EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
MPN: EP3SE260H780C2N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4500 | $4,500.00 |
| 10 | $4280 | $42,800.00 |
| 25 | $4100 | $102,500.00 |
| 100 | $3850 | $385,000.00 |
| 500 | $3600 | $1,800,000.00 |
EP3SE260H780C2N Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O standards are defined at design time by loading a configuration bitstream into on-chip SRAM. FPGAs sit hierarchically between application-specific integrated circuits (ASICs) and software processors, combining hardware parallelism with software-defined functionality, and Stratix III E variants are positioned within Intel's high-end, transceiver-rich family.
Key features of the EP3SE260H780C2N include 488 user I/Os, 16,672,768 total RAM bits (14,049,152 user bits plus additional memory), support for DDR/DDR2/DDR3/QDRII/QDRII+/RLDRAM II external memory interfaces, and up to 24 full-duplex transceivers. The FCBGA-780 package combines flip-chip attach with a thermal lid suitable for high-power dissipation, while 12 global clock networks and 88 PLLs/DCMs provide flexible clock synthesis for high-performance timing closure.
Architecturally, the Stratix III E device uses adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), a tiered memory hierarchy (MLABs, M9K, M144K), and dedicated DSP blocks capable of 600 MHz 18x18 multiplication. The transceiver blocks include embedded PMA, PCS, and hard IP for PCIe and Gbps Ethernet, substantially offloading soft logic.
Typical applications include ASIC and SoC prototyping, high-speed data acquisition cards, radar and baseband processing, broadcast video processing, and 40G/100G wire-speed bridging. When laying out the board, allocate contiguous 780-BGA land pattern, observe transceiver break-out length and impedance rules, and provide adequate decoupling for the 0.9 V core rail to avoid logic-margin loss.
Drop-in alternatives for EP3SE260H780C2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE260H780C2N (same form factor and footprint) — differing in Package, Speed Grade, Family, RoHS Status, Core Voltage.
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View Datasheet →EP3SE260H780C2N Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Logic Elements | 255,000 |
| LABs / CLBs | 10,200 |
| Total RAM Bits | 16,672,768 |
| User I/O Count | 488 |
| Core Voltage | 0.9 V |
| Package | 780-BGA FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature Range | Commercial (0C to +85C) |
| Speed Grade | C2 |
| MSL Level | 3 (168 hours) |
| Reflow Peak Time Max | 40 s |
| Package Code | BGA |
| Terminal Form | Ball |
| Number of Terminals | 780 |
| Process Node | 40 nm |
EP3SE260H780C2N bga Pin Configuration Guide
Pin configuration for EP3SE260H780C2N (bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE260H780C2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE260H780C2N is suitable for 6 applications: ASIC and SoC Prototyping, High-Speed Serial Bridging and Protocol Conversion, High-Performance DSP and Signal Processing, Broadcast Video Processing and Image Manipulation, Test and Measurement Instrumentation, Industrial Control and Robotics.
ASIC and SoC Prototyping
The EP3SE260H780C2N fits ASIC/SoC prototyping thanks to its 255,000 logic elements and 16,672,768 embedded memory bits per the Intel Stratix III handbook. Engineers map full SoC RTL onto the device's 8-input ALM fabric to validate complex designs before tape-out, using the 488 user I/Os to bring out multiple debug and trace buses. Quartus II software supports in-circuit debugging with SignalTap, and the part's high logic capacity means single-FPGA prototypes of mid-complexity ASICs (multi-million gates) are feasible. The C2 speed grade also gives sufficient timing margin to close at typical ASIC clock targets up to ~200-250 MHz.
Recommended
High-Speed Serial Bridging and Protocol Conversion
The EP3SE260H780C2N's transceiver-rich architecture, with up to 6.375 Gbps multi-gigabit transceivers per the Intel handbook, makes it suitable for bridging PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet, and CPRI links between modules. The 780-BGA package supports up to 24 full-duplex transceiver channels, enabling fan-out, aggregation, and protocol conversion in base stations and storage controllers. Compared with a discrete PHY plus FPGA design, the integrated hard IP reduces latency and frees logic for frame processing, while the 16 Mbit of embedded RAM serves as fast packet buffer memory.
Recommended
High-Performance DSP and Signal Processing
The EP3SE260H780C2N integrates dedicated DSP blocks capable of 600 MHz 18x18 multiplication, allowing designers to build FIR filters, FFT engines, and radar baseband pipelines without consuming logic elements. Combined with its 16,672,768 bits of embedded RAM, the device stores FFT working buffers and coefficient tables on-die, avoiding external SRAM bottlenecks. The 488 I/O bandwidth streams ADC data into the fabric at hundreds of MHz, while the C2 speed grade preserves timing margin on multi-tap filter paths used in radar, sonar, and software-defined radio systems.
Recommended
Broadcast Video Processing and Image Manipulation
The EP3SE260H780C2N is well-suited for broadcast video processing because its 255K logic elements handle multiple video pipelines in parallel, and its 16 Mbit embedded memory provides line and frame buffers. Per Intel's reference designs, Stratix III E parts support SDI, HDMI, and DisplayPort interfaces through their transceiver channels, while the 488 I/Os feed parallel RGB/YUV buses and memory interfaces such as DDR2/DDR3. Designers use ALM-rich fabric for scaling, de-interlacing, and colour-space conversion at 1080p60 and beyond.
Recommended
Test and Measurement Instrumentation
The EP3SE260H780C2N serves as the core of high-end test and measurement instruments, where 255K logic elements implement protocol analysers, pattern generators, and logic-state sequencer functions. Its 488 user I/Os and multi-gigabit transceivers provide the digital and high-speed serial stimulus channels required for protocol conformance, while 16 Mbit embedded RAM captures deep traces on-chip before offload. The C2 speed grade supports timing-accurate state machines at instrument-grade clock rates, and the FCBGA lid allows fan-cooled chassis in compact PXI/PXIe form factors.
Recommended
Industrial Control and Robotics
The EP3SE260H780C2N supports industrial motion-control and robotic systems by integrating multiple motor-control loops, encoder interfaces, and EtherCAT/PROFIBUS bridges in a single device. The 488 user I/Os accommodate many quadrature encoder channels, while the embedded DSP blocks run field-oriented control algorithms at high PWM rates. Industrial users prefer the I-grade EP3SE260H780I3N for -40C to +100C operation, but the C2 commercial variant suffices in climate-controlled factory cabinets where lower-cost deployment is paramount.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE260H780C2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE260H780C2 | EP3SE260H780C3N | EP3SE260H780C4N | EP3SE260H780I3 | EP3SE260H780I3N | EP3SE260F1152C2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BGA FCBGA | 780-BGA FCBGA - same | 780-BGA FCBGA - same | 780-BGA FCBGA - same | 780-BGA FCBGA - same | 780-BGA FCBGA - same | 1152-BGA - different ballout |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 |
| Speed Grade | C2 | C2 - same | C3 (faster) | C4 (fastest) | I3 (slower) | I3 (slower) | C2 - same |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Industrial | Commercial |
| Lead-Free (N suffix) | Yes | No | Yes | Yes | No | Yes | Yes |
| Total RAM Bits | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 |
| User I/O Count | 488 | 488 | 488 | 488 | 488 | 488 | 744 (F1152) |
Key Differentiators
- Lead-free (N suffix) termination for RoHS 6/6 assembly (vs EP3SE260H780C2)
- C2 speed grade balances timing margin and power (vs EP3SE260H780C3N / C4N)
- Industrial temperature variants available for harsh environments (vs EP3SE260H780I3 / I3N)
Design Notes
Estimated: at maximum toggle activity with all 488 I/Os active, Stratix III E devices in the 780-BGA FCBGA can dissipate 15-25 W. The package's integrated heat-spreader lid is mandatory per Intel design guidelines, and a thermal interface material plus heatsink or 200 LFM airflow is recommended to keep junction temperature below 100C. Designers should respect the MSL 3 (168 hour) floor life and bake the part before reflow if the floor-life clock has expired.
The 780-BGA FCBGA requires a microvia stack-up, with via-in-pad recommended for inner-row balls. Assign a continuous ground plane in the layer beneath the package to control return paths, and route transceiver lanes as 100 ohm differential pairs with length matching within 150 mils per Intel routing guidelines. Decouple every 0.9 V core pin with 0.1 uF + 10 uF ceramic + bulk polymer, placed as close to the balls as the breakout allows.
Transceiver signals up to 6.375 Gbps require controlled-impedance routing (85 ohm or 100 ohm differential), AC-coupling capacitors near the transmitter, and a continuous reference plane under the entire channel. Place the FPGA's PLL supply filters within 100 mils of their respective pins and isolate noisy switching I/Os from clock and JTAG traces with ground guards. Quartus II SignalTap and the TimeQuest timing analyser should be run on the prototype before sign-off.
Common pitfalls with the EP3SE260 include: failing to populate all GND balls (which causes ground bounce and overheating), selecting the wrong configuration scheme (passive serial vs JTAG) for the CPLD/EPCS controller, ignoring dual-boot image requirements for fail-safe field updates, and under-provisioning 0.9 V core current (use Intel's PowerPlay early estimator to size the regulator). Always verify pin assignments against the latest 780-BGA ball map because errata updates occasionally shift ball functions.
Compliance Information
N suffix denotes lead-free per Intel's RoHS migration notice. Reach, halogen-free, and conflict-minerals status were not in the provided data.
