EP3SE260H780C3N vs EP3SE260H780C2N Comparison

Detailed side-by-side comparison of EP3SE260H780C3N by Intel and EP3SE260H780C2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N โš  Last Time Buy

Specification Comparison

Parameter EP3SE260H780C3N EP3SE260H780C2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $1,325.00 $3,600.00
Series Stratixยฎ III E Stratix III E
Logic Elements (LE) 255,000 โ€”
Embedded Memory (bits) 16,672,768 โ€”
Number of LABs/CLBs 10,200 โ€”
User I/Os 488 โ€”
Number of Pins / Balls 780 โ€”
Package 780-BBGA, FCBGA (H780) 780-BGA FCBGA
Mounting Type Surface Mount Surface Mount
Operating Temperature 0 ยฐC to +85 ยฐC (C grade, commercial) โ€”
Process Technology 40 nm CMOS โ€”
Maximum Core Frequency [DATA_NEEDED: maximum core frequency MHz] โ€”
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal V] โ€”
Transceivers [DATA_NEEDED: number of embedded transceivers and max data rate] โ€”
DSP Blocks [DATA_NEEDED: number of DSP blocks and precision] โ€”
RoHS Status Compliant (lead-free 'N' suffix) [DATA_NEEDED: rohs status]
Moisture Sensitivity Level (MSL) [DATA_NEEDED: MSL level per JEDEC J-STD-020] โ€”
Configuration Method SRAM-based, configured via JTAG / passive / active serial / fast passive parallel โ€”
Design Toolchain Altera Quartus II (legacy); Intel Quartus Prime โ€”
Logic Elements โ€” 255,000
LABs / CLBs โ€” 10,200
Total RAM Bits โ€” 16,672,768
User I/O Count โ€” 488
Number of Transceivers โ€” [DATA_NEEDED: transceiver count]
Core Voltage โ€” 0.9 V
Operating Temperature Range โ€” Commercial (0C to +85C)
Speed Grade โ€” C2
MSL Level โ€” 3 (168 hours)
Reflow Peak Time Max โ€” 40 s
Lead-Free โ€” [DATA_NEEDED: lead-free]
Package Code โ€” BGA
Terminal Form โ€” Ball
Number of Terminals โ€” 780
Process Node โ€” 40 nm

Datasheets & Resources

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