EP3SE260H780C3N vs EP3SE260H780C4N Comparison

Detailed side-by-side comparison of EP3SE260H780C3N by Intel and EP3SE260H780C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260H780C3N EP3SE260H780C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,325.00 $1,395.00
Series Stratixยฎ III E โ€”
Logic Elements (LE) 255,000 โ€”
Embedded Memory (bits) 16,672,768 โ€”
Number of LABs/CLBs 10,200 โ€”
User I/Os 488 โ€”
Number of Pins / Balls 780 โ€”
Package 780-BBGA, FCBGA (H780) 780-ball FCBGA (Flip Chip BGA)
Mounting Type Surface Mount Surface Mount
Operating Temperature 0 ยฐC to +85 ยฐC (C grade, commercial) 0C to +85C (commercial)
Process Technology 40 nm CMOS โ€”
Maximum Core Frequency [DATA_NEEDED: maximum core frequency MHz] โ€”
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal V] โ€”
Transceivers [DATA_NEEDED: number of embedded transceivers and max data rate] โ€”
DSP Blocks [DATA_NEEDED: number of DSP blocks and precision] โ€”
RoHS Status Compliant (lead-free 'N' suffix) โ€”
Moisture Sensitivity Level (MSL) [DATA_NEEDED: MSL level per JEDEC J-STD-020] 3 (168 hours)
Configuration Method SRAM-based, configured via JTAG / passive / active serial / fast passive parallel Serial/Parallel via Quartus II
Design Toolchain Altera Quartus II (legacy); Intel Quartus Prime โ€”
Family โ€” Stratix III E (Enhanced)
Logic Elements โ€” 255,000
Logic Array Blocks (LABs) โ€” 10,200
Total RAM Bits โ€” 16,672,768
Embedded Memory โ€” M9K and M144K blocks
User I/O Pins โ€” 488
DSP Blocks (18x18 Multipliers) โ€” 768
PLLs โ€” 12
Process Node โ€” 65 nm CMOS
Core Voltage โ€” 0.86 V to 1.15 V
Maximum Core Clock Frequency โ€” 450 MHz

Datasheets & Resources

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