Intel

EP3SE260H780C4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

MPN: EP3SE260H780C4N ✗ End of Life

In Stock Ships in 1-3 business days

0.86 V to 1.15 V Vdss 780-ball FCBGA (Flip Chip BGA) Package 450 MHz Speed M9K and M144K blocks Memory

From $1395 USD / Unit

MOQ: 1 |

Price updated: 2026-09-09

Volume Pricing

Qty	Unit Price	Extended
1	$1850	$1,850.00
10	$1720	$17,200.00
100	$1595	$159,500.00
500	$1480	$740,000.00
1,000	$1395	$1,395,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

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EP3SE260H780C4N Overview

The Intel (formerly Altera) EP3SE260H780C4N is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 255,000 logic elements, 10,200 Logic Array Blocks (LABs), and 16,672,768 bits of embedded RAM, housed in a 780-ball FineLine Ball-Grid Array (FCBGA) package. The device operates across a 0.86 V to 1.15 V core voltage range using TSMC's 65 nm process node, with a maximum core clock frequency of 450 MHz. The 488 user I/O pins support a broad mix of single-ended and differential I/O standards for high-bandwidth system connectivity.

A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP (transceivers, memory blocks, DSP slices, PLLs) on a single silicon die. FPGAs sit in the wider taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors, and they enable parallel hardware implementation of algorithms that would otherwise require custom ASICs or multi-chip DSP solutions.

Key features of the EP3SE260H780C4N include 768 18x18 multipliers for DSP, 12 phase-locked loops (PLLs) for clock management, support for external memory interfaces including DDR3, DDR2, and QDRII+ up to 800 MHz, and integrated transceiver capability depending on die variant. The device is hardened for signal integrity with on-chip termination and adaptive equalization, and is rated for industrial-grade operating temperature.

Architecturally, the Stratix III E family uses an adaptive logic module (ALM) fabric that is roughly 25 percent more area-efficient than prior Stratix II Adaptive Look-Up Tables, while the partial reconfiguration and dedicated configuration logic enable secure in-field updates. The 65 nm process and 1.1 V core deliver a favorable performance-per-watt envelope for high-end DSP and packet-processing workloads.

Typical applications include high-performance digital signal processing for radar and software-defined radio, ASIC prototyping and emulation, high-speed packet processing in network infrastructure, video broadcasting and medical imaging pipelines, and high-throughput data-acquisition systems. The combination of logic density and dedicated multiplier resources is well suited to multi-channel DSP and FEC implementations.

Designers should plan for 0.86 V to 1.15 V core supply sequencing and use the Altera/Intel Quartus II design suite with the Stratix III device library for synthesis, place-and-route, and timing closure. Thermal management at high toggle rates requires a multi-layer PCB with sufficient ground and power planes; reference the Stratix III handbook for thermal design guidelines.

This page synthesizes distributor stock and pricing, the Stratix III family pin-compatible variants, and practical design notes that complement the manufacturer datasheet and Quartus II device documentation.

Drop-in alternatives for EP3SE260H780C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3SE260H780C4N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Mounting Type, RoHS Status.

EP3SE260H780C2N

Intel

Package: 780-BGA FCBGA

Speed Grade: C2