EP3SE260H780C4N vs EP3SE260H780C3N Comparison

Detailed side-by-side comparison of EP3SE260H780C4N by Intel and EP3SE260H780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260H780C4N EP3SE260H780C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $1,395.00 $1,325.00
Family Stratix III E (Enhanced) โ€”
Logic Elements 255,000 โ€”
Logic Array Blocks (LABs) 10,200 โ€”
Total RAM Bits 16,672,768 โ€”
Embedded Memory M9K and M144K blocks โ€”
User I/O Pins 488 โ€”
DSP Blocks (18x18 Multipliers) 768 โ€”
PLLs 12 โ€”
Process Node 65 nm CMOS โ€”
Core Voltage 0.86 V to 1.15 V โ€”
Maximum Core Clock Frequency 450 MHz โ€”
Package 780-ball FCBGA (Flip Chip BGA) 780-BBGA, FCBGA (H780)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 hours) [DATA_NEEDED: MSL level per JEDEC J-STD-020]
Operating Temperature 0C to +85C (commercial) 0 ยฐC to +85 ยฐC (C grade, commercial)
Configuration Method Serial/Parallel via Quartus II SRAM-based, configured via JTAG / passive / active serial / fast passive parallel
Series โ€” Stratixยฎ III E
Logic Elements (LE) โ€” 255,000
Embedded Memory (bits) โ€” 16,672,768
Number of LABs/CLBs โ€” 10,200
User I/Os โ€” 488
Number of Pins / Balls โ€” 780
Process Technology โ€” 40 nm CMOS
Maximum Core Frequency โ€” [DATA_NEEDED: maximum core frequency MHz]
Supply Voltage (VCCINT) โ€” [DATA_NEEDED: VCCINT nominal V]
Transceivers โ€” [DATA_NEEDED: number of embedded transceivers and max data rate]
DSP Blocks โ€” [DATA_NEEDED: number of DSP blocks and precision]
RoHS Status โ€” Compliant (lead-free 'N' suffix)
Design Toolchain โ€” Altera Quartus II (legacy); Intel Quartus Prime

Datasheets & Resources

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