EP3SE260H780C4N vs EP3SE260H780I4L Comparison

Detailed side-by-side comparison of EP3SE260H780C4N by Intel and EP3SE260H780I4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE260H780C4N EP3SE260H780I4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $1,395.00 $1,395.00
Family Stratix III E (Enhanced) Stratix III E (Enhanced)
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10,200 β€”
Total RAM Bits 16,672,768 β€”
Embedded Memory M9K and M144K blocks β€”
User I/O Pins 488 β€”
DSP Blocks (18x18 Multipliers) 768 β€”
PLLs 12 β€”
Process Node 65 nm CMOS β€”
Core Voltage 0.86 V to 1.15 V 0.9 V
Maximum Core Clock Frequency 450 MHz β€”
Package 780-ball FCBGA (Flip Chip BGA) β€”
Mounting Type Surface Mount Surface Mount (flip-chip)
Moisture Sensitivity Level (MSL) 3 (168 hours) β€”
Operating Temperature 0C to +85C (commercial) Industrial, -40C to +85C
Configuration Method Serial/Parallel via Quartus II β€”
Total Memory Bits β€” 16,672,640
Number of LABs/CLBs β€” [DATA_NEEDED: LAB count]
User I/O Count β€” 488
Process Technology β€” 65 nm
Package Type β€” 780-pin FC-HFBGA (flip-chip BGA)
Number of Transceivers β€” 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate β€” 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers β€” [DATA_NEEDED: per-package multiplier count]
RoHS Status β€” Compliant (lead-free)
Configuration Mode β€” JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package β€” 780-BBGA, FCBGA (flip-chip)

Datasheets & Resources

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