EP3SE260H780C4N vs EP3SE260H780I4N Comparison
Detailed side-by-side comparison of EP3SE260H780C4N by Intel and EP3SE260H780I4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N β Last Time BuySpecification Comparison
| Parameter | EP3SE260H780C4N | EP3SE260H780I4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,395.00 | $2,150.00 |
| Family | Stratix III E (Enhanced) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Total RAM Bits | 16,672,768 | β |
| Embedded Memory | M9K and M144K blocks | β |
| User I/O Pins | 488 | β |
| DSP Blocks (18x18 Multipliers) | 768 | β |
| PLLs | 12 | β |
| Process Node | 65 nm CMOS | β |
| Core Voltage | 0.86 V to 1.15 V | 1.1 V |
| Maximum Core Clock Frequency | 450 MHz | β |
| Package | 780-ball FCBGA (Flip Chip BGA) | 780-pin FC-HFBGA (FCBGA) |
| Mounting Type | Surface Mount | β |
| Moisture Sensitivity Level (MSL) | 3 (168 hours) | β |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Configuration Method | Serial/Parallel via Quartus II | β |
| Embedded Memory Bits | β | 16,672,768 bits |
| User I/Os | β | 488 |
| Process Technology | β | 65 nm |
| Maximum Operating Frequency | β | 450 MHz |
| Package Dimensions | β | 33 mm x 33 mm |
| Ball Pitch | β | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | β | AS, PS, JTAG, FPP |
| Boundary Scan | β | IEEE Std. 1149.1 (JTAG) |
| RoHS Status | β | Compliant |
| Lead-Free | β | Yes |
| Moisture Sensitivity Level | β | [DATA_NEEDED: MSL rating] |