EP3SE260H780I4L vs EP3SE260H780C4N Comparison

Detailed side-by-side comparison of EP3SE260H780I4L by Intel and EP3SE260H780C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE260H780I4L EP3SE260H780C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,395.00 $1,395.00
Family Stratix III E (Enhanced) Stratix III E (Enhanced)
Logic Elements 255,000 255,000
Total Memory Bits 16,672,640 β€”
Number of LABs/CLBs [DATA_NEEDED: LAB count] β€”
User I/O Count 488 β€”
Core Voltage 0.9 V 0.86 V to 1.15 V
Process Technology 65 nm β€”
Package Type 780-pin FC-HFBGA (flip-chip BGA) β€”
Mounting Type Surface Mount (flip-chip) Surface Mount
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) β€”
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) β€”
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] β€”
Operating Temperature Industrial, -40C to +85C 0C to +85C (commercial)
RoHS Status Compliant (lead-free) β€”
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel β€”
Pin/Package 780-BBGA, FCBGA (flip-chip) β€”
Logic Array Blocks (LABs) β€” 10,200
Total RAM Bits β€” 16,672,768
Embedded Memory β€” M9K and M144K blocks
User I/O Pins β€” 488
DSP Blocks (18x18 Multipliers) β€” 768
PLLs β€” 12
Process Node β€” 65 nm CMOS
Maximum Core Clock Frequency β€” 450 MHz
Package β€” 780-ball FCBGA (Flip Chip BGA)
Moisture Sensitivity Level (MSL) β€” 3 (168 hours)
Configuration Method β€” Serial/Parallel via Quartus II

Datasheets & Resources

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