EP3SE50F484C3G vs EP3C80F484C8 Comparison
Detailed side-by-side comparison of EP3SE50F484C3G by Intel and EP3C80F484C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE50F484C3G | EP3C80F484C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $205.00 | $182.76 |
| Family | Stratix III E | Cyclone III |
| Logic Elements | 47,500 | β |
| Adaptive Logic Modules (ALMs) | 19,000 | β |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | β |
| M9K Memory Blocks | 320 (2,304 Kbits) | β |
| M144K Memory Blocks | 12 (1,728 Kbits) | β |
| User I/O Pins | 296 | β |
| 18x18 Multipliers | 384 | β |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | β |
| Package | 484-ball FCBGA (F484), 1.0 mm pitch | 484-ball FBGA (23x23 mm, 1.0 mm pitch) |
| Speed Grade | C3 | C8 (commercial, slowest Cyclone III grade) |
| Operating Temperature | 0C to +85C (commercial, "C") | 0C to +85C (commercial) |
| Process Node | 65 nm TSMC low-power | β |
| Core Voltage | 1.1 V | β |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant (lead-free) | Compliant |
| Logic Elements (LE) | β | 81,264 |
| Total Memory Bits | β | 2,810,880 bits (2810 Kb) |
| Embedded 18x18 Multipliers | β | 244 |
| Maximum User I/O | β | 295 |
| Process Technology | β | 65 nm CMOS |
| Core Voltage (Vccint) | β | 1.2 V |
| Maximum Operating Frequency | β | 402 MHz |
| Lead-Free | β | Yes |
| Memory Interfaces Supported | β | DDR, DDR2, QDRII SDRAM |