EP3SE50F484C3G - Stratix III E FPGA, 47.5K LE, 484-FCBGA | Intel
MPN: EP3SE50F484C3G ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 25 | $250 | $6,250.00 |
| 100 | $225 | $22,500.00 |
| 500 | $205 | $102,500.00 |
EP3SE50F484C3G Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O can be programmed after manufacturing to implement custom digital functions. FPGAs sit in the programmable-logic hierarchy between fixed-function ASICs (lower NRE cost, higher unit cost) and microcontroller/DSP cores (lower flexibility). The Stratix III family belongs to the high-performance tier, adding dedicated DSP blocks, high-speed transceivers, and large on-chip RAM to the basic FPGA fabric.
Key features of the EP3SE50F484C3G include 47.5K adaptive logic modules (ALMs), 2,304 Kbits of M9K memory and 1,888 Kbits of M144K block memory, up to 296 user I/O pins, 384 18x18 multipliers, and 4 PLLs supporting multiple clock domains. Programmable Power Technology allows unused logic to be disabled, reducing static power by up to 50% versus previous generations.
The Stratix III E family uses TSMC's 65 nm low-power process with a 1.1V core, achieving clock rates above 500 MHz in pipelined DSP designs. The 484-ball FCBGA package is wire-bond, supports 1.0 mm ball pitch, and provides multiple high-speed serial transceiver lanes (model-dependent). Configuration is supported through JTAG, passive serial, fast passive parallel, and dedicated configuration pins.
Typical applications include high-performance DSP for wireless baseband, radar and beamforming, ASIC prototyping and emulation, high-speed packet processing in networking line cards, video broadcast and image processing pipelines, and military/aerospace signal processing. The wide parallel I/O count makes the EP3SE50 suitable for memory-rich data-acquisition systems where the 5.76 Mbit embedded RAM can buffer multiple video frames.
When designing with the EP3SE50F484C3G, allocate at least eight layers for PCB routing to escape the 1.0 mm-pitch BGA cleanly. Use Altera's Quartus II design suite (version 13.0 or earlier for full Stratix III support) for synthesis, place-and-route, and power analysis. Engineers migrating to newer Stratix V/10 families should plan a re-validation cycle, as the Stratix III is in its final lifecycle phase.
This page consolidates distributor pricing, packaging details, drop-in same-package alternatives, and reference designs that complement, but do not replace, the official Intel Stratix III Device Handbook and per-pin datasheets.
Drop-in alternatives for EP3SE50F484C3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE50F484C3G (same form factor and footprint) — differing in Package, Operating Temperature, Family, RoHS Status, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE50F484C2G
✅ Drop-In✓ In Stock
$1180 / Unit
View Datasheet →EP3SE50F484C2
✅ Drop-In✓ In Stock
$895 / Unit
View Datasheet →EP3SE50F484C2N
✅ Drop-In✓ In Stock
$5934.83 / Unit
View Datasheet →EP3SE50F484C3
✅ Drop-In✓ In Stock
$820 / Unit
View Datasheet →EP3C80F484C8
✅ Drop-In✓ In Stock
$182.76 / Unit
View Datasheet →EP3C80F484C7
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP3SE50F484C3G Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements | 47,500 |
| Adaptive Logic Modules (ALMs) | 19,000 |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) |
| M9K Memory Blocks | 320 (2,304 Kbits) |
| M144K Memory Blocks | 12 (1,728 Kbits) |
| User I/O Pins | 296 |
| 18x18 Multipliers | 384 |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Package | 484-ball FCBGA (F484), 1.0 mm pitch |
| Speed Grade | C3 |
| Operating Temperature | 0C to +85C (commercial, "C") |
| Process Node | 65 nm TSMC low-power |
| Core Voltage | 1.1 V |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (lead-free) |
EP3SE50F484C3G 484-ball fcbga (f484), 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP3SE50F484C3G (484-ball fcbga (f484), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE50F484C3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE50F484C3G is suitable for 6 applications: Wireless Baseband DSP, Radar and Beamforming Signal Processing, ASIC Prototyping and Emulation, High-Speed Packet Processing, Broadcast Video Processing, Industrial Test & Measurement Instrumentation.
Wireless Baseband DSP
The EP3SE50F484C3G's 384 18x18 multipliers and 47.5K LEs are well-matched to multi-carrier wireless baseband processing such as LTE PHY-layer uplink/downlink, where parallel MAC processing and FFT pipelines run concurrently. The 4 PLLs and 16 global clock networks support independent sample-rate domains for ADC interfaces and backhaul Ethernet. Drop the device between ADC front-ends (e.g., dual 14-bit 250 MSPS converters) and a backhaul SERDES, using M9K RAM to buffer 1-2 ms subframe windows before DMA into DDR2.
Recommended
Radar and Beamforming Signal Processing
The 384 dedicated 18x18 multipliers implement phase-shifting beamforming weights across 32-64 antenna elements at IF sample rates up to 200 MHz, making the EP3SE50F484C3G a good fit for mid-range phased-array radar front-ends. The 5.76 Mbit embedded RAM (320 M9K blocks) accumulates pulse-compressed samples and chirp correlation buffers without external SRAM. Four PLLs derive independent LO, sample-clock, and timing-reference domains. The 484-FCBGA package's matched-length BGA escape supports multi-GHz DDR2 sample memory.
Recommended
ASIC Prototyping and Emulation
With 47.5K LEs and 384 multipliers, the EP3SE50F484C3G can emulate ~3-5 million gates of mid-complexity ASIC logic, supporting partitioned ASIC prototyping flows. The 296 user I/Os in a 484-FCBGA accommodate FPGA-to-ASIC socket adapters, and the 5.76 Mbit embedded RAM doubles as in-circuit emulation scratch memory. Quartus II 13.x supports multi-FPGA partitioning with TimeLogic and Certify flows. The 1.1V core and Programmable Power Technology keep per-board power under 8W for a 4-FPGA emulation chassis.
Recommended
High-Speed Packet Processing
Wire-speed packet classification, deep-packet inspection, and encryption offload leverage the EP3SE50F484C3G's 296 user I/Os and 5.76 Mbit embedded memory to sustain 10 Gbps line-rate lookups. The 384 multipliers accelerate AES, SHA, and SNOW 3G ciphers at multi-Gbps rates. Four PLLs generate the required PHY clocks (156.25 MHz for 10GbE, 161.13 MHz for OC-192). The 484-FCBGA package supports clean break-out to QSFP cages and external TCAM memories for routing-table acceleration.
Recommended
Broadcast Video Processing
The EP3SE50F484C3G handles HD/3G-SDI video processing including up/down/cross-conversion, color-space conversion, and frame-rate adaptation for broadcast infrastructure. M9K blocks implement line and frame buffers, while the 384 multipliers accelerate de-interlacing and scaling kernels at full 3 Gbps SDI rates. Sixteen global clock networks support independent video, audio, and ancillary-data domains. The 484-FCBGA's 296 user I/Os accept multi-channel SDI input plus genlock reference, with embedded RAM holding three frames of progressive video.
Recommended
Industrial Test & Measurement Instrumentation
The EP3SE50F484C3G drives arbitrary-waveform generators, digitizers, and protocol analyzers used in bench-top and PXI instrumentation, where the 384 multipliers implement real-time DSP (FFT, FIR, decimation) on ADC sample streams up to 500 MSPS. The 5.76 Mbit embedded RAM holds acquisition windows while the 296 user I/Os interface to front-panel LCDs, trigger buses, and external DAC/ADC clusters. The commercial 0-85C operating range covers factory-floor test racks, and Quartus II 13.x supports LabVIEW FPGA integration for National Instruments customers.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE50F484C3G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F484C2G | EP3SE50F484C2 | EP3SE50F484C2N | EP3SE50F484C3 | EP3C80F484C8 | EP3C80F484C7 |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FCBGA (F484), 1.0 mm pitch | 484-ball FCBGA (F484) - same | 484-ball FCBGA (F484) - same | 484-ball FCBGA (F484) - same | 484-ball FCBGA (F484) - same | 484-ball FCBGA (F484) - same | 484-ball FCBGA (F484) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Cyclone III | Cyclone III |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 81,360 | 81,360 |
| Speed Grade | C3 | C2 (faster) | C2 (faster) | C2 (faster) | C3 | C8 (slower) | C7 (slower) |
| Embedded Memory | 5.76 Mbit | 5.76 Mbit | 5.76 Mbit | 5.76 Mbit | 5.76 Mbit | 2.74 Mbit | 2.74 Mbit |
| 18x18 Multipliers | 384 | 384 | 384 | 384 | 384 | 488 | 488 |
| User I/Os | 296 | 296 | 296 | 296 | 296 | 295 | 295 |
| RoHS / Lead-Free | Yes (G suffix) | Yes (G suffix) | No (Pb-bearing) | No (Pb-bearing) | No (Pb-bearing) | Yes | Yes |
Key Differentiators
- Higher DSP density per pin count than Cyclone III F484 (vs EP3C80F484C8)
- C2 speed grade is faster, drop-in compatible with same pinout (vs EP3SE50F484C2G)
- Lead-free RoHS option with same die (vs EP3SE50F484C3)
Design Notes
The 484-ball FCBGA at 1.0 mm pitch demands at least an 8-layer PCB stack-up with micro-via or via-in-pad construction. Allocate the top two layers for signal escape and a continuous ground plane immediately beneath the BGA to control return paths. Matched-length tuning is critical for DDR2/3 interfaces; use the Quartus II pin planner's delay-chain reports to verify. Decoupling: 0.1uF X7R per power pin within 100 mil, plus bulk 220uF polymer tantalum near the package.
Estimated: at the 1.1V core and typical Stratix III E toggle activity around 12-15% in DSP pipelines, the EP3SE50 dissipates approximately 4-6W at 85C junction. The 484-FCBGA has a typical theta_JA of 12-15 C/W with a 12-layer JEDEC test board, requiring at least 25-30 CFM airflow or a heatsink for continuous full-rate operation. If your design utilizes Programmable Power Technology to gate unused ALMs, expect a 30-40% static-power reduction; verify with Quartus II PowerPlay analysis.
Do not mix Stratix III E (EP3SE) and L (EP3SL) variants on the same PCB layout - their pinouts and transceiver-lane assignments differ even within the same package code. Confirm you are using the F484 pinout file from the Stratix III Device Handbook (not the Stratix II pinout). For configuration, verify MSEL[3:0] strap pins match your chosen mode (AS, PS, FPP, JTAG); an incorrect strap silently prevents configuration. Last-time-buy planning is essential since the family is NRND; coordinate with Intel FAEs early.
Stratix III E I/O banks support LVDS, SSTL, and HSTL at 1.2V to 3.3V VCCIO. Run IBIS simulations (Altera provides package-aware models) for all >200 MHz signals. Series-damping resistors (22-33 ohm) may be required on DDR2/3 clock and address/command pairs to suppress ringing. Use the Quartus II TimeQuest timing analyzer with derived Tco/Pcb delay vectors for setup/hold closure - do not rely on default timing models.
Compliance Information
RoHS compliance indicated by G suffix per Altera/Intel part numbering convention. AEC-Q100 not applicable to commercial-grade FPGAs. Halogen-free and conflict-mineral status not explicitly stated in distributor listings.
