EP3SE50F484I4LN vs EP3SE50F484I4LG Comparison

Detailed side-by-side comparison of EP3SE50F484I4LN by Intel and EP3SE50F484I4LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE50F484I4LG EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel

EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel

EP3SE50F484I4LG ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE50F484I4LN EP3SE50F484I4LG
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $895.00 $1,340.00
Family Stratix III E Stratix III (Enhanced)
Logic Elements (LE) 47,500 47,500
Logic Array Blocks (LABs) 1,900 β€”
Embedded Memory 5.76 Mbit (estimated from 47.5K LE family) β€”
User I/O Count 296 296
Process Node 65 nm β€”
Core Voltage (VCCINT) 0.9 V β€”
Auxiliary Voltage (VCCAUX) 1.1 V β€”
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V (bank-dependent) β€”
Package 484-ball FBGA (FineLine BGA) 484-ball FBGA / FCBGA
Pin/Pitch 484 balls, 1.0 mm pitch β€”
Operating Temperature -40C to +100C (industrial I4 grade) β€”
Configuration SRAM-based (external flash/EPCS required) β€”
RoHS Status Compliant (LN suffix indicates lead-free) Compliant
Lead-Free Yes (LF / N suffix indicates lead-free) β€”
Transceivers 0 (F484 package does not include transceiver banks) β€”
PLL Count Up to 12 (estimated for Stratix III E family) β€”
DSP Blocks (18x18 Multipliers) [DATA_NEEDED: DSP block count] β€”
Design Tool Quartus II (legacy, support via Altera/Intel subscription) β€”
Series β€” Stratix III E
Adaptive Logic Modules (ALMs) β€” 19,000
LABs/CLBs β€” 1,900
Total Embedded Memory β€” 5,760,000 bits (5.49 Mbit / 5.76 Mbit per source)
Number of DSP Blocks β€” 104 (18x18 multipliers)
Number of PLLs β€” 8
Core Supply Voltage (Vccint) β€” 0.86 V to 1.15 V (1.1 V nominal)
Operating Temperature Range β€” -40C to +100C (Industrial, TJ)
Mounting Type β€” Surface Mount (SMD/SMT)
Packaging β€” Tray
Process Technology β€” 40 nm CMOS
Configuration Interface β€” Passive Serial / Fast Passive Parallel / JTAG
Bitstream Encryption β€” 256-bit AES

Datasheets & Resources

Browse All Products Create BOM Request Quote