EP3SE50F484I4LN - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
MPN: EP3SE50F484I4LN ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1287.57 | $1,287.57 |
| 10 | $1215 | $12,150.00 |
| 50 | $1150 | $57,500.00 |
| 100 | $1095 | $109,500.00 |
| 500 | $980 | $490,000.00 |
| 1,000 | $895 | $895,000.00 |
EP3SE50F484I4LN Overview
A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (LABs), embedded memory blocks, DSP blocks, and programmable I/O cells, that the designer can configure after manufacture to implement custom digital circuits, signal-processing pipelines, or interface bridging logic. FPGAs occupy a tier between fixed-function ASICs and software-defined microcontrollers in the semiconductor hierarchy: programmable logic IC -> FPGA -> SRAM-based FPGA -> high-density FPGA. Stratix III E parts target high-performance compute, telecoms, and signal-processing designs.
Key features include 1,900 LABs, 190 (estimated) embedded 18x18 multipliers supporting DSP, multi-gigabit transceivers, up to 12 PLLs, and hard memory controllers. The 484-FBGA package is the medium-density variant of the Stratix III E family and supports high I/O count at moderate board area. Per the Stratix III Device Handbook, the part supports up to 8.5 Gbps transceivers on selected Stratix III variants; transceiver counts on EP3SE50F484 are 0 because the F484 pinout does not include the transceiver I/O bank.
The EP3SE50F484I4LN uses a SRAM-based configuration cell, so it must be configured at each power-on by an external flash or EPCS controller. Configuration schemes include fast passive parallel, active serial, and JTAG. The part operates from -40C to +100C ambient (industrial, indicated by the I4 grade), supporting harsh-environment embedded compute.
Typical applications include telecom baseband prototyping, high-speed serial bridging, video processing pipelines, and software-defined radio front-ends. Compared with smaller Cyclone III parts, the EP3SE50 delivers roughly 6x the logic capacity and integrated DSP for compute-bound designs.
When designing with the EP3SE50F484I4LN, plan power sequencing so that the 0.9 V VCCINT rail reaches regulation before the 1.1 V/1.2 V VCCAUX and VCCIO rails, and use the Quartus II design suite (Altera/Intel) to verify pinout, fitter, and timing closure.
This page synthesizes distributor pricing, drop-in Stratix III E alternatives, and practical Quartus design notes not consolidated on any single distributor page.
Drop-in alternatives for EP3SE50F484I4LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE50F484I4LN (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE50F484I4L
✅ Drop-In✓ In Stock
$1290 / Unit
View Datasheet →EP3SE50F484I4LG
✅ Drop-In✓ In Stock
$1340 / Unit
View Datasheet →EP3SE50F484I4G
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP3SE50F484I3N
✅ Drop-In✓ In Stock
$841.66 / Unit
View Datasheet →EP3SE50F484C4N
✅ Drop-In✓ In Stock
$468.11 / Unit
View Datasheet →EP3SE50F484C4LN
✅ Drop-In✓ In Stock
$772.12 / Unit
View Datasheet →EP3SE50F484I4LN Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements (LE) | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Embedded Memory | 5.76 Mbit (estimated from 47.5K LE family) |
| User I/O Count | 296 |
| Process Node | 65 nm |
| Core Voltage (VCCINT) | 0.9 V |
| Auxiliary Voltage (VCCAUX) | 1.1 V |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V (bank-dependent) |
| Package | 484-ball FBGA (FineLine BGA) |
| Pin/Pitch | 484 balls, 1.0 mm pitch |
| Operating Temperature | -40C to +100C (industrial I4 grade) |
| Configuration | SRAM-based (external flash/EPCS required) |
| RoHS Status | Compliant (LN suffix indicates lead-free) |
| Lead-Free | Yes (LF / N suffix indicates lead-free) |
| Transceivers | 0 (F484 package does not include transceiver banks) |
| PLL Count | Up to 12 (estimated for Stratix III E family) |
| Design Tool | Quartus II (legacy, support via Altera/Intel subscription) |
EP3SE50F484I4LN 484-ball fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP3SE50F484I4LN (484-ball fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE50F484I4LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE50F484I4LN is suitable for 7 applications: Telecom Baseband Prototyping, High-Speed Serial Bridging and Protocol Conversion, Video and Image Processing Pipelines, Software-Defined Radio Front-End Processing, Industrial Control and Motor Drive Logic, Test and Measurement Instrumentation, Aerospace and Defense Ruggedized Systems.
Telecom Baseband Prototyping
The EP3SE50F484I4LN suits telecom baseband prototyping because its 47,500 logic elements provide enough capacity to implement multi-channel digital up-conversion, channel coding, and timing-recovery DSP blocks. The 5.76 Mbits of embedded memory reduce the need for external SRAM for buffering sample streams, and the 296 user I/Os allow parallel LVDS lanes to ADCs and DACs. Designers can iterate baseband algorithms in Quartus II without waiting for ASIC fabrication, cutting development cycles from months to weeks. Industrial -40C to +100C operation suits outdoor cell-site installations.
Recommended
High-Speed Serial Bridging and Protocol Conversion
Although the F484 package does not include transceiver banks, the EP3SE50F484I4LN handles protocol bridging between LVDS, LVCMOS, and parallel data interfaces up to several hundred MHz per pin. Its 1,900 LABs and rich DSP block availability allow soft SERDES, 8b/10b encoding, and CRC engines for legacy bus aggregation. With 296 user I/Os the part can aggregate multiple slower buses into a faster downstream port. Stratix III E's 0.9 V core delivers high performance per watt relative to older Stratix II designs.
Recommended
Video and Image Processing Pipelines
The EP3SE50F484I4LN is a strong fit for video processing because its 18x18 hardware multipliers and embedded RAM blocks efficiently implement 2D convolution, motion estimation, and color-space conversion at real-time frame rates. The 296 user I/Os accept multi-lane camera or HDMI-style LVDS inputs while the embedded 5.76 Mbit memory buffers line/frame data on-chip. Industrial temperature operation enables deployment in machine-vision systems used on factory floors. Designers can implement full 1080p60 video pipelines entirely within one EP3SE50 device.
Recommended
Software-Defined Radio Front-End Processing
Software-defined radio (SDR) front-ends benefit from the EP3SE50F484I4LN's dense DSP block array and ample embedded memory for I/Q buffering and FFT computation. The part can implement 1024-point FFTs, channelization filters, and digital down-conversion at sample rates exceeding 200 MHz when paired with high-speed ADCs on the LVDS I/Os. Its low 0.9 V core reduces power per gate versus previous-generation FPGAs, important in portable or battery-powered radio platforms. The industrial temperature grade supports outdoor deployable SDR units.
Recommended
Industrial Control and Motor Drive Logic
The EP3SE50F484I4LN suits industrial motor-drive controllers because its 296 user I/Os accept quadrature encoder, Hall-sensor, and PWM feedback signals from multi-axis drives, while its LABs implement state machines, PID loops, and safety logic in parallel. Industrial -40C to +100C operation tolerates drive cabinet temperatures, and the 0.9 V low-power core helps meet IEC 61800 energy-efficiency targets. The SRAM-based configuration allows field firmware updates via JTAG for production-line retooling. Multiple EP3SE50 devices can be chained for coordinated multi-axis servo control.
Recommended
Test and Measurement Instrumentation
The EP3SE50F484I4LN accelerates logic-analyzer, pattern-generator, and protocol-analyzer designs because its 296 user I/Os can probe dozens of channels simultaneously and its LABs implement deep trigger sequencers and on-chip timing capture. The 5.76 Mbits of embedded memory store capture buffers, and industrial temperature operation lets the same hardware ship into field-test racks as well as lab benches. Pairing the FPGA with high-speed ADCs on the LVDS lanes builds multi-Gsps digitizers. Quartus II's TimeQuest timing analyzer closes timing on the most demanding capture paths.
Recommended
Aerospace and Defense Ruggedized Systems
Aerospace and defense applications leverage the EP3SE50F484I4LN's industrial temperature range, lead-free RoHS compliance, and high-density programmable logic for radar DSP, electronic-warfare front-ends, and secure communications crypto engines. The 47.5K-LE logic capacity supports multi-channel digital beamforming and pulse compression, and the embedded memory stores sample buffers without external RAM. The 484-FBGA package is solderable onto ruggedized PCB substrates. Designers should verify that the obsolete-status sourcing strategy supports the program's lifecycle expectancy before locking the BOM.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE50F484I4LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F484I4L | EP3SE50F484I4G | EP3SE50F484I3N | EP3SE50F484C4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F484) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| User I/O Count | 296 | 296 | 296 | 296 | 296 |
| Temperature Grade | Industrial -40C to +100C (I4) | Industrial -40C to +100C (I4) | Industrial -40C to +100C (I4) | Industrial -40C to +100C (I3) | Commercial 0C to +85C (C4) |
| Speed Grade | I4 | I4 | I4 | I3 (one tier slower) | C4 (commercial) |
| Lead-Free / RoHS | Yes (LN suffix) | Yes (L suffix) | Yes (G suffix) | Yes (N suffix) | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Lead-free / RoHS-compliant package for global market compliance (vs EP3SE50F484I4)
- Industrial temperature range -40C to +100C vs commercial 0C to +85C (vs EP3SE50F484C4N)
- Full I4 speed grade (vs slower I3 grade) (vs EP3SE50F484I3N)
- Highest-density 484-FBGA option in the EP3SE50 family (vs EP3SE50F780I4N)
Design Notes
The Stratix III E family requires sequenced power-on: VCCINT (0.9 V) must reach regulation before VCCAUX (1.1 V), and VCCAUX before VCCIO (1.2-3.0 V bank-dependent). Skipping this sequence risks I/O latch-up or configuration failure. Use an Intel-recommended power sequencer or a discrete RC delay between regulator enables. Decoupling follows the Stratix III Device Handbook's per-bank capacitor tables; on the F484 package plan 22 uF bulk + 100 nF per VCCIO pin plus 4.7 uF per VCCINT pin.
The 484-FBGA uses 1.0 mm ball pitch on a 23 x 23 array with the 484th ball omitted; PCB layout must follow Intel's footprint recommendation with 0.5 mm solder mask openings and microvia or via-in-pad stackups. Run all high-speed LVDS lanes as 100 ohm differential pairs on a low-loss top-layer microstrip, and keep length-matched within 5 ps intra-pair and 50 ps inter-pair to avoid skew. Use the Quartus II pin planner to validate legal pin assignments before board fab.
Because the Stratix III E family uses volatile SRAM configuration, the EP3SE50F484I4LN must be configured at every power-on by an external flash (EPCS), a parallel flash, or a microprocessor host via JTAG. Designs that omit the configuration source will boot to a blank FPGA. Industrial temperature applications should use automotive-grade flash rated to +85C or higher. Run the Quartus II programmer to verify the configuration flash image matches the .sof bitstream before depopulating the factory.
Estimated: at typical Quartus II utilization of 70% LE and 50% DSP blocks at 200 MHz with default toggle rates, the EP3SE50F484I4LN dissipates approximately 3-5 W. The 484-FBGA's theta_JA is approximately 18-22 C/W on a 4-layer JEDEC test board with adequate thermal vias under the package. For higher dissipation designs, attach a heatsink with thermal interface material or supply forced airflow of 200 LFM minimum. Always cross-check with the Thermal Modeling Tool from Intel for production deployments.
The EP3SE50F484I4LN supports LVDS, LVCMOS, and SSTL I/O standards with up to 12 PLLs and 80+ clock networks. For multi-lane LVDS interfaces, use OCT (on-chip termination) to avoid external resistor networks. Drive reference clocks into dedicated CLK pins (CLK[0..N]) to minimize jitter, and run the TimeQuest timing analyzer with SDC constraints that match the silicon PLL settings. Multi-clock domain crossings require double-flopping or FIFO crossings to avoid metastability.
Compliance Information
RoHS-compliant per Intel/Stratix III product page; lead-free finish indicated by LN suffix in part number. Not AEC-Q100 qualified (industrial -40C to +100C, but no automotive PPAP).