EP3SE50F484I4N vs EP3SE50F484I4LN Comparison

Detailed side-by-side comparison of EP3SE50F484I4N by Intel and EP3SE50F484I4LN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F484I4N EP3SE50F484I4LN
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $998.00 $895.00
Device Family Stratix III E β€”
Logic Elements (LE) 47,500 47,500
Adaptive Logic Modules (ALMs) 19,000 β€”
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory (TriMatrix) 2,136 Kbits β€”
Embedded Multipliers (18x18) 384 β€”
User I/Os 296 β€”
I/O Banks 12 β€”
PLLs 8 β€”
Global Clock Networks 16 β€”
Maximum User I/O Frequency 800 MHz (per DigChip datasheet summary) β€”
Process Technology 65 nm CMOS β€”
Core Voltage 1.1 V β€”
Package 484-ball FC-FBGA (F484) 484-ball FBGA (FineLine BGA)
Operating Temperature 0 C to +85 C (Industrial) -40C to +100C (industrial I4 grade)
Speed Grade I4 β€”
Lead-Free / RoHS Lead-free (per ampheo listing) β€”
Family β€” Stratix III E
Embedded Memory β€” 5.76 Mbit (estimated from 47.5K LE family)
User I/O Count β€” 296
Process Node β€” 65 nm
Core Voltage (VCCINT) β€” 0.9 V
Auxiliary Voltage (VCCAUX) β€” 1.1 V
I/O Voltage (VCCIO) β€” 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V (bank-dependent)
Pin/Pitch β€” 484 balls, 1.0 mm pitch
Configuration β€” SRAM-based (external flash/EPCS required)
RoHS Status β€” Compliant (LN suffix indicates lead-free)
Lead-Free β€” Yes (LF / N suffix indicates lead-free)
Transceivers β€” 0 (F484 package does not include transceiver banks)
PLL Count β€” Up to 12 (estimated for Stratix III E family)
DSP Blocks (18x18 Multipliers) β€” [DATA_NEEDED: DSP block count]
Design Tool β€” Quartus II (legacy, support via Altera/Intel subscription)

Datasheets & Resources

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