EP3SE50F780C2N vs EP3SE260H780C2N Comparison
Detailed side-by-side comparison of EP3SE50F780C2N by Intel and EP3SE260H780C2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N β Last Time BuySpecification Comparison
| Parameter | EP3SE50F780C2N | EP3SE260H780C2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $278.90 | $3,600.00 |
| Family | Stratix III Enhanced (E) | β |
| Logic Elements | 47,500 | 255,000 |
| Adaptive Logic Modules (ALMs) | 19,000 | β |
| Embedded Memory | 5,760,000 bits | β |
| DSP Blocks | Yes (number not in source data) | β |
| User I/O Count | 488 | 488 |
| Transceiver Channels | 12 (data rate not in source data) | β |
| Process Technology | 65 nm CMOS | β |
| Core Voltage | 0.9 V to 1.1 V | 0.9 V |
| Maximum Internal Clock Frequency | 600 MHz | β |
| Package | 780-ball FC-FBGA (FBGA-780) | 780-BGA FCBGA |
| Speed Grade | C2 | C2 |
| Temperature Grade | Commercial (C2) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Lead Free | Yes | β |
| Configuration Mode | Passive Serial / Fast Passive Parallel | β |
| Series | β | Stratix III E |
| LABs / CLBs | β | 10,200 |
| Total RAM Bits | β | 16,672,768 |
| Number of Transceivers | β | [DATA_NEEDED: transceiver count] |
| Operating Temperature Range | β | Commercial (0C to +85C) |
| MSL Level | β | 3 (168 hours) |
| Reflow Peak Time Max | β | 40 s |
| RoHS Status | β | [DATA_NEEDED: rohs status] |
| Lead-Free | β | [DATA_NEEDED: lead-free] |
| Package Code | β | BGA |
| Terminal Form | β | Ball |
| Number of Terminals | β | 780 |
| Process Node | β | 40 nm |