EP3SE80F1152C2 vs EP3SE260F1152C3N Comparison
Detailed side-by-side comparison of EP3SE80F1152C2 by Intel and EP3SE260F1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N β ActiveSpecification Comparison
| Parameter | EP3SE80F1152C2 | EP3SE260F1152C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,325.00 | $7,500.00 |
| Family | Stratix III E | β |
| Logic Elements | 80,000 | β |
| Logic Array Blocks (LABs) | 3,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | β |
| Embedded Memory Bits | 6,843,392 | 16,672,768 bits |
| User I/Os | 744 | β |
| Process Technology | 65 nm | 65 nm |
| Core Voltage (VCCINT) | 1.1 V | β |
| Internal Operating Frequency | up to 600 MHz | β |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to +85 C (Commercial) |
| Speed Grade | C2 | β |
| Package | 1152-ball FC-FBGA (Flip Chip FineLine BGA) | 1152-BBGA, FCBGA |
| Package Code | F1152 | β |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | β |
| Series | β | Stratix III E |
| Logic Elements / Cells | β | 255,000 |
| User I/O Count | β | 744 |
| Core Voltage | β | 1.1 V |
| Transceivers | β | Integrated high-speed transceivers |
| DSP Blocks | β | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | β | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | β | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | β | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | β | Supported |
| Programmable Power Technology | β | Yes (up to 50% dynamic power reduction) |