EP3SE80F780C3N vs EP3SE110F780C3N Comparison
Detailed side-by-side comparison of EP3SE80F780C3N by Intel and EP3SE110F780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE80F780C3N | EP3SE110F780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,410.00 | $1,245.00 |
| Family | Stratix III | Stratix III E |
| Logic Elements | 80,000 | β |
| Number of LABs | 3200 | β |
| Number of I/Os | 488 | β |
| Package Type | FBGA-780 (FineLine BGA) | β |
| Process Technology | 40 nm CMOS | 65 nm |
| Supply Voltage | 0.9 V core | β |
| Operating Temperature | 0 Β°C to 85 Β°C (commercial) | β |
| Internal Frequency (max) | 717 MHz | β |
| Speed Grade | C3 | β |
| Lead-Free | Yes (Pb-free) | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Memory Subsystem | TriMatrix embedded memory | β |
| DSP Blocks | Yes, dedicated DSP blocks | Yes (integrated, count varies by configuration) |
| RoHS Status | Compliant | Compliant |
| Total Pins | 780 | β |
| Logic Elements (LEs) | β | 107,500 |
| Embedded Memory Bits | β | 8,936,448 |
| Logic Array Blocks (LABs) | β | 4,300 |
| User I/Os | β | 488 |
| Package | β | 780-ball FCBGA (Flip-Chip BGA) |
| Core Voltage | β | 1.1 V |
| Maximum Operating Frequency | β | 500 MHz |
| Transceiver Channels | β | 8 (multi-gigabit) |
| Embedded Memory | β | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | β | Serial / Parallel via Quartus II |
| Operating Temperature Grade | β | Commercial (C suffix) |
| MSL Level | β | [DATA_NEEDED: MSL rating] |