EP3SL200H780C2 vs EP3SL200H780C3N Comparison

Detailed side-by-side comparison of EP3SL200H780C2 by Intel and EP3SL200H780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780C2 EP3SL200H780C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $6,950.00 $4,995.00
Series Stratix III L β€”
Logic Elements 200,000 200,000
LABs / CLBs 8000 β€”
Total Memory Bits 10,901,504 β€”
User I/O Count 488 β€”
Package 780-BBGA, FCBGA 780-Ball FCBGA (HBGA), 29 x 29 mm
Operating Temperature 0C to +85C (Commercial) 0C to +85C (commercial)
Mounting Type Surface Mount Surface Mount
MSL Level [DATA_NEEDED: MSL level] 3
Process Node 65 nm 40 nm
Voltage - Core [DATA_NEEDED: core voltage] 0.9 V / 1.0 V (core, VCC)
Voltage - I/O [DATA_NEEDED: I/O voltage] 1.2 V to 3.3 V (VCCIO banks)
DSP Multipliers (18x18) [DATA_NEEDED: 18x18 multiplier count] β€”
Transceivers [DATA_NEEDED: transceiver count for H780] 24 channels, up to 3.75 Gbps
RoHS Status Compliant β€”
Lead Free Yes β€”
Family β€” Stratix III L (low-power)
Embedded Memory Bits β€” 10,901,504 bits
Logic Array Blocks (LABs) β€” 8,000
User I/Os β€” 488
Maximum Internal Clock Frequency β€” 800 MHz
DSP Blocks β€” 384
Speed Grade β€” C3 (commercial, -3 speed)
Lead-Free / RoHS β€” Yes
Mounting Pitch β€” 1.0 mm ball pitch
PLLs β€” 12 (Stratix III PLL array)
Configuration β€” JTAG IEEE Std 1149.1, passive/active serial

Datasheets & Resources

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