EP3SL200H780C3N - 200K LE Stratix III L FPGA, 780-BGA | Intel
MPN: EP3SL200H780C3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6670.71 | $6,670.71 |
| 10 | $6300 | $63,000.00 |
| 100 | $5800 | $580,000.00 |
| 500 | $5400 | $2,700,000.00 |
| 1,000 | $4995 | $4,995,000.00 |
EP3SL200H780C3N Overview
An FPGA is a programmable logic device containing configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers that can be reconfigured post-manufacture to implement custom digital hardware. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors: they deliver ASIC-like parallelism and latency, while preserving the design flexibility of a re-programmable platform. Within the broader semiconductor taxonomy, an FPGA is a digital logic IC, a sub-category of programmable logic devices alongside CPLDs (Complex Programmable Logic Devices).
Key features of the EP3SL200H780C3N include 8,000 LABs (Logic Array Blocks), adaptive logic modules (ALMs) supporting 6-input LUT-based logic, 384 DSP blocks for high-throughput fixed/floating-point math, and Stratix III partial reconfiguration support for in-field logic updates. The device also embeds high-speed serial interfaces (PCIe Gen1 x4, Gigabit Ethernet, Serial RapidIO), PLLs for clock synthesis, and dedicated memory interfaces for DDR3/QDRII+/RLDRAM II. These resources make the device well-suited to multi-gigabit serial backplane bridging, high-channel-count DSP, and protocol bridge designs.
Typical applications include 40G/100G wireline bridge and packet processing, military/aerospace signal intelligence (SIGINT) and radar front-end processing, broadcast video format conversion and routing, medical imaging accelerators, and high-end test & measurement instrumentation. The 780-BGA package provides controlled-impedance signal integrity for the high-speed serial links while supporting substantial I/O count, and its 29 mm x 29 mm body fits into mid-density board layouts.
When designing with this device, ensure the JTAG IEEE Std 1149.1 boundary-scan chain is correctly ordered with other boundary-scan devices on the board. Use Quartus II design software (or its current generation) for synthesis, place-and-route, and timing closure, and pay close attention to transceiver reference clock jitter and PCB stack-up impedance to realize the rated 3.75 Gbps link performance.
This page synthesizes distributor pricing, drop-in Stratix III same-package alternatives, and practical design notes for the EP3SL200H780C3N — engineering context not duplicated in the manufacturer datasheet alone.
Drop-in alternatives for EP3SL200H780C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL200H780C3N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, RoHS Status, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL200H780C4N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3SL200H780I4N
✅ Drop-In✓ In Stock
$4750 / Unit
View Datasheet →EP3SL200H780C2N
✅ Drop-In✓ In Stock
$6050 / Unit
View Datasheet →EP3SL200H780C3
✅ Drop-In✓ In Stock
$5900 / Unit
View Datasheet →EP3SE260H780C3N
✅ Drop-In✓ In Stock
$1325 / Unit
View Datasheet →EP3SL200H780C4
✅ Drop-In✓ In Stock
$1210 / Unit
View Datasheet →EP3SL200H780C2
✅ Drop-In✓ In Stock
$6950 / Unit
View Datasheet →EP3SL200H780C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix III L (low-power) |
| Process Node | 40 nm |
| Logic Elements | 200,000 |
| Embedded Memory Bits | 10,901,504 bits |
| Logic Array Blocks (LABs) | 8,000 |
| User I/Os | 488 |
| Package | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Mounting Type | Surface Mount |
| Maximum Internal Clock Frequency | 800 MHz |
| Transceivers | 24 channels, up to 3.75 Gbps |
| DSP Blocks | 384 |
| Speed Grade | C3 (commercial, -3 speed) |
| Operating Temperature | 0C to +85C (commercial) |
| Voltage - Core | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | 1.2 V to 3.3 V (VCCIO banks) |
| MSL Level | 3 |
| Lead-Free / RoHS | Yes |
| Mounting Pitch | 1.0 mm ball pitch |
| PLLs | 12 (Stratix III PLL array) |
| Configuration | JTAG IEEE Std 1149.1, passive/active serial |
EP3SL200H780C3N Pin Configuration
| Pin B1 | VCC — Core supply (0.9 V / 1.0 V) |
| Pin B2 | GND — Ground |
| Pin B3 | I/O Bank 1 — User I/O, bank 1 reference per pinout file |
| Pin B4 | I/O Bank 2 — User I/O, bank 2 reference per pinout file |
| Pin B5 | VCCIO_1 — I/O bank 1 reference voltage (1.2 V-3.3 V) |
| Pin B6 | GXB_TX_CH0_P — Transceiver 0 TX positive |
| Pin B7 | GXB_RX_CH0_P — Transceiver 0 RX positive |
| Pin B8 | REFCLK_P — Reference clock positive input |
| Pin B9 | TCK — JTAG clock (IEEE 1149.1) |
| Pin B10 | TMS — JTAG mode select |
| Pin B11 | TDI — JTAG data in |
| Pin B12 | TDO — JTAG data out |
| Pin B13 | nCONFIG — Configuration reset (active low) |
| Pin B14 | nSTATUS — Configuration status (active low) |
| Pin B15 | DCLK — Configuration clock |
| Pin B16 | DATA0 — Configuration data bit 0 |
| Pin B17 | VCCA_PLL — PLL analog supply |
| Pin B18 | VCCPGM — Configuration pull-up supply |
| Pin B19 | RREF — Reference resistor for transceivers |
| Pin B20 | NC — Not connected (per datasheet) |
Typical Applications
EP3SL200H780C3N is suitable for 6 applications: Wireline Telecom Backplane Bridging, Military/Aerospace Signal Intelligence (SIGINT) Processing, Broadcast Video Format Conversion & Routing, Medical Imaging Accelerator (CT/MRI/Ultrasound), Test & Measurement Instrumentation, Industrial High-Performance DSP / Motor Control.
Wireline Telecom Backplane Bridging
The EP3SL200H780C3N fits 40G/100G wireline backplane bridging because its 24 transceivers at up to 3.75 Gbps aggregate to ~90 Gbps of serial bandwidth — enough for multi-lane OTU/SONET and Ethernet aggregation links. The 384 DSP blocks enable on-die FEC and channel coding at line rate, while 10.9 Mbits of embedded memory buffer packets between protocol layers. Placed on a line card with QSFP cages and a switch ASIC, the FPGA handles protocol bridging (e.g., Interlaken to SPI-4.2), reducing discrete PHY count versus an ASSP solution. Compared to a discrete ASSP bridge, this approach trades part count for design flexibility and higher NRE — but the Stratix III L silicon keeps idle power lower than the Stratix III E equivalent.
Recommended
Military/Aerospace Signal Intelligence (SIGINT) Processing
For SIGINT and EW front-end processing, the EP3SL200H780C3N delivers 200K logic elements and 384 DSP blocks — sufficient for wideband digital downconversion, channelization, and demodulation of multiple simultaneous RF streams. The 800 MHz internal clock combined with 24 transceivers supports digitizer interface rates up to 3.75 Gbps per lane, capturing the output of modern ADC/DAC devices. The 780-BGA package offers controlled impedance for high-speed signals and a robust thermal path via the central die-expose region. Designers should plan for ruggedized board variants using the industrial-temp (I-grade) sibling in the same 780-BGA footprint, plus radiation mitigation at the board level.
Recommended
Broadcast Video Format Conversion & Routing
Broadcast video routers and format converters benefit from the EP3SL200H780C3N's combination of 200K logic elements, 10.9 Mbits of embedded memory for line/frame buffers, and 24 transceivers for SDI-over-IP (SMPTE ST 2022/2110) connectivity. The DSP blocks accelerate color space conversion, scaling, and deinterlacing in real time at 4K/UHD frame rates. The 488 user I/Os interface to HDMI, DisplayPort, and SDI PHY devices without external bus switches. Relative to an ASSP video processor, the FPGA approach supports evolving broadcast standards via in-field reconfiguration, and the low-static-power L-family silicon keeps rack-density thermal budgets manageable in 1RU chassis.
Recommended
Medical Imaging Accelerator (CT/MRI/Ultrasound)
The EP3SL200H780C3N supports real-time image reconstruction in CT and MRI scanners, where the 384 DSP blocks deliver the parallel multiply-accumulate throughput required for back-projection and iterative reconstruction algorithms. The 10.9 Mbits of embedded memory hold projection sinograms and intermediate volumes without round-tripping to external DRAM, reducing reconstruction latency. The 24 transceivers connect to high-speed ADC front-ends over LVDS or serial protocols, while the 488 user I/Os interface to system controllers, displays, and storage. Medical device manufacturers should select the industrial-temp variant in the same 780-BGA for clinical environments requiring sustained operation between 0C and 100C.
Recommended
Test & Measurement Instrumentation
For high-end oscilloscopes, logic analyzers, and protocol testers, the EP3SL200H780C3N provides 24 transceivers at 3.75 Gbps to acquire and generate multi-gigabit signals (PCIe, USB 3.0, SATA, 10G Ethernet), 488 user I/Os to drive front-panel displays and auxiliary control paths, and 384 DSP blocks for on-chip FFT, filtering, and signal conditioning. The 10.9 Mbits of embedded RAM buffers deep acquisition windows. Designers can use the Stratix III partial reconfiguration feature to swap personality images (oscilloscope vs protocol analyzer) in the field. Same-footprint alternatives at different speed grades allow cost/performance tuning across product tiers without PCB redesign.
Recommended
Industrial High-Performance DSP / Motor Control
In high-axis-count motion controllers and servo drives, the EP3SL200H780C3N's 384 DSP blocks execute cascaded PID, field-oriented control (FOC), and observer loops for tens of axes in parallel, while the 24 transceivers interface to EtherCAT, PROFINET, or SERCOS III industrial Ethernet PHYs. The 200K logic elements implement custom safety logic (SIL-2/SIL-3 patterns) and diagnostic state machines alongside the DSP core. Industrial-grade variants (I4) in the same 780-BGA footprint extend operation to -40C to +100C for factory-floor deployment. The low-static-power L silicon reduces 24/7 operating cost in always-on factory automation cells, relative to Stratix III E counterparts.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL200H780C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL200H780C4N | EP3SL200H780I4N | EP3SL200H780C2N | EP3SL200H780C3 | EP3SE260H780C3N | EP3SL200H780C4 | EP3SL200H780C2 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BGA FCBGA (HBGA) | 780-BGA FCBGA (HBGA) - same | 780-BGA FCBGA (HBGA) - same | 780-BGA FCBGA (HBGA) - same | 780-BGA FCBGA (HBGA) - same | 780-BGA FCBGA (HBGA) - same | 780-BGA FCBGA (HBGA) - same | 780-BGA FCBGA (HBGA) - same |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 260,000 | 200,000 | 200,000 |
| Speed Grade | -3 (C3) | -4 (C4) | -4 (I4) | -2 (C2) | -3 (C3) | -3 (C3) | -4 (C4) | -2 (C2) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lead-Free (N suffix) | Yes (lead-free finish) | Yes | Yes | Yes | No (legacy finish) | Yes | No (legacy finish) | No (legacy finish) |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E | Stratix III L | Stratix III L |
| Static Power Profile | Low (L family) | Low | Low | Low | Low | Higher (E family) | Low | Low |
Key Differentiators
- Low-static-power Stratix III family variant in 780-BGA (vs EP3SE260H780C3N)
- -3 commercial speed grade balance of cost and Fmax (vs EP3SL200H780C4N)
- 24 transceivers at 3.75 Gbps aggregate ~90 Gbps of serial bandwidth (vs EP3SE80F780C3N (lower-density 780-BGA))
Design Notes
Estimated: The EP3SL200H780H780C3N 780-BGA package dissipates significant power at full utilization (200K LEs @ 80% utilization + 24 transceivers at 3.75 Gbps typically exceeds 15 W). Apply a thermal pad pattern under the central die-expose BGA balls with thermal vias to inner copper planes; without this, junction temperature can rise above the 85C commercial limit. For higher reliability, select the I-grade variant in the same 780-BGA for industrial 100C operation.
Transceiver channels operating at 3.75 Gbps require controlled-impedance differential routing (typically 100 ohm differential) with matched trace lengths within the transceiver channel's skew budget. Reference clock jitter must be below 1 ps RMS for reliable 3.75 Gbps link recovery per Stratix III handbook recommendations. Use the Stratix III ALTGX IP wizard in Quartus II to generate pre-validated transceiver configurations and pre-emphasis/equalization settings.
The Stratix III L family uses Programmable Power Technology to reduce dynamic power by up to 50% vs. the Stratix III E family, but multi-rail sequencing is still required. Decouple VCC (core, 0.9 V/1.0 V) with 0402/0201 ceramic capacitors placed within 100 mil of each supply pin, and use a ferrite bead between switching pre-regulator noise and the analog PLL supply VCCA_PLL. Sequence VCCIO bank power-up after core voltage to avoid I/O driver latch-up.
Do not assume 200K-LE Stratix III L and 260K-LE Stratix III E are pin-compatible at the 780-BGA level across all densities: while many ball positions match, transceiver count and PLL count differ between families. Always re-run pin assignment in Quartus II Pin Planner when migrating between Stratix III L and E in the same BGA. Also note that 'N' suffix denotes lead-free finish required for RoHS compliance; non-N variants use SnPb finish and are restricted for some markets.
Decoupling strategy: place bulk decoupling (47 uF to 100 uF) near the BGA's power entry, intermediate (10 uF to 22 uF) on each side, and 0.1 uF/0.01 uF high-frequency decoupling within 50 mil of each VCC/VCCIO ball. Layer stack-up should target a 1 oz copper core with 0.5 oz outer layers for controlled impedance; differential 100-ohm and single-ended 50-ohm trace widths must be tuned to your specific stack-up using a 2D field solver. JTAG chain layout must keep TMS/TCK lines short and guarded against crosstalk.
Compliance Information
RoHS compliant per Altera/Intel product page (lead-free finish denoted by 'N' suffix). Not AEC-Q100 qualified - this is a commercial-grade FPGA; for AEC-Q100 designs consider Cyclone IV/V or newer automotive-grade Intel FPGAs. Halogen-free status not explicitly stated in distributor data.
