EP3SL200H780C3N vs EP3SL200H780C4L Comparison

Detailed side-by-side comparison of EP3SL200H780C3N by Intel and EP3SL200H780C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780C3N EP3SL200H780C4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $4,995.00 $6,459.35
Family Stratix III L (low-power) β€”
Process Node 40 nm β€”
Logic Elements 200,000 200,000
Embedded Memory Bits 10,901,504 bits β€”
Logic Array Blocks (LABs) 8,000 β€”
User I/Os 488 β€”
Package 780-Ball FCBGA (HBGA), 29 x 29 mm β€”
Mounting Type Surface Mount β€”
Maximum Internal Clock Frequency 800 MHz β€”
Transceivers 24 channels, up to 3.75 Gbps β€”
DSP Blocks 384 β€”
Speed Grade C3 (commercial, -3 speed) -4 (medium performance, commercial)
Operating Temperature 0C to +85C (commercial) 0C to 85C (commercial)
Voltage - Core 0.9 V / 1.0 V (core, VCC) β€”
Voltage - I/O 1.2 V to 3.3 V (VCCIO banks) β€”
MSL Level 3 β€”
Lead-Free / RoHS Yes β€”
Mounting Pitch 1.0 mm ball pitch β€”
PLLs 12 (Stratix III PLL array) β€”
Configuration JTAG IEEE Std 1149.1, passive/active serial β€”
Manufacturer β€” Intel (formerly Altera)
Series β€” Stratix III
Device Type β€” FPGA - Field Programmable Gate Array
Embedded Memory β€” 6.5 Mbit
User I/O Count β€” 488
Package Type β€” 780-ball FCBGA (FineLine BGA, HBGA)
Package Code β€” BGA-780 / PBGA780 / HBGA-780
Package Mounting β€” Surface Mount
Internal Logic Frequency β€” up to 717 MHz (per ampheo datasheet brief)
Lead-Free / Pb-Free β€” Yes (L suffix, lead-free)
RoHS Status β€” Compliant
Process Technology β€” TSMC 40 nm
Configuration Modes β€” FPP, AS, PS, JTAG

Datasheets & Resources

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