EP3SL200H780C3N vs EP3SL200H780I3N Comparison

Detailed side-by-side comparison of EP3SL200H780C3N by Intel and EP3SL200H780I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780C3N EP3SL200H780I3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $4,995.00 $7,200.00
Family Stratix III L (low-power) Stratix III L
Process Node 40 nm 40 nm
Logic Elements 200,000 200,000
Embedded Memory Bits 10,901,504 bits β€”
Logic Array Blocks (LABs) 8,000 β€”
User I/Os 488 β€”
Package 780-Ball FCBGA (HBGA), 29 x 29 mm 780-BBGA, FCBGA
Mounting Type Surface Mount Surface Mount
Maximum Internal Clock Frequency 800 MHz β€”
Transceivers 24 channels, up to 3.75 Gbps β€”
DSP Blocks 384 β€”
Speed Grade C3 (commercial, -3 speed) β€”
Operating Temperature 0C to +85C (commercial) -40C to +100C (Industrial)
Voltage - Core 0.9 V / 1.0 V (core, VCC) β€”
Voltage - I/O 1.2 V to 3.3 V (VCCIO banks) β€”
MSL Level 3 β€”
Lead-Free / RoHS Yes β€”
Mounting Pitch 1.0 mm ball pitch β€”
PLLs 12 (Stratix III PLL array) β€”
Configuration JTAG IEEE Std 1149.1, passive/active serial β€”
RAM Bits β€” 10,901,504
User I/O β€” 488
Package Pin Count β€” 780
Supply Voltage (Core) β€” 0.9 V
Technology β€” CMOS, 40 nm
Number of Terminals β€” 780
Case / Package Code β€” BGA-780
RoHS Status β€” Compliant
Lead-Free β€” Yes

Datasheets & Resources

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