EP3SL200H780C3N vs EP3SL200H780I4LN Comparison

Detailed side-by-side comparison of EP3SL200H780C3N by Intel and EP3SL200H780I4LN by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780C3N EP3SL200H780I4LN
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $4,995.00 $1,280.00
Family Stratix III L (low-power) Stratix III L (Low-Power)
Process Node 40 nm β€”
Logic Elements 200,000 β€”
Embedded Memory Bits 10,901,504 bits β€”
Logic Array Blocks (LABs) 8,000 β€”
User I/Os 488 β€”
Package 780-Ball FCBGA (HBGA), 29 x 29 mm β€”
Mounting Type Surface Mount Surface Mount
Maximum Internal Clock Frequency 800 MHz β€”
Transceivers 24 channels, up to 3.75 Gbps β€”
DSP Blocks 384 β€”
Speed Grade C3 (commercial, -3 speed) I4 (Industrial, mid-speed grade)
Operating Temperature 0C to +85C (commercial) -40C to +100C (industrial)
Voltage - Core 0.9 V / 1.0 V (core, VCC) β€”
Voltage - I/O 1.2 V to 3.3 V (VCCIO banks) β€”
MSL Level 3 MSL 3 (168 Hours, per JEDEC J-STD-020)
Lead-Free / RoHS Yes β€”
Mounting Pitch 1.0 mm ball pitch β€”
PLLs 12 (Stratix III PLL array) β€”
Configuration JTAG IEEE Std 1149.1, passive/active serial β€”
Series β€” Stratix III L
Manufacturer β€” Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells β€” 200,000
Number of LABs / CLBs β€” 8,000
Total RAM Bits β€” 10,901,504 (approximately 10.9 Mbit)
Number of I/O β€” 488
Voltage - Supply β€” 0.9 V core (selectable Vcore)
Package / Case β€” 780-BBGA, FCBGA (Flip-Chip BGA)
Process Technology β€” 65 nm CMOS
RoHS Status β€” RoHS Compliant (lead-free)
Roaming Pin Name Suffix β€” LN = lead-free, industrial temp, H780 780-ball package

Datasheets & Resources

Browse All Products Create BOM Request Quote