EP3SL200H780I3 vs EP3SL200H780I4 Comparison
Detailed side-by-side comparison of EP3SL200H780I3 by Intel and EP3SL200H780I4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SL200H780I3 | EP3SL200H780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7,980.00 | $6,255.75 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | Stratix III |
| Logic Elements | 200,000 | β |
| LABs (Logic Array Blocks) | 8000 | β |
| Total RAM Bits | 10,901,504 (10,900 Kb) | β |
| User I/O Count | 488 | 488 |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | β |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | β |
| PLLs | 12 | β |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | β |
| Maximum Operating Frequency | 717 MHz | β |
| Operating Temperature | -40C to +100C (Industrial) | β |
| Package | 780-BBGA, FCBGA (HBGA-780) | β |
| Mounting Type | Surface Mount | β |
| Supplier Device Package | 780-FBGA (29x29 mm) | β |
| Lead-Free / RoHS | Compliant (lead-free) | β |
| Logic Elements (LE) | β | 200,000 |
| Logic Array Blocks (LABs) | β | 8000 |
| Embedded Memory Bits | β | 10,901,504 |
| DSP Multipliers (18x18) | β | 384 |
| Voltage - Core Supply | β | 1.1 V |
| Package Type | β | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | β | 33 mm x 33 mm |
| Speed Grade | β | I4 (industrial) |
| Operating Junction Temperature | β | -40C to +100C (industrial) |
| Configuration Memory | β | SRAM-based, volatile |
| RoHS Status | β | Compliant |
| Design Tool | β | Quartus II (legacy) / Quartus Prime |