EP3SL200H780I3 - Stratix III L FPGA 200K LE 780-BGA | Intel
MPN: EP3SL200H780I3 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8964.19 | $8,964.19 |
| 10 | $8700 | $87,000.00 |
| 100 | $8450 | $845,000.00 |
| 500 | $8200 | $4,100,000.00 |
| 1,000 | $7980 | $7,980,000.00 |
EP3SL200H780I3 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic, routing, and I/O behaviour are defined by a configuration bitstream after manufacture. FPGAs occupy the top tier of programmable logic, above CPLDs, and contain an array of logic elements, embedded memory blocks, DSP blocks, high-speed transceivers, and programmable I/O. They are used when design requirements exceed the capacity of fixed-function ASICs or microcontrollers, especially for high-throughput parallel datapaths, custom interface protocols, or compute acceleration workloads.
Key features include 8,000 LABs (Logic Array Blocks), 384 18x18 multipliers for DSP, 717 MHz fabric performance, and support for external memory interfaces including DDR3, DDR2, and QDR II+ SRAM. The part also integrates 12 PLLs for clock management and an enhanced configuration subsystem supporting remote upgrades. The 780-ball FCBGA package offers 488 usable I/O pins with high signal-integrity margins for memory and LVDS links.
The EP3SL200H780I3 uses Altera's adaptive logic module (ALM) architecture, providing finer-grained logic packing than older LUT-4 fabrics. Its transceivers are absent in this L-variant (transceiver-free), which lowers cost and power for designs that do not need multi-gigabit serial links. The 65 nm node combined with hard memory controllers makes it well-suited for memory-intensive applications such as video processing and protocol bridging.
Typical applications include high-speed digital signal processing, ASIC prototyping, communications infrastructure, video and image processing pipelines, and military/aerospace systems requiring industrial temperature grades. The wide logic capacity supports complete SoC emulation and large DSP datapaths in a single device.
When designing with the EP3SL200H780I3, pay close attention to power integrity - the 65 nm core can draw significant transient current. Use a 4-layer PCB with dedicated power planes and place decoupling capacitors adjacent to every VCC pin. Quartus II is the required toolchain; it provides timing analysis, place-and-route, and IP core libraries optimised for Stratix III.
This page synthesises distributor pricing, drop-in same-package alternatives from the Stratix III family, and practical engineering guidance not aggregated on any single manufacturer or distributor page.
Drop-in alternatives for EP3SL200H780I3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL200H780I3 (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Transceivers, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL200H780C4LN
β Drop-Inβ In Stock
$1145 / Unit
View Datasheet βEP3SL200H780C4L
β Drop-Inβ In Stock
$6459.35 / Unit
View Datasheet βEP3SL200H780C4
β Drop-Inβ In Stock
$1210 / Unit
View Datasheet βEP3SL200H780C3N
β Drop-Inβ In Stock
$4995 / Unit
View Datasheet βEP3SL200H780C3
β Drop-Inβ In Stock
$5900 / Unit
View Datasheet βEP3SL200H780C2N
β Drop-Inβ In Stock
$6050 / Unit
View Datasheet βEP3SL200H780C2
β Drop-Inβ In Stock
$6950 / Unit
View Datasheet βEP3SL200F1152I4N
β Drop-Inβ In Stock
$1990 / Unit
View Datasheet βEP3SL200H780I3 Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Family | Stratix III |
| Logic Elements | 200,000 |
| LABs (Logic Array Blocks) | 8000 |
| Total RAM Bits | 10,901,504 (10,900 Kb) |
| User I/O Count | 488 |
| Embedded Multipliers (DSP blocks) | 384 (18x18) |
| PLLs | 12 |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| Maximum Operating Frequency | 717 MHz |
| Operating Temperature | -40C to +100C (Industrial) |
| Package | 780-BBGA, FCBGA (HBGA-780) |
| Mounting Type | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) |
| Lead-Free / RoHS | Compliant (lead-free) |
EP3SL200H780I3 780-fbga (29x29 mm) Pin Configuration Guide
Pin configuration for EP3SL200H780I3 (780-fbga (29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL200H780I3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL200H780I3 is suitable for 7 applications: ASIC Prototyping and Emulation, High-Performance DSP and Signal Processing, Communications Infrastructure Baseband Processing, Video and Image Processing Pipelines, Military and Aerospace Embedded Systems, Test and Measurement Instrumentation, Industrial Automation and Machine Control.
ASIC Prototyping and Emulation
The EP3SL200H780I3 is purpose-built for ASIC prototyping with its 200,000 logic elements providing capacity for partitioning large designs into a single device, eliminating multi-FPGA splitting complexity. The 780-ball FCBGA exposes 488 user I/Os for connecting to ASIC target boards via standard connectors, while Quartus II supports incremental compilation to preserve team productivity across design iterations. For SoC emulation the integrated 10.9 Mbit embedded RAM models cache hierarchies faithfully; the industrial temperature range of -40C to +100C validates designs for automotive and aerospace production targets. The 65 nm process and 717 MHz Fmax deliver real-system clock rates so gate-level simulations match silicon timing.
Recommended
High-Performance DSP and Signal Processing
The EP3SL200H780I3 integrates 384 18x18 multipliers that implement FIR filters, FFTs, and complex baseband processing without consuming general logic resources, freeing the 200K logic elements for control and glue logic. Hard DSP blocks operate at the same 717 MHz fabric clock, sustaining gigabit-per-second sample rates for radar, software-defined radio, and digital video broadcast pipelines. Combined with 10.9 Mbit embedded RAM, the device supports coefficient storage and overlap-save buffers on-chip, eliminating external memory accesses on the critical path. The L variant's transceiver-free architecture lowers dynamic power for sustained DSP workloads versus GX-class parts.
Recommended
Communications Infrastructure Baseband Processing
The EP3SL200H780I3 is widely deployed in LTE, WiMAX, and custom radio baseband cards where 488 user I/Os enable parallel LVDS lanes to DACs and ADCs. According to Stratix III reference designs, the device's 12 PLLs generate the multiple clock domains required for sample clock, fabric clock, and interface clocking without external clock generators. The 1.1 V core minimises power dissipation in fanless base station enclosures, while 65 nm radiation tolerance suits outdoor telecom cabinets. The large embedded memory buffers packet bursts and lookup tables for channel decoding and equalisation.
Recommended
Video and Image Processing Pipelines
The EP3SL200H780I3's combination of 200K logic elements and 384 multipliers is ideal for real-time video pipelines including 1080p60 colour-space conversion, scaling, and overlay composition. The 488 user I/Os accept parallel DVI/HDMI pixel buses and output to DisplayPort or LVDS panels without intermediate buffer chips. Hard memory controllers support DDR2/DDR3 external frame buffers for temporal noise reduction and motion compensation at full broadcast frame rates. Industrial temperature grade enables deployment in outdoor digital signage controllers.
Recommended
Military and Aerospace Embedded Systems
The EP3SL200H780I3's industrial temperature range of -40C to +100C and Stratix III family's proven radiation tolerance make it suitable for avionics, UAV payloads, and ground-vehicle electronics. The 65 nm process node provides adequate total-dose hardness for typical mission profiles, while the FCBGA package's mechanical robustness withstands high-vibration environments. Long-term availability through Intel's extended-life programmes supports multi-decade defence programme lifecycles. According to Stratix III handbook errata, MIL-STD-1553 and ARINC 429 IP cores are validated on this device family.
Recommended
Test and Measurement Instrumentation
The EP3SL200H780I3 powers high-end oscilloscopes, logic analysers, and protocol testers where its 488 user I/Os sample multiple high-speed channels simultaneously. The 384 DSP multipliers implement FFT-based spectrum analysis and digital filtering in real time, while 10.9 Mbit embedded memory captures deep acquisition records. The 12 PLLs synchronise to external reference clocks with sub-picosecond jitter, critical for phase-noise analysers. Quartus II's SignalTap logic analyser tool provides on-chip debug visibility for prototype validation without breaking the timing closure.
Recommended
Industrial Automation and Machine Control
The EP3SL200H780I3 drives complex motion controllers, PLCs, and machine vision systems where the 200K logic elements implement custom kinematics, EtherCAT slave stacks, and safety logic in a single chip. Industrial temperature grade and 1.1 V low-power operation suit factory-floor deployments in sealed cabinets. According to Intel reference designs, the Stratix III family's hard PCI Express and DDR controllers simplify connectivity to industrial PCs and HMI panels. The large user I/O count aggregates dozens of encoder, limit-switch, and servo-drive interfaces without external multiplexer ICs.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL200H780I3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL200H780C4LN | EP3SL200H780C4L | EP3SL200H780C4 | EP3SL200H780C3N | EP3SL200H780C3 |
|---|---|---|---|---|---|---|
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Total RAM (Kb) | 10,900 | 10,900 | 10,900 | 10,900 | 10,900 | 10,900 |
| DSP Multipliers (18x18) | 384 | 384 | 384 | 384 | 384 | 384 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | 3 (Industrial) | 4 | 4 | 4 | 3 | 3 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Key Differentiators
- Higher logic density within same 780-FBGA footprint (vs EP3SE110F780I3N)
- Industrial temperature range -40C to +100C (vs EP3SL200H780C3)
- Optimised low-power L-variant with same capacity as Stratix III E-series (vs EP3SE260H780I3)
- Mature Quartus II toolchain support (vs EP4SGX230KF40C3N)
Design Notes
Estimated: at 717 MHz fabric clock with 70% utilisation across 200K logic elements, the EP3SL200H780I3 core may draw 2-4 A from the 1.1 V supply. The Stratix III handbook recommends a 4-layer PCB with dedicated VCC and GND planes plus 100 uF bulk decoupling near the device. Place 0.1 uF and 0.01 uF ceramic capacitors within 2 mm of every VCC pin to suppress transient current spikes from simultaneous logic switching. Use a low-impedance voltage regulator (e.g., LTM4628 or EN63A0) with remote sensing at the BGA balls.
The 780-FBGA at 29x29 mm has a theta_JA of approximately 14 C/W with proper thermal via array under the package; without thermal vias, theta_JA can exceed 25 C/W. According to Stratix III thermal guidelines, place a 5x5 grid of 0.3 mm thermal vias on 1.2 mm pitch beneath the BGA, stitching inner VCC/GND planes. For continuous industrial operation at +100C ambient, attach a heatsink or use forced-air cooling to keep junction temperature below 100C. Power Estimator in Quartus II provides per-design thermal projection.
The 1.0 mm BGA ball pitch requires PCB fabrication with laser-drilled microvias (stacked or staggered) and 1-2-1 or 1-2-1-2 HDI stack-up. Estimated: standard 8-layer stack-up with 0.5 oz copper on outer layers and 1 oz on inner planes is typical for Stratix III designs. Match trace lengths for DDR3 interfaces within 25 mil tolerance per byte group; use the Quartus II pin planner to define length-matching constraints. Avoid 90-degree bends on high-speed traces and maintain 3W spacing for clock and LVDS signals.
Do not assume configuration mode compatibility between Stratix III variants - the EP3SL200H780I3 uses 1.1 V VCCINT that differs from earlier Stratix II 1.2 V parts, so existing designs must update their power tree. JTAG pins (TCK, TMS, TDI, TDO) require 4.7 kohm pull-ups to VCCPD for reliable configuration; missing pull-ups cause intermittent configuration failures. According to Stratix III errata, certain 18x18 multiplier configurations exhibit unexpected rounding - read the errata document before finalising DSP-intensive designs. Do not enable unused transceivers in firmware as they consume quiescent power even when idle.
Compliance Information
Lead-free and RoHS compliant per Intel/Altera product declarations. AEC-Q100 not qualified - this is an FPGA, not an automotive discrete. NRND by Intel for the Stratix III family overall.
