EP3SL200H780I3 vs EP3SL200H780I4L Comparison
Detailed side-by-side comparison of EP3SL200H780I3 by Intel and EP3SL200H780I4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SL200H780I3 | EP3SL200H780I4L |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7,980.00 | $1,395.00 |
| Series | Stratix III L | β |
| Family | Stratix III | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | β |
| Total RAM Bits | 10,901,504 (10,900 Kb) | β |
| User I/O Count | 488 | β |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | β |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | β |
| PLLs | 12 | β |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | β |
| Maximum Operating Frequency | 717 MHz | β |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Package | 780-BBGA, FCBGA (HBGA-780) | 780-pin FC-HFBGA (Flip-Chip) |
| Mounting Type | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | β |
| Lead-Free / RoHS | Compliant (lead-free) | β |
| Logic Array Blocks (LABs) | β | 8,000 |
| Embedded Memory (Bits) | β | 10,901,504 |
| Maximum User I/O | β | 488 |
| Core Supply Voltage | β | 0.86 V to 1.15 V |
| Internal Performance | β | 375 MHz |
| Transceivers | β | Up to 24 channels |
| Transceiver Data Rate | β | Up to 6.375 Gbps |
| DSP Blocks | β | 9x9 / 18x18 / 36x36 multipliers |
| Memory Interface Support | β | DDR3, DDR2, DDR, QDR II+, RLDRAM II |
| JTAG Support | β | IEEE Std 1149.1 Boundary-Scan |
| RoHS Status | β | Compliant |
| Speed Grade | β | I4 (Industrial) |
| HardCopy Support | β | Compatible (Lattice-style migration path via HardCopy III) |