EP3SL200H780I3N vs EP3SL200H780C3N Comparison

Detailed side-by-side comparison of EP3SL200H780I3N by Intel and EP3SL200H780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780I3N EP3SL200H780C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $7,200.00 $4,995.00
Family Stratix III L Stratix III L (low-power)
Logic Elements 200,000 200,000
RAM Bits 10,901,504 β€”
User I/O 488 β€”
Package 780-BBGA, FCBGA 780-Ball FCBGA (HBGA), 29 x 29 mm
Package Pin Count 780 β€”
Mounting Type Surface Mount Surface Mount
Operating Temperature -40C to +100C (Industrial) 0C to +85C (commercial)
Supply Voltage (Core) 0.9 V β€”
Technology CMOS, 40 nm β€”
Process Node 40 nm 40 nm
Number of Terminals 780 β€”
Case / Package Code BGA-780 β€”
RoHS Status Compliant β€”
Lead-Free Yes β€”
Embedded Memory Bits β€” 10,901,504 bits
Logic Array Blocks (LABs) β€” 8,000
User I/Os β€” 488
Maximum Internal Clock Frequency β€” 800 MHz
Transceivers β€” 24 channels, up to 3.75 Gbps
DSP Blocks β€” 384
Speed Grade β€” C3 (commercial, -3 speed)
Voltage - Core β€” 0.9 V / 1.0 V (core, VCC)
Voltage - I/O β€” 1.2 V to 3.3 V (VCCIO banks)
MSL Level β€” 3
Lead-Free / RoHS β€” Yes
Mounting Pitch β€” 1.0 mm ball pitch
PLLs β€” 12 (Stratix III PLL array)
Configuration β€” JTAG IEEE Std 1149.1, passive/active serial

Datasheets & Resources

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