EP3SL200H780I4N vs EP3SL200H780I4 Comparison

Detailed side-by-side comparison of EP3SL200H780I4N by Intel and EP3SL200H780I4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SL200H780I4N EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N ⚠ Last Time Buy

Specification Comparison

Parameter EP3SL200H780I4N EP3SL200H780I4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $4,750.00 $6,255.75
Series Stratix III L Stratix III L
Family Stratix III (Logic-rich variant) Stratix III
Logic Elements 200,000 β€”
Logic Array Blocks (LABs) 8,000 8000
Embedded Memory (bits) 10,901,504 β€”
User I/Os 488 β€”
Core Voltage 1.1 V (0.86 V to 1.15 V range) β€”
Process Technology 65 nm CMOS 65 nm CMOS
Fabric Frequency (typical) 450 MHz β€”
Speed Grade I4 I4 (industrial)
Operating Temperature Range -40C to +100C (industrial) β€”
Package 780-ball FCBGA (Flip-Chip BGA, FineLine) β€”
Mounting Type Surface Mount (BGA) β€”
Lead-Free Yes (suffix N) β€”
RoHS Status Compliant Compliant
Logic Elements (LE) β€” 200,000
Embedded Memory Bits β€” 10,901,504
User I/O Count β€” 488
DSP Multipliers (18x18) β€” 384
Voltage - Core Supply β€” 1.1 V
Package Type β€” 780-BBGA / FCBGA (FC-HFBGA)
Package Dimensions β€” 33 mm x 33 mm
Operating Junction Temperature β€” -40C to +100C (industrial)
Configuration Memory β€” SRAM-based, volatile
Design Tool β€” Quartus II (legacy) / Quartus Prime

Datasheets & Resources

Browse All Products Create BOM Request Quote