EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel
MPN: EP3SL200H780I4N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5800 | $5,800.00 |
| 10 | $5520 | $55,200.00 |
| 50 | $5260 | $263,000.00 |
| 100 | $5000 | $500,000.00 |
| 500 | $4750 | $2,375,000.00 |
EP3SL200H780I4N Overview
What is a Stratix III FPGA? The Stratix III family is a high-performance FPGA platform from Altera/Intel that delivers a logic, memory, DSP, and I/O fabric in a single reprogrammable device. FPGAs in this hierarchy are programmable semiconductors that sit alongside ASICs, microcontrollers, and processors; designers implement custom logic by configuring on-chip look-up tables (LUTs), embedded memory blocks (M9K/M144K), DSP blocks, and PLLs. The Stratix III family specifically introduced a 'logic-rich' variant ('L') that doubles on-chip memory relative to earlier Stratix generations, enabling large FIFO and packet-buffer implementations without external SRAM.
The EP3SL200H780I4N variant carries the 'I4' speed grade and 'N' lead-free suffix, indicating an industrial temperature range (typically -40C to +100C) suitable for telecom, aerospace, and ruggedized industrial systems. The 'L' suffix denotes the logic-rich variant, and the part number encodes 488 user I/Os, a 780-pin FineLine BGA with flip-chip die attach, and 8,000 logic array blocks (LABs). Transceiver count, PLL count, and global clock network details are device-specific and should be confirmed against the manufacturer datasheet.
Performance highlights of this device class include up to 450 MHz core fabric performance, dedicated 18x18 multipliers and hardware DSP blocks that can be cascaded into higher-precision filters, and Programmable Power Technology that reduces dynamic power on quiescent logic. The 780-ball FCBGA package uses flip-chip land-grid construction with an integrated heat spreader lid, providing a thermal envelope compatible with forced-air and conduction-cooled system designs when correctly mounted.
Typical applications for the EP3SL200H780I4N include high-throughput packet processing in network switches and routers, ASIC and ASSP prototyping for CPU subsystems and image-pipeline designs, software-defined radio baseband processing, military/aerospace signal intelligence, medical imaging accelerators, and test-and-measurement instrumentation requiring deep logic and memory parallelism. The Stratix III L family was broadly deployed in early-2010s high-end wireline and wireless infrastructure, including 40G/100G Ethernet line cards and LTE baseband pre-prototyping.
When designing with the EP3SL200H780I4N, ensure that PCB layout follows Altera's High-Speed Board Design guidelines: matched-length differential pairs for DDR2/DDR3 memory interfaces, controlled-impedance (typically 50 ohm single-ended / 100 ohm differential) routing for clock and global signals, and a minimum of 6 PCB layers with continuous reference planes. Power-rail decoupling requires bulk capacitors near each VCORE/VCCIO supply pin plus high-frequency MLCCs placed within 100 mil of the BGA balls. Quartus II (or its successor) is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, same-package drop-in variants within the Stratix III family, and practical design notes that complement the manufacturer datasheet.
Drop-in alternatives for EP3SL200H780I4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL200H780I4N (same form factor and footprint) β differing in Speed Grade, Package, Family, Operating Temperature, Package Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL200H780I4LN
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1280 / Unit
View Datasheet βEP3SL200H780I4L
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1395 / Unit
View Datasheet βEP3SL200H780I4
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$6255.75 / Unit
View Datasheet βEP3SL200H780I3N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$7200 / Unit
View Datasheet βEP3SL200H780C4LN
β Drop-Inβ In Stock
$1145 / Unit
View Datasheet βEP3SL200H780C3N
β Drop-Inβ In Stock
$4995 / Unit
View Datasheet βEP3SL200H780I4N Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Family | Stratix III (Logic-rich variant) |
| Logic Elements | 200,000 |
| Logic Array Blocks (LABs) | 8,000 |
| Embedded Memory (bits) | 10,901,504 |
| User I/Os | 488 |
| Core Voltage | 1.1 V (0.86 V to 1.15 V range) |
| Process Technology | 65 nm CMOS |
| Fabric Frequency (typical) | 450 MHz |
| Speed Grade | I4 |
| Operating Temperature Range | -40C to +100C (industrial) |
| Package | 780-ball FCBGA (Flip-Chip BGA, FineLine) |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free | Yes (suffix N) |
| RoHS Status | Compliant |
EP3SL200H780I4N 780-ball fcbga (flip-chip bga, fineline) Pin Configuration Guide
Pin configuration for EP3SL200H780I4N (780-ball fcbga (flip-chip bga, fineline) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL200H780I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL200H780I4N is suitable for 6 applications: High-Speed Network Switch / Router Line Card, ASIC and ASSP Prototyping Platform, Software-Defined Radio Baseband Processing, Military and Aerospace Signal Intelligence, Medical Imaging Accelerator, Test and Measurement Instrumentation.
High-Speed Network Switch / Router Line Card
The EP3SL200H780I4N's 200K logic elements and 10.9 Mbits of embedded memory make it well suited to 40G/100G Ethernet line-card forwarding engines, where deep packet buffers and parallel lookup tables are required. Its 488 user I/Os can fan out to multiple SFP+/QSFP cages plus an external TCAM or DDR3 buffer pool. The 65 nm low-power architecture and programmable power technology reduce dynamic power on idle packet paths, which is critical for thermal-limited 1U switch designs. The 780-ball FCBGA exposes enough high-speed LVDS/HSMC lanes for serializer/deserializer interfaces.
Recommended
ASIC and ASSP Prototyping Platform
With 200K logic elements and abundant M144K memory blocks, the EP3SL200H780I4N serves as a high-density prototyping vehicle for ASIC and ASSP designs targeting wireline, image processing, or DSP workloads. Engineers map RTL across the Stratix III fabric, use the embedded M9K/M144K blocks to mimic SRAM macros, and validate timing closure before tape-out. The 780-ball FCBGA's 1.0 mm or finer ball pitch supports the high I/O count required to break out every prototype interface to physical connectors. Quartus II synthesis and incremental compile flows shorten iteration cycles.
Recommended
Software-Defined Radio Baseband Processing
The EP3SL200H780I4N's 18x18 hardware multipliers and DSP blocks allow efficient implementation of LTE, WiMAX, and proprietary baseband modems in software-defined radio architectures. Its 450 MHz fabric performance supports real-time FFT and channelization at 20 MHz LTE bandwidth, while the 10.9 Mbits of on-chip memory hold coefficient tables and small FIFOs without external SRAM access. Industrial temperature rating and the rugged FCBGA package suit outdoor small-cell base stations. The 488 I/Os route CPRI or OBSAI framer links plus JTAG and debug buses.
Recommended
Military and Aerospace Signal Intelligence
The industrial -40C to +100C operating range, lead-free 780-ball FCBGA construction, and 200K logic-element density make the EP3SL200H780I4N a fit for ruggedized signal-intelligence and electronic-warfare subsystems. The high logic count supports multi-channel digital receivers with on-chip FFT, channelization, and demodulation. The flip-chip FCBGA package provides excellent thermal performance under conduction-cooled cold-plate mounting. Designers pair the device with ruggedized DDR2/DDR3 SO-DIMM memory and radiation-mitigation scrubbing firmware for high-altitude or space applications.
Recommended
Medical Imaging Accelerator
The EP3SL200H780I4N is well matched to CT, MRI, and ultrasound image-pipeline accelerators that need parallel DSP throughput with deterministic latency. With 200K logic elements, hardware multipliers, and 10.9 Mbits of embedded memory, the device can implement real-time beamformers, back-projection, and image reconstruction kernels without external ASIC assistance. Industrial temperature rating supports the equipment-room environment. The 488 user I/Os carry multi-channel LVDS data from analog front-ends plus a PCIe or Camera Link host interface for image-data upload.
Recommended
Test and Measurement Instrumentation
The EP3SL200H780I4N powers high-end oscilloscopes, logic analyzers, and protocol testers where deep state machines, parallel DSP, and high I/O bandwidth are mandatory. The 200K logic elements implement deep trigger sequencers and protocol decoders for standards like USB 3.0, PCIe Gen2, or 10 GbE. Embedded memory blocks store up to 10.9 Mbits of acquisition samples for pre-trigger capture. Industrial temperature rating suits bench, portable, and ATE-deployed testers. Quartus II SignalTap logic analyzer tools leverage the same JTAG chain for runtime debugging.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL200H780I4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL200H780I4LN | EP3SL200H780I4L | EP3SL200H780I3N | EP3SL200H780C4LN |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FCBGA | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Speed Grade | I4 (industrial, mid) | I4L | I4L | I3 (slower) | C4L (commercial) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (commercial) |
| User I/Os | 488 | 488 | 488 | 488 | 488 |
| Embedded Memory (bits) | 10,901,504 | 10,901,504 | 10,901,504 | 10,901,504 | 10,901,504 |
| Lead-Free Finish | Yes (suffix N) | Yes | Yes | Yes | Yes |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Key Differentiators
- Highest logic density in the Stratix III L family (vs EP3SL150F1152I3N)
- Largest embedded memory capacity at 780-ball FCBGA (vs EP3SE260H780I4N)
- Industrial temperature in the 780-ball package (vs EP3SL200H780C3N)
- Drop-in compatible with all 780-ball FCBGA Stratix III L variants (vs Stratix IV migration (EP4SE230F29))
Design Notes
Estimated: the 780-ball FCBGA's ~1.0 mm ball pitch requires a minimum 6-layer PCB with continuous ground and power reference planes beneath the device footprint. Use 50 ohm single-ended / 100 ohm differential controlled impedance for high-speed LVDS pairs and clock traces, with via-in-pad micro-via construction recommended for BGA break-out. Place decoupling capacitors (0.1 uF MLCC plus 10 uF bulk) within 100 mil of each VCORE/VCCIO ball cluster. Reference the Altera Stratix III High-Speed Board Design Guidelines for full impedance and stackup recommendations.
The EP3SL200H780I4N requires a sequenced multi-rail supply (typically 1.1 V VCORE, 1.1/1.2/1.5/1.8/2.5/3.3 V VCCIO, and 2.5 V VCCA_PLL) with monotonic ramp-up per the Stratix III Power Management chapter. Use a controller with programmable soft-start (such as the LTM4677 or ISL63876) to enforce the recommended 0.2-50 ms ramp range. Each VCORE ball cluster needs at least one 0.1 uF MLCC plus one 22 uF bulk capacitor; VTT termination for DDR interfaces must sink/source up to several amps during burst writes.
Estimated: at 200K LE utilization with moderate toggle rates (~20%), the 780-ball FCBGA may dissipate 5-12 W. The package's integrated heat spreader lid allows direct attachment of a heat sink or cold plate via thermal interface material. For forced-air cooling at 1-2 m/s, a finned aluminum heat spreader is typically adequate; for conduction-cooled sealed enclosures, a copper cold plate is recommended. Always validate with a thermal simulation that the junction temperature stays below 100C at industrial corners.
Common pitfalls when designing with the EP3SL200H780I4N include (1) failing to configure unused I/O banks to a known state via the Quartus device options (floating banks can draw excess current), (2) ignoring the MSEL pin settings required to select the configuration scheme (AS, PS, JTAG, or FPP), and (3) under-provisioning the POR delay, which can cause configuration failure on cold-boot. Always run a full Quartus timing analysis with multi-corner multi-mode (Slow 85C, Fast 0C) before committing the bitstream, and verify the JTAG chain integrity at board bring-up.
Compliance Information
RoHS compliance and lead-free terminal finish indicated by the 'N' suffix in the MPN. REACH, halogen-free, and conflict-minerals status were not specified in the verified web data - set to 'unknown' rather than assumed. AEC-Q100 is not applicable as this is a commercial/industrial FPGA, not an automotive-grade IC.
