EP3SL340F1760I3 vs EP3SL340F1760I3N Comparison
Detailed side-by-side comparison of EP3SL340F1760I3 by Intel and EP3SL340F1760I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 β Last Time BuySpecification Comparison
| Parameter | EP3SL340F1760I3 | EP3SL340F1760I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,450.00 | $3,150.00 |
| Series | Stratix III L | β |
| Logic Elements | 337,500 LE | 337,500 |
| LABs (Logic Array Blocks) | 13,500 | β |
| Embedded Memory Bits | 18,822,144 bit | 18,821,144 bits |
| User I/Os | 1120 | β |
| Number of Pins / Balls | 1760 | β |
| Package Type | FC-FBGA (1760-ball, FineLine BGA) | β |
| Package Code | BGA1760, 42x42, 40 | β |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm CMOS |
| Operating Temperature | -40 Β°C to 100 Β°C (Industrial grade, I3 suffix) | -40C to +100C (Industrial) |
| Speed Grade | I3 (Industrial, mid-speed bin) | I3 |
| Mounting Type | Surface Mount | β |
| RoHS Status | Compliant (Pb-free BGA balls) | Compliant |
| Configuration Memory | SRAM-based, volatile (requires external configuration device) | β |
| Transceivers | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] | β |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | β |
| PLLs | [DATA_NEEDED: PLL count] | β |
| MSL Level | MSL3 (JEDEC J-STD-020, reflow 245 Β°C peak) | β |
| Family | β | Stratix III L |
| Logic Array Blocks (LABs) | β | 13,500 |
| Maximum User I/O | β | 1120 |
| Package | β | 1760-ball FC-FBGA (Flip-Chip BGA) |
| Ball Pitch | β | 1.0 mm |
| Configuration Method | β | JTAG / Serial / Parallel |
| Lead-Free | β | Yes |
| Design Software | β | Quartus II (legacy) |