Intel

EP3SL340F1760I3N - Stratix III L FPGA, 337.5K LEs, 1760-BGA | Intel

MPN: EP3SL340F1760I3N ✗ End of Life

In Stock Ships in 1-3 business days

1.1 V Vdss 1760-ball FC-FBGA (Flip-Chip BGA) Package I3 Speed 18,821,144 bits Memory

From $3150 USD / Unit

MOQ: 1 |

Price updated: 2026-09-09

Volume Pricing

Qty	Unit Price	Extended
1	$4200	$4,200.00
10	$3990	$39,900.00
100	$3700	$370,000.00
500	$3450	$1,725,000.00
1,000	$3150	$3,150,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

EP3SL340F1760I3N Overview

The Intel (formerly Altera) EP3SL340F1760I3N is a high-density, low-power member of the Stratix III L FPGA family, integrating 337,500 logic elements in a 1760-ball Flip-Chip BGA (FC-FBGA) package and fabricated on a 65 nm process node. The device operates at a core voltage of 1.1 V and supports user I/O counts up to 1120, with up to 18,822,144 bits of embedded memory and 13,500 logic array blocks (LABs) per the manufacturer ordering information. Per DigiKey catalog data the device is qualified for industrial temperature operation and ships in lead-free packaging.

An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit that combines programmable logic blocks, routing interconnect, and dedicated hard IP such as memory blocks, DSP blocks, and high-speed transceivers. Within Intel's portfolio, the Stratix III L family sits in the high-density, low-power segment, designed for applications that require very large gate counts but where dynamic power must be minimized. The L variant extends the Stratix III architecture with programmable power technology that lets unused regions be powered down at fine granularity, lowering both static and dynamic consumption compared with the standard Stratix III family.

Key features of the EP3SL340F1760I3N include 337,500 logic elements, 18,822,144 embedded memory bits, support for up to 1120 general-purpose I/O pins arranged across multiple I/O banks, and integrated DSP blocks for high-throughput signal processing. The 1760-ball FCBGA package exposes the full user-I/O and high-speed serial interface count and is suited to backplane-style boards where signal integrity and density are critical. Configuration is via standard JTAG, serial, or parallel modes and the device supports the Altera/Intel Quartus II design flow.

Architecturally, the device uses 65 nm CMOS with hard IP for memory, DSP, and transceiver blocks; this hybrid fabric delivers deterministic performance for parallel DSP pipelines while keeping logic utilization flexible. Compared with previous-generation Stratix II parts, Stratix III L improves logic density, reduces dynamic power by roughly 50 percent at the same performance, and adds the programmable-power capability for fine-grained power gating.

Typical applications include high-performance digital signal processing in radar and software-defined radio, ASIC prototyping, high-speed protocol bridging such as PCIe Gen2 and Serial RapidIO, industrial imaging and video processing, and military/aerospace signal processing where the device's large logic and memory budget is required. The 1760-BGA package is the largest in the Stratix III L family and is selected when the design needs the maximum I/O and transceiver count.

When designing with this part, ensure the PCB BGA layout supports the 1 mm ball pitch, that all power rails (VCC, VCCPD, VCCIO per bank) are properly decoupled, and that thermal management accounts for the device's possible high power dissipation under heavy utilization. Quartus II software with the appropriate device license is required for synthesis, place-and-route, and timing closure.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for EP3SL340F1760I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3SL340F1760I3N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Embedded Memory Bits, RoHS Status.

EP3SL340F1760C2

Intel

Package: 1760-ball FCBGA (FineLine BGA)

Operating Temperature: 0C to +85C (Commercial, C2 suffix)