EP3SL340F1760I3N vs EP3SL340F1760I3 Comparison

Detailed side-by-side comparison of EP3SL340F1760I3N by Intel and EP3SL340F1760I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SL340F1760I3 EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel

EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel

EP3SL340F1760I3 ⚠ Last Time Buy

Specification Comparison

Parameter EP3SL340F1760I3N EP3SL340F1760I3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $3,150.00 $1,450.00
Family Stratix III L β€”
Logic Elements 337,500 337,500 LE
Logic Array Blocks (LABs) 13,500 β€”
Embedded Memory Bits 18,821,144 bits 18,822,144 bit
Maximum User I/O 1120 β€”
Process Technology 65 nm CMOS 65 nm
Core Voltage 1.1 V 1.1 V
Package 1760-ball FC-FBGA (Flip-Chip BGA) β€”
Ball Pitch 1.0 mm β€”
Operating Temperature -40C to +100C (Industrial) -40 Β°C to 100 Β°C (Industrial grade, I3 suffix)
Speed Grade I3 I3 (Industrial, mid-speed bin)
Configuration Method JTAG / Serial / Parallel β€”
RoHS Status Compliant Compliant (Pb-free BGA balls)
Lead-Free Yes β€”
Design Software Quartus II (legacy) β€”
Series β€” Stratix III L
LABs (Logic Array Blocks) β€” 13,500
User I/Os β€” 1120
Number of Pins / Balls β€” 1760
Package Type β€” FC-FBGA (1760-ball, FineLine BGA)
Package Code β€” BGA1760, 42x42, 40
Mounting Type β€” Surface Mount
Configuration Memory β€” SRAM-based, volatile (requires external configuration device)
Transceivers β€” [DATA_NEEDED: transceiver count and data rate for this F1760 variant]
DSP Blocks β€” [DATA_NEEDED: 18x18 multiplier count]
PLLs β€” [DATA_NEEDED: PLL count]
MSL Level β€” MSL3 (JEDEC J-STD-020, reflow 245 Β°C peak)

Datasheets & Resources

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