EP3SL50F780C3 vs EP3SL70F780C3 Comparison

Detailed side-by-side comparison of EP3SL50F780C3 by Intel and EP3SL70F780C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL50F780C3 EP3SL70F780C3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $540.00 $780.00
Family Stratix III L (low-power) Stratix III
Series Stratix III Stratix III L
Logic Elements 47,500 β€”
Logic Array Blocks (LABs) 1,900 2,700
Embedded Memory Bits 2,184,192 β€”
User I/Os 488 β€”
Package Type 780-BBGA, FCBGA (FineLine) β€”
Device Pin Count 780 β€”
Operating Temperature 0C to +85C (Commercial) β€”
Speed Grade 3 C3
Supply Voltage (Core) [DATA_NEEDED: VCCINT nominal value] β€”
PLLs 12 β€”
Global Clock Networks 24 β€”
Process Node 65 nm TSMC β€”
Configuration Method SRAM-based, supports Partial Reconfiguration β€”
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Lead-Free / Halogen-Free Lead-Free (per package marking); Halogen-Free status unknown β€”
Moisture Sensitivity Level (MSL) MSL3 (per JEDEC J-STD-020, typical for large FBGA) β€”
Logic Elements (LE) β€” 67,500
Embedded Memory (bits) β€” 2,699,264
User I/O Count β€” 488
Number of I/O Banks β€” [DATA_NEEDED: number of I/O banks]
Number of Pins / Balls β€” 780
Package β€” 780-BBGA, FC-FBGA
Mounting Type β€” Surface Mount
Process Technology β€” 65 nm
Core Voltage (VCCINT) β€” 1.1 V
Maximum Internal Clock Frequency β€” 500 MHz
Operating Temperature Range β€” 0Β°C to 85Β°C (commercial)
Design Software β€” Quartus II (last supported v13.1)

Datasheets & Resources

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