EP3SL70F780C3 - Stratix III L FPGA, 67.5K LE, 488 I/O, 780-BGA | Intel
MPN: EP3SL70F780C3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1145.29 | $1,145.29 |
| 10 | $1080 | $10,800.00 |
| 100 | $980 | $98,000.00 |
| 500 | $870 | $435,000.00 |
| 1,000 | $780 | $780,000.00 |
EP3SL70F780C3 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP (DSP blocks, M9K/M144K memory, PLLs, transceivers) that the designer configures via an HDL bitstream. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs in capacity and below ASICs in unit cost, and are widely used for parallel DSP, high-speed serial I/O, and ASIC prototyping in the broader taxonomy of programmable logic devices (PLDs) within digital semiconductors.
Key features of the EP3SL70F780C3 include support for up to 12 transceivers depending on the die variant, dedicated DSP blocks for high-throughput arithmetic, on-chip termination (OCT), and the Quartus II design software ecosystem. The 780-pin FC-FBGA package offers a compact footprint for high-I/O designs while providing robust thermal dissipation through the flip-chip BGA construction. The 'C3' speed grade designates a commercial temperature range with a specific performance bin, balancing speed and power for non-extreme environments.
The Stratix III L architecture leverages adaptive logic modules (ALMs) instead of traditional 4-input LUTs, yielding up to 25% higher performance and lower dynamic power versus prior Stratix generations. Hard IP such as PCI Express hard IP blocks, external memory interfaces (DDR2/DDR3), and dedicated PLLs are embedded directly in silicon, freeing programmable fabric and reducing latency for memory-intensive and serial-protocol designs.
Typical applications include ASIC prototyping, high-speed digital signal processing (DSP), high-end communications infrastructure, video processing and image acceleration, and test and measurement instrumentation. The 488 user I/Os make it suitable for memory-rich and parallel data-path designs that interface with DDR2/DDR3 SDRAM, QDRII+ SRAM, and RLDRAM II memories.
When designing with this part, ensure proper power-rail sequencing (1.1 V VCCINT before VCCIO), adequate PCB stackup for multi-Gbps transceivers, and the use of the Quartus II design toolchain (the last supported major release is Quartus II v13.1). The 'C3' commercial speed grade is appropriate for lab and production environments operating between 0°C and 85°C junction.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III and Stratix III L families, and design considerations not aggregated on any single distributor page.
Drop-in alternatives for EP3SL70F780C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL70F780C3 (same form factor and footprint) — differing in Family, Package, Operating Temperature, Speed Grade, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL70F780C3N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP3SL70F780C4N
✅ Drop-In✓ In Stock
$1210 / Unit
View Datasheet →EP3SL70F780C4L
✅ Drop-In✓ In Stock
$944.74 / Unit
View Datasheet →EP3SL50F780C3
✅ Drop-In✓ In Stock
$540 / Unit
View Datasheet →EP3SE50F780C3
✅ Drop-In✓ In Stock
$890 / Unit
View Datasheet →EP3SL110F780C3
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP3SL70F780C3 Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Family | Stratix III |
| Logic Elements (LE) | 67,500 |
| Embedded Memory (bits) | 2,699,264 |
| Logic Array Blocks (LABs) | 2,700 |
| User I/O Count | 488 |
| Number of Pins / Balls | 780 |
| Package | 780-BBGA, FC-FBGA |
| Mounting Type | Surface Mount |
| Process Technology | 65 nm |
| Core Voltage (VCCINT) | 1.1 V |
| Maximum Internal Clock Frequency | 500 MHz |
| Operating Temperature Range | 0°C to 85°C (commercial) |
| Speed Grade | C3 |
| Design Software | Quartus II (last supported v13.1) |
EP3SL70F780C3 780-bbga, fc-fbga Pin Configuration Guide
Pin configuration for EP3SL70F780C3 (780-bbga, fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL70F780C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL70F780C3 is suitable for 6 applications: ASIC Prototyping and Validation, High-Throughput Digital Signal Processing, Communications Protocol Bridging, Video and Image Processing, Test and Measurement Instrumentation, Industrial Control and Motor Drive.
ASIC Prototyping and Validation
The EP3SL70F780C3 is widely used as an ASIC prototyping vehicle because its 67,500 logic elements, 2,700 LABs, and 2.7 Mbit embedded memory provide sufficient capacity to map mid-complexity ASIC RTL (typically 1-2 million gates). Quartus II 13.1 supports industry-standard VHDL/Verilog synthesis plus the Synplify and Precision tools. The 488 user I/Os allow direct mapping of wide on-chip buses and external ASIC pin pads, while dedicated DDR2/DDR3 memory controllers interface to real SDRAM during bring-up. Compared with using a smaller FPGA, the EP3SL70F780C3 reduces multi-FPGAbrication partitioning risk and accelerates time-to-prototype for telecom, networking, and storage ASICs.
Recommended
High-Throughput Digital Signal Processing
The Stratix III L architecture integrates dedicated DSP blocks that deliver up to several hundred GMACS of fixed- and floating-point arithmetic, and the EP3SL70F780C3 inherits this DSP density in the 67.5K LE class. Per the Stratix III device handbook, each DSP block supports 18x18 or 9x9 multiplication, summation chains, and pre-adders, enabling efficient FIR filters, FFTs, and matrix multiplications. The 2.7 Mbit embedded memory provides data buffering between DSP stages. The 488 user I/Os and high-speed LVDS pairs allow direct connection to multi-channel ADC/DAC front ends used in radar, software-defined radio, and medical imaging DSP pipelines.
Recommended
Communications Protocol Bridging
The EP3SL70F780C3 supports bridging between telecom protocols (SONET/SDH, OTN, Ethernet, RapidIO) by leveraging its 488 user I/Os to drive multiple backplane interfaces simultaneously. Dedicated hard IP for PCI Express Gen1/Gen2, Gigabit Ethernet MACs, and external memory interfaces reduces fabric usage for protocol termination. The 780-FBGA package provides the high pin count required for parallel backplane buses plus multiple SFP+/CPRI serial links. According to the Stratix III handbook, the device supports up to 1.25 Gbps LVDS pairs without external SERDES, ideal for telecom line-card designs.
Recommended
Video and Image Processing
Video processing systems require wide data paths and high memory bandwidth, both of which the EP3SL70F780C3 delivers. The 488 user I/Os accept multi-channel video streams (Camera Link, DVI/HDMI bridges, BT.1120, SDI) while the dedicated DDR2/DDR3 controllers sustain pixel buffering at 1080p60 and beyond. Per the Stratix III handbook, the embedded M9K and M144K memory blocks act as line buffers, frame stores, and motion-estimation caches. The 67.5K LE fabric is sufficient for deinterlacing, scaling, color-space conversion, and overlay functions in broadcast and surveillance video systems.
Recommended
Test and Measurement Instrumentation
Test and measurement equipment benefits from the EP3SL70F780C3's high logic density and abundant memory. The FPGA can implement deep pattern generators, real-time protocol analyzers, arbitrary waveform generators, and digital oscilloscope acquisition front ends. The 488 user I/Os support LVDSEXTEMPE/ECL/PECL logic standards, and the dedicated PLLs provide precise multi-channel clocking for time-interleaved ADCs. According to the Stratix III handbook, the embedded DSP blocks accelerate FFT-based spectrum analysis, while M9K blocks store capture buffers. The commercial 0-85°C temperature grade suits laboratory and benchtop environments.
Recommended
Industrial Control and Motor Drive
The EP3SL70F780C3 fits industrial control applications requiring deterministic real-time response with multiple motor axes. Its 488 user I/Os accept parallel encoder feedback (incremental, SSI, EnDat) plus drive-protection signals, while the dedicated DSP blocks execute field-oriented control (FOC), space-vector PWM, and adaptive filtering at high switching frequencies. The Stratix III handbook highlights the LVDS and differential I/O banks for noise-immune encoder reception in factory environments. The commercial 0-85°C operating range suits enclosed control cabinets, and the 1.1 V core plus 780-FBGA flip-chip package provides adequate thermal headroom for continuous multi-axis control.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL70F780C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL70F780C3N | EP3SL70F780C4N | EP3SL70F780C4L | EP3SL50F780C3 | EP3SE50F780C3 |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (FC-FBGA) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 33,000 | ~48,000 |
| Speed Grade | C3 | C3 | C4 (faster) | C4 (faster) | C3 | C3 |
| User I/O Count | 488 | 488 | 488 | 488 | 488 | 488 |
| Lead-Free / RoHS | Not lead-free (legacy finish) | Lead-free | Lead-free | Lead-free | Not lead-free (legacy finish) | Not lead-free (legacy finish) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Mid-density Stratix III L with abundant user I/Os (vs EP3SL50F780C3)
- Lead-free RoHS drop-in equivalent available (vs EP3SL70F780C3N)
- Faster speed grade available in same package (vs EP3SL70F780C4N)
Design Notes
The Stratix III family requires sequenced power-rail startup: VCCINT (1.1 V) must reach stable regulation before VCCPD and VCCIO banks. Per the Stratix III handbook, use the dedicated power management ICs such as the Intel EN63A0A or LTM4628 to provide soft-start with monotonic rise; failing to sequence rails can cause inrush currents that trigger POR (Power-On-Reset) and prevent configuration. Decoupling must include 0.1 µF and 10 µF ceramic capacitors within 5 mm of each power pin, plus bulk decoupling on each supply rail.
Estimated: the 780-FBGA package has a typical ball pitch of 1.0 mm, requiring a 4-6 layer PCB stackup with microvia (laser-drilled) technology for inner-row escape. The flip-chip BGA thermal pad connects to internal ground planes through thermal vias (0.2-0.3 mm diameter, 1 mm pitch) to dissipate the 65 nm FPGA's ~5-8 W typical power. High-speed transceiver pairs must be length-matched within 150 µm and routed over a continuous reference plane to maintain 100 Ω differential impedance.
Common pitfalls when designing with the EP3SL70F780C3: (1) do not use Quartus Prime - only Quartus II 13.1 SP1 or earlier supports Stratix III compilation; (2) the configuration mode (AS, AP, FPP, JTAG) must be selected via MSEL pins at board design time and cannot be changed in the field; (3) LVDS I/O standards require specific bank VCCIO voltages (2.5 V for LVDS) and bank VREF for SSTL/HSTL; (4) the 65 nm process is sensitive to power-rail noise, so dedicated LDO regulation rather than POL sharing is recommended for VCCINT.
Estimated: typical power dissipation for the EP3SL70F780C3 at 500 MHz toggle rates ranges from 3-6 W depending on logic utilization, with worst-case power around 8 W. The 780-FBGA flip-chip package provides theta-JA of approximately 8-12 C/W with proper thermal via array, allowing commercial 0-85°C operation at moderate utilization. Designers should use a thermal simulation tool (e.g., ANSYS IcePak or FloTHERM) to validate junction temperature, especially in sealed enclosures. Forced-air cooling is recommended for continuous high-utilization designs.
When laying out the 780-FBGA PCB escape, fan out inner balls to inner layers using microvias, while outer balls route on top/bottom layers with short traces to vias. Per Intel's BGA escape guidelines, separate digital I/O banks (VCCIO), transceiver channels, and PLL/clock pins to minimize crosstalk. Place the EPCS configuration memory (e.g., EPCS64SI16N) within 25 mm of the FPGA's MSEL/ASDATA pins to meet configuration timing. Add ground stitching vias every λ/20 along high-speed edges to suppress common-mode resonances.
Compliance Information
EP3SL70F780C3 uses legacy SnPb terminal finish and is NOT RoHS-compliant. The 'N' suffix variant EP3SL70F780C3N is the lead-free / RoHS-compliant drop-in equivalent. AEC-Q100 does not apply to commercial-grade FPGAs. REACH and conflict-minerals status inferred from Intel/Altera product compliance documentation; halogen-free status not explicitly stated for this part number.
