EP3SL70F780C3 vs EP3SL50F780C3 Comparison

Detailed side-by-side comparison of EP3SL70F780C3 by Intel and EP3SL50F780C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL70F780C3 EP3SL50F780C3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $780.00 $540.00
Series Stratix III L Stratix III
Family Stratix III Stratix III L (low-power)
Logic Elements (LE) 67,500 β€”
Embedded Memory (bits) 2,699,264 β€”
Logic Array Blocks (LABs) 2,700 1,900
User I/O Count 488 β€”
Number of I/O Banks [DATA_NEEDED: number of I/O banks] β€”
Number of Pins / Balls 780 β€”
Package 780-BBGA, FC-FBGA β€”
Mounting Type Surface Mount β€”
Process Technology 65 nm β€”
Core Voltage (VCCINT) 1.1 V β€”
Maximum Internal Clock Frequency 500 MHz β€”
Operating Temperature Range 0Β°C to 85Β°C (commercial) β€”
Speed Grade C3 3
Design Software Quartus II (last supported v13.1) β€”
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Logic Elements β€” 47,500
Embedded Memory Bits β€” 2,184,192
User I/Os β€” 488
Package Type β€” 780-BBGA, FCBGA (FineLine)
Device Pin Count β€” 780
Operating Temperature β€” 0C to +85C (Commercial)
Supply Voltage (Core) β€” [DATA_NEEDED: VCCINT nominal value]
PLLs β€” 12
Global Clock Networks β€” 24
Process Node β€” 65 nm TSMC
Configuration Method β€” SRAM-based, supports Partial Reconfiguration
Lead-Free / Halogen-Free β€” Lead-Free (per package marking); Halogen-Free status unknown
Moisture Sensitivity Level (MSL) β€” MSL3 (per JEDEC J-STD-020, typical for large FBGA)

Datasheets & Resources

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