EP3SL70F780C3G vs EP3SL70F780C4L Comparison

Detailed side-by-side comparison of EP3SL70F780C3G by Intel and EP3SL70F780C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL70F780C3G EP3SL70F780C4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $185.00 $944.74
Family Stratixยฎ III L โ€”
Series EP3SL70 Stratix III L
Logic Elements 67,500 โ€”
Embedded Memory 2,699,264 bits โ€”
Number of I/O 488 โ€”
Package 780-BBGA, FCBGA (29x29 mm) โ€”
Speed Grade -3 C4
Temperature Grade Commercial (0C to +85C) โ€”
Process Technology 40 nm 65 nm
Voltage - Supply 0.9 V, 1.1 V, 2.5 V โ€”
Mounting Type Surface Mount Surface Mount (BGA)
MSL Level 3 (168 hours) โ€”
RoHS Status Compliant โ€”
Lead-Free Yes โ€”
DSP Multipliers (18x18) 384 โ€”
PLL Count 4 โ€”
Global Clock Networks 12 โ€”
Configuration Method JTAG, Active Serial, Passive Serial JTAG, Passive Serial, FPP, external memory
Manufacturer โ€” Intel (formerly Altera)
Device Type โ€” FPGA - Field Programmable Gate Array
Logic Elements (LE) โ€” 67,500
Total Memory Bits โ€” 2,699,264 bits (~2.7 Mb)
Logic Array Blocks (LABs) โ€” 2,700
Maximum User I/O โ€” 488
Internal Frequency (max) โ€” [DATA_NEEDED: internal frequency]
Core Voltage (VCC) โ€” 0.9 V
Operating Temperature โ€” 0C to 85C (commercial)
Package Type โ€” 780-BBGA, FC-FBGA (Flip-Chip)
Lead Free / RoHS โ€” Yes (lead-free per BGA package)
Design Software โ€” Quartus II (Stratix III device support)

Datasheets & Resources

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