EP3SL70F780C4L - Stratix III L FPGA 67.5K LE 780-FBGA | Intel
MPN: EP3SL70F780C4L ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1475.82 | $1,475.82 |
| 10 | $1328.24 | $13,282.40 |
| 100 | $1180.65 | $118,065.00 |
| 500 | $1062.59 | $531,295.00 |
| 1,000 | $944.74 | $944,740.00 |
EP3SL70F780C4L Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined by the customer after manufacturing through a configuration bitstream. FPGAs sit at the top of the programmable logic device (PLD) hierarchy, alongside CPLDs, and belong to the broader category of logic ICs under integrated circuits. The Stratix III family was engineered specifically for low static and dynamic power consumption, making it suitable for high-throughput DSP, high-speed serial interfacing, and memory-intensive compute subsystems where ASIC NRE is not justified.
Key features of the EP3SL70F780C4L include 2700 Logic Array Blocks (LABs) organized around an adaptive logic module (ALM) fabric, dedicated DSP blocks for high-speed multiply-accumulate operations, embedded M9K and M144K memory blocks totaling approximately 2.7 Mb, and integrated transceivers and PLLs for clock management. The device supports high-speed external memory interfaces such as DDR3, QDRII+, and RLDRAM II, with PHY blocks hardened on-chip to simplify board design and reduce timing closure effort.
From an architectural standpoint, the Stratix III L FPGA uses programmable logic tiles with 8-input fracturable ALMs, fine-grained clock networks with up to 16 global clocks, and per-LAB control signals. The 65 nm low-power process, combined with programmable power technology that lets unused tiles enter low-leakage states, allows the EP3SL70F780C4L to balance performance versus quiescent current at a system level. Configuration is supported via JTAG, passive serial, fast passive parallel, and external memory controllers.
Typical applications for the EP3SL70F780C4L include high-speed data acquisition systems, wireless baseband processing, software-defined radio front-ends, military radar prototypes, medical imaging accelerators, and telecom line-card prototyping. The 488 user I/Os and rich transceiver count make it particularly well-suited as an FPGA-based ASIC prototype or as a production platform for low-volume high-complexity designs where mask charges would be prohibitive.
When designing with this part, engineers should follow Intel/Altera's Stratix III pin connection guidelines for unused pins, provide adequate decoupling across VCC, VCCL, VCCPT, VCCA_PLL, and VCCH_GXB rails, and consider thermal relief for the FC-FBGA substrate using the official thermal model. Quartus II design software is required for synthesis, place-and-route, and timing closure; bitstream security features such as AES-256 encryption should be enabled for production deployments.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP3SL70F780C4L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL70F780C4L (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, RoHS Status, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL70F780C4N
✅ Drop-In✓ In Stock
$1210 / Unit
View Datasheet →EP3SL70F780C4G
✅ Drop-In✓ In Stock
$835 / Unit
View Datasheet →EP3SL70F780C3N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP3SL70F780C3G
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP3SL70F780C3
✅ Drop-In✓ In Stock
$780 / Unit
View Datasheet →EP3SL70F780C2N
✅ Drop-In✓ In Stock
$139 / Unit
View Datasheet →EP3SL70F780C2G
✅ Drop-In✓ In Stock
$1185 / Unit
View Datasheet →EP3SL70F780C4L Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements (LE) | 67,500 |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) |
| Logic Array Blocks (LABs) | 2,700 |
| Maximum User I/O | 488 |
| Process Technology | 65 nm |
| Core Voltage (VCC) | 0.9 V |
| Speed Grade | C4 |
| Operating Temperature | 0C to 85C (commercial) |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) |
| Mounting Type | Surface Mount (BGA) |
| Lead Free / RoHS | Yes (lead-free per BGA package) |
| Configuration Method | JTAG, Passive Serial, FPP, external memory |
| Design Software | Quartus II (Stratix III device support) |
EP3SL70F780C4L 780-bbga, fc-fbga (flip-chip) Pin Configuration Guide
Pin configuration for EP3SL70F780C4L (780-bbga, fc-fbga (flip-chip) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL70F780C4L.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL70F780C4L is suitable for 7 applications: High-Speed Data Acquisition Systems, Software-Defined Radio Baseband, Telecom Line-Card Prototyping, Medical Imaging Accelerator, Military Radar Prototype, ASIC Prototype Emulation, Industrial Motor Control.
High-Speed Data Acquisition Systems
The EP3SL70F780C4L fits high-speed data acquisition systems because its 67,500 logic elements, 2.7 Mb embedded memory, and 488 user I/Os support multi-channel parallel ADC interfaces without external FIFOs. The hardened DSP blocks accelerate per-sample calibration math (gain/offset correction, FIR decimation) directly in the FPGA fabric. With Stratix III low static power, multi-board chassis systems stay thermally manageable, and the 780-FBGA's 1.0 mm pitch integrates cleanly on standard 6-8 layer PCBs. Per the Stratix III handbook, designers can achieve above 250 MSPS throughput with the on-chip M9K/M144K memory blocks buffering bursts.
Recommended
Software-Defined Radio Baseband
Software-defined radio (SDR) baseband processing maps well to the EP3SL70F780C4L's hardened DSP blocks and high I/O count. The 488 I/Os accept wide parallel digital front-end buses (e.g., dual 16-bit LVDS at hundreds of MHz), while the 2.7 Mb embedded memory is sufficient for FFT window buffers and channelizer coefficient tables. The 65 nm low-power Stratix III core enables air-cooled radios at moderate clock rates, and the integrated PLLs align ADC sampling with FPGA processing domains. Quartus II DSP Builder accelerates FFT and DDC IP development.
Recommended
Telecom Line-Card Prototyping
The EP3SL70F780C4L suits telecom line-card prototyping because Stratix III integrated transceivers (where populated) and high-pin-count BGA simplify framer/MAC/PCS prototyping. The C4 speed grade balances Fmax margin with cost-effective timing closure for 100 M to 1 G interfaces. The 0.9 V core and per-bank I/O voltage support (1.2-3.0 V) eases interfacing with legacy 3.3 V PHY devices without level shifters. Hot-swap friendly LVCMOS and LVDS options in the I/O banks also simplify mid-plane designs.
Recommended
Medical Imaging Accelerator
Medical imaging accelerators such as CT and ultrasound beamformers benefit from the EP3SL70F780C4L's parallel DSP fabric and embedded memory. The 488 I/Os aggregate multi-channel ADC data, while the 2,700 LABs enable parallel beamforming kernels with deterministic latency. The C4 speed grade is typically adequate for real-time image reconstruction at ultrasound frame rates. Stratix III low-power reduces heat near sensitive analog front ends, an important factor in bedside equipment where thermal noise can drift calibration.
Recommended
Military Radar Prototype
Military radar prototyping uses the EP3SL70F780C4L because the 67.5K LE capacity supports pulse-Doppler, SAR, and MTI algorithms in a single device. The 2.7 Mb embedded memory holds range-bin buffers and Doppler FFT scratchpads without external SRAM. For industrial-temperature deployments, design teams can migrate to the EP3SL70F780I4N variant (industrial grade) on the same PCB footprint. The 780-FBGA substrate also accepts underfill for vibration-prone airborne platforms.
Recommended
ASIC Prototype Emulation
ASIC prototype emulation is a classic use case for the EP3SL70F780C4L: 67,500 LE map directly to ASIC gate equivalents at a roughly 4:1 ratio, and the 488 user I/Os expose ample connections for chip-level testbench connectivity. Quartus II's incremental compile flows enable partition-by-partition bring-up of multi-million-gate ASICs. The 65 nm Stratix III core runs at ASIC-equivalent frequencies for functional validation, and the C4 speed grade gives margin for timing-driven prototyping of slower ASIC blocks.
Recommended
Industrial Motor Control
Industrial motor control and high-end drive systems use the EP3SL70F780C4L because the 488 I/Os support multi-axis PWM generation, encoder feedback (EnDat, BISS, resolver via companion IC), and high-speed fieldbus interfaces. The 2,700 LABs run FOC control loops, SVPWM modulators, and predictive maintenance DSP concurrently. Industrial temperature deployments can use the EP3SL70F780I4N variant directly on the same 780-FBGA footprint, simplifying inventory across product tiers.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL70F780C4L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL70F780C4N | EP3SL70F780C4G | EP3SL70F780C3N | EP3SL70F780C2N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-BBGA, FC-FBGA | 780-BBGA, FC-FBGA (same) | 780-BBGA, FC-FBGA (same) | 780-BBGA, FC-FBGA (same) | 780-BBGA, FC-FBGA (same) |
| Family | Stratix III L | Stratix III L (same) | Stratix III L (same) | Stratix III L (same) | Stratix III L (same) |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Memory Bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits |
| Speed Grade | C4 | C4 (same) | C4 (same) | C3 (slower) | C2 (faster) |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C (same) | 0C to 85C (same) | 0C to 85C (same) | 0C to 85C (same) |
| Terminal Finish | Lead-free (per L marking) | Lead-free, no lead-free symbol | Pb-free matte tin | Lead-free | Lead-free |
| Unit Price (qty 1, as of 2026-09-10) | ~$1,475.82 | ~$1,475 (similar) | ~$1,475 (similar) | ~$1,395 (typically slightly lower) | ~$1,580 (typically slightly higher) |
Key Differentiators
- Lead-free terminal finish with L marking for RoHS-compliance traceability (vs EP3SL70F780C4N)
- C4 speed grade offers better timing closure margin than C2 (vs EP3SL70F780C2N)
- Identical die and footprint to C3N enables seamless down-grade (vs EP3SL70F780C3N)
Design Notes
The EP3SL70F780C4L requires multiple rails: VCC (0.9 V core), VCCL/VCCPT (around 1.0 V), VCCA_PLL (1.2 V analog, low noise), VCCIO (1.2-3.0 V per bank), and VCCH_GXB (1.4 V for transceivers). Per Intel AN 514 (Stratix III Hardware Design), allocate 0.1 uF plus 10 uF bulk per rail, with the 0.1 uF cap placed within 100 mil of each VCC pin. Sequence VCCH_GXB before VCC to avoid in-rush damage. Use a sequencer IC or controller PMIC for multi-rail turn-on.
The 780-FBGA FC-FBGA package has a theta_JA in the 12-18 C/W range (still air, JEDEC JESD51 standard board). Estimated: with 70 percent utilization at 200 MHz core clock and typical Stratix III power-per-LE figures, dissipation can reach 6-8 W, putting junction rise around 100C above ambient at room temperature without airflow. A 1 m/s airflow or top-side heatsink is recommended for production builds. Use the Stratix III PowerPlay analyzer for accurate early estimates.
Lay out the 780-FBGA with 1.0 mm pitch micro-via-in-pad or stacked-micro-via fan-out, 6-8 layer stack-up, and continuous reference planes on Layers 2 and (N-1). Matched-length tuning for high-speed DDR3 interfaces should follow Intel's Stratix III External Memory Interface Handbook. Place transceiver (GXB) AC-coupling caps within 50 mil of the FPGA pin. BGA break-out should use 0.8-1.0 mm drill-to-pad diameters.
Do not leave dedicated pins (TDI, TMS, TCK, TDO, nCONFIG, nSTATUS, CONF_DONE, MSEL) floating during configuration - tie them to defined states per Intel AN 371. The MSEL pins select the configuration mode (AS, PS, FPP, JTAG) and must match your bitstream storage device. Configuration errors with hard-to-debug symptoms are commonly caused by MSEL strapping mistakes or insufficient configuration clock stability.
Differential pairs (LVDS, transceiver channels) should be routed with 100 ohm differential impedance and matched length within +/-10 mil for data, +/-50 mil for pairs within a bus. Keep LVDS away from noisy switching power nodes. Separate analog VCCA_PLL and digital VCC with a ferrite bead; place the PLL loop filter components within 50 mil of the corresponding PLL pins. Decoupling for VCCIO banks must remain within each bank footprint boundary.
Compliance Information
Lead-free terminal finish confirmed by L suffix in MPN. RoHS status per DigiKey product listing. REACH, halogen-free, and conflict-minerals data not explicitly stated in the verified web results - marked unknown.
