EP3SL70F780C3N vs EP3SL70F780C4L Comparison

Detailed side-by-side comparison of EP3SL70F780C3N by Intel and EP3SL70F780C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL70F780C3N EP3SL70F780C4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $198.00 $944.74
Series Stratix III L Stratix III L
Logic Elements 67,500 β€”
Adaptive Logic Modules (ALMs) 33,750 β€”
Embedded Memory Bits 2,699,264 bits (2.699 Mbit) β€”
Embedded Multipliers (18x18) 488 β€”
Maximum Operating Frequency 717 MHz β€”
Process Technology 65 nm CMOS 65 nm
Core Voltage 1.1 V β€”
Number of I/O Banks 8 β€”
Number of Pins 780 β€”
Package Type 780-ball FC-FBGA (29x29 mm) 780-BBGA, FC-FBGA (Flip-Chip)
Operating Temperature Range Commercial (0C to +85C) β€”
Mounting Type Surface Mount Surface Mount (BGA)
RoHS Status Compliant (lead-free FBGA) β€”
MSL Level 3 (per JEDEC J-STD-020) β€”
Manufacturer β€” Intel (formerly Altera)
Device Type β€” FPGA - Field Programmable Gate Array
Logic Elements (LE) β€” 67,500
Total Memory Bits β€” 2,699,264 bits (~2.7 Mb)
Logic Array Blocks (LABs) β€” 2,700
Maximum User I/O β€” 488
Internal Frequency (max) β€” [DATA_NEEDED: internal frequency]
Core Voltage (VCC) β€” 0.9 V
Speed Grade β€” C4
Operating Temperature β€” 0C to 85C (commercial)
Lead Free / RoHS β€” Yes (lead-free per BGA package)
Configuration Method β€” JTAG, Passive Serial, FPP, external memory
Design Software β€” Quartus II (Stratix III device support)

Datasheets & Resources

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