EP3SL70F780C4G vs EP3SL70F780C4L Comparison

Detailed side-by-side comparison of EP3SL70F780C4G by Intel and EP3SL70F780C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL70F780C4G EP3SL70F780C4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $835.00 $944.74
Family Stratix III L β€”
Logic Elements (LE) 67,500 67,500
Adaptive Logic Modules (ALM) 27,000 β€”
Embedded Memory 2,699,264 bits (2.57 Mbit) β€”
Maximum User I/O 488 488
Package 780-ball FCBGA (Flip-Chip BGA) β€”
Operating Supply Voltage (Core) 1.1 V β€”
Speed Grade C4 (commercial) C4
Operating Temperature Range 0C to +85C (Commercial) β€”
Mounting Type Surface Mount (SMD/SMT) Surface Mount (BGA)
Process Node 40 nm TSMC low-power β€”
Number of PLLs 8 β€”
DSP Multipliers (18x18) [DATA_NEEDED: DSP block count] β€”
Configuration Modes PS, FPP, AS, JTAG β€”
RoHS Status Compliant β€”
MSL Level 3 β€”
Manufacturer β€” Intel (formerly Altera)
Series β€” Stratix III L
Device Type β€” FPGA - Field Programmable Gate Array
Total Memory Bits β€” 2,699,264 bits (~2.7 Mb)
Logic Array Blocks (LABs) β€” 2,700
Process Technology β€” 65 nm
Internal Frequency (max) β€” [DATA_NEEDED: internal frequency]
Core Voltage (VCC) β€” 0.9 V
Operating Temperature β€” 0C to 85C (commercial)
Package Type β€” 780-BBGA, FC-FBGA (Flip-Chip)
Lead Free / RoHS β€” Yes (lead-free per BGA package)
Configuration Method β€” JTAG, Passive Serial, FPP, external memory
Design Software β€” Quartus II (Stratix III device support)

Datasheets & Resources

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