EP3SL70F780I3 vs EP3SL70F780I3N Comparison
Detailed side-by-side comparison of EP3SL70F780I3 by Intel and EP3SL70F780I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 β Last Time Buy
Specification Comparison
| Parameter | EP3SL70F780I3 | EP3SL70F780I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,096.81 | $1,240.00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory Bits | 2,699,264 bits | β |
| Maximum User I/O | 488 | β |
| Operating Temperature | -40 C to +100 C (Industrial) | β |
| Speed Grade | I3 (industrial) | I3 (industrial) |
| Core Voltage | 1.1 V | 1.1 V (1.05 V to 1.15 V) |
| Process Node | 65 nm | β |
| Package | 780-ball FineLine BGA (FC-FBGA), 28x28 mm | β |
| Package Code | BGA780,28X28,40 | β |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Mode | JTAG IEEE 1149.1, Passive Serial, Active Serial | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant (per distributor listings) |
| Number of Terminals | 780 | β |
| Supplier Device Package | 780-BBGA, FCBGA | β |
| Logic Array Blocks (LABs) | β | 2,700 |
| Embedded Memory (bits) | β | 2,699,264 |
| User I/Os | β | 488 |
| Process Technology | β | 65 nm CMOS |
| Operating Frequency | β | 500 MHz |
| Package Type | β | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) |
| Ball Pitch | β | 1.0 mm |
| Operating Junction Temperature | β | -40 C to +100 C |
| Configuration | β | SRAM-based, volatile |