EP3SL70F780I3N - Stratix III L FPGA 67.5K LE 780-FBGA | Intel
MPN: EP3SL70F780I3N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1446.33 | $1,446.33 |
| 10 | $1395 | $13,950.00 |
| 25 | $1340 | $33,500.00 |
| 50 | $1295 | $64,750.00 |
| 100 | $1240 | $124,000.00 |
EP3SL70F780I3N Overview
An FPGA (Field-Programmable Gate Array) is a class of programmable logic IC that sits within the broader hierarchy of digital semiconductors: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. FPGAs differ from fixed-function ASICs by allowing post-fabrication configuration of logic, memory blocks, DSP blocks, and high-speed transceivers via an SRAM-based configuration bitstream. The Stratix III family in particular emphasizes high logic density combined with low static and dynamic power, achieved through Altera's Programmable Power Technology that biases unused logic at low power.
Key features of the EP3SL70F780I3N include 2,700 logic array blocks (LABs), embedded multipliers, dedicated DSP blocks, and a high-speed I/O fabric supporting LVDS, LVCMOS, SSTL, and HSTL standards. The 780-FBGA package provides a fine-pitch 1.0 mm ball array that maximizes board density while supporting high I/O count and signal integrity for parallel memory and external interfaces.
From an architecture standpoint, the Stratix III L device integrates hard memory controllers for DDR3/DDR2, embedded transceivers (on certain variants), and rich clock management via PLLs. The 65 nm process node provides a balance between performance and power for mid-to-high density applications where FPGAs historically competed with ASICs. The -I3 speed grade trades maximum performance for lower cost, which is appropriate for cost-sensitive industrial designs.
Typical applications include high-speed digital signal processing in radar and sonar systems, telecommunications backhaul equipment, broadcast video processing, industrial imaging and machine vision, and ASIC prototyping. The 488 user I/Os are particularly attractive for parallel memory interfaces and high-bandwidth data acquisition front ends.
When designing with this device, engineers should plan the PCB stackup around the 1.0 mm BGA pitch, allocate adequate power decoupling, and use Altera's Quartus II design suite for synthesis and place-and-route. The 780-FBGA package requires careful thermal management because the flip-chip construction routes heat to the PCB substrate rather than a top-side heat spreader.
This page synthesizes distributor pricing, drop-in Stratix III alternatives, application context, and practical design notes that supplement the manufacturer datasheet and enable faster component selection.
Drop-in alternatives for EP3SL70F780I3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL70F780I3N (same form factor and footprint) β differing in Speed Grade, Operating Temperature, Package, Package Type, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL70F780I3G
β Drop-Inβ In Stock
$990 / Unit
View Datasheet βEP3SL70F780I3
β Drop-Inβ In Stock
$1096.81 / Unit
View Datasheet βEP3SL70F780C4N
β Drop-Inβ In Stock
$1210 / Unit
View Datasheet βEP3SL70F780C4LN
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP3SL70F780C4L
β Drop-Inβ In Stock
$944.74 / Unit
View Datasheet βEP3SL70F780C3N
β Drop-Inβ In Stock
$198 / Unit
View Datasheet βEP3SL70F780I3N Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 67,500 |
| Logic Array Blocks (LABs) | 2,700 |
| Embedded Memory (bits) | 2,699,264 |
| User I/Os | 488 |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V (1.05 V to 1.15 V) |
| Operating Frequency | 500 MHz |
| Speed Grade | I3 (industrial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) |
| Ball Pitch | 1.0 mm |
| Operating Junction Temperature | -40 C to +100 C |
| Configuration | SRAM-based, volatile |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (per distributor listings) |
EP3SL70F780I3N 780-bbga, fcbga (flip-chip fineline bga) Pin Configuration Guide
Pin configuration for EP3SL70F780I3N (780-bbga, fcbga (flip-chip fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL70F780I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL70F780I3N is suitable for 6 applications: Telecommunications Backhaul Equipment, Software Defined Radio and Radar DSP, Broadcast Video Processing and Format Conversion, Industrial Machine Vision and Image Processing, ASIC Prototyping and Emulation, Medical Imaging and Diagnostic Equipment.
Telecommunications Backhaul Equipment
The EP3SL70F780I3N fits telecommunications backhaul line cards where wire-speed packet processing, FEC encoding, and CPRI/OBSAI framer logic must run concurrently. Its 67,500 logic elements and 2.7 Mbits of embedded memory provide headroom for deep packet buffers and lookup tables, while the 488 user I/Os support multi-lane SFI and SFP+ interface fan-out without external mux logic. The 500 MHz fabric and dedicated DSP blocks accelerate Reed-Solomon and Turbo decoding at line rate, and the I3 industrial speed grade ensures reliable operation in temperature-uncontrolled central-office shelves. Use the device downstream of a PHY/MAC ASSP, paired with external DDR3 for table storage.
Recommended
Software Defined Radio and Radar DSP
The EP3SL70F780I3N is well suited to software-defined radio and radar baseband DSP front ends. Its 65 nm fabric delivers 500 MHz operation with hundreds of 18x18 multipliers, enabling real-time FFT, channelization, and pulse-Doppler processing for radar returns up to 100 MHz instantaneous bandwidth. The 488 user I/Os allow direct parallel ADC capture from multi-channel A/D converters like the AD9650 family, while embedded M9K memory blocks hold FFT windows without external SRAM. The 780-FBGA package provides low-inductance power delivery required by the digital-intensive DSP, and Quartus II DSP Builder accelerates model-based design entry for radar algorithms.
Recommended
Broadcast Video Processing and Format Conversion
Broadcast video routers, format converters, and multi-viewers benefit from the EP3SL70F780I3N's combination of mid-range logic density and very high I/O count. The 488 user I/Os accept multiple 3G-SDI or HDMI streams simultaneously, while embedded memory buffers line-rate video frames without external DDR. Its DSP blocks perform chroma resampling, scaling, and deinterlacing at 1080p60 with margin to spare. The 780-FBGA's 1.0 mm pitch integrates cleanly into typical 12-layer broadcast board stackups, and the 1.1 V core minimizes power dissipation in fanless chassis designs typical of broadcast control rooms.
Recommended
Industrial Machine Vision and Image Processing
The EP3SL70F780I3N suits industrial machine vision systems where multi-camera GigE Vision or Camera Link inputs must be aggregated, processed, and routed to a host PC. The 488 user I/Os handle parallel Camera Link base/medium/full configurations, and embedded DSP blocks run Sobel, Laplacian, and Hough-transform kernels at line rate. The 2.7 Mbits of block memory holds lookup tables for LUT-based color correction and gamma correction. The I3 industrial speed grade tolerates factory-floor temperature swings, and the Stratix III platform has a long lifecycle appropriate for industrial equipment with multi-decade deployment horizons.
Recommended
ASIC Prototyping and Emulation
The EP3SL70F780I3N is a strong fit for ASIC and ASSP prototyping where mid-range gate counts (roughly 1-3 million ASIC gates) must be validated with real-world I/O. Quartus II supports industry-standard synthesis flows from Synopsys Design Compiler and Cadence Genus, and the 488 user I/Os map readily to a prototype daughter card's peripheral mix. The 65 nm Stratix III fabric has well-characterized timing models that closely match synthesized ASIC timing after back-end P&R, improving confidence in the prototype-to-silicon handoff. Multi-FPGA partitioning across several EP3SL70 devices using known design methodologies is well documented in Intel application notes.
Recommended
Medical Imaging and Diagnostic Equipment
The EP3SL70F780I3N addresses medical imaging front ends in ultrasound, endoscopy, and digital X-ray where mid-range logic density, low noise, and deterministic latency are mandatory. The 488 user I/Os accept multiple parallel ADC streams from transducer arrays, while DSP blocks execute beamforming and matched-filter operations in real time. The 780-FBGA package supports low-EMI layouts required to meet IEC 60601-1 emissions limits, and the I3 industrial speed grade offers the temperature tolerance needed in chassis adjacent to heat-generating X-ray tubes. Long-term availability through industrial extended-lifecycle programs helps medical OEMs sustain FDA-cleared platforms.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL70F780I3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL70F780I3G | EP3SL70F780I3 | EP3SL70F780C4N | EP3SL70F780C4LN | EP3SL70F780C4L | EP3SL70F780C3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (1.0 mm pitch) | 780-FBGA (same) | 780-FBGA (same) | 780-FBGA (same) | 780-FBGA (same) | 780-FBGA (same) | 780-FBGA (same) |
| Family / Logic Elements | Stratix III L / 67,500 LE | Stratix III L / 67,500 LE | Stratix III L / 67,500 LE | Stratix III L / 67,500 LE | Stratix III L / 67,500 LE | Stratix III L / 67,500 LE | Stratix III L / 67,500 LE |
| Speed Grade | I3 (industrial, fastest) | I3 (industrial) | I3 (industrial) | C4 (commercial) | C4 (commercial) | C4 (commercial) | C3 (commercial) |
| Operating Temperature | -40 C to +100 C (junction) | -40 C to +100 C | -40 C to +100 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Embedded Memory | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Core Voltage | 1.1 V (1.05 V to 1.15 V) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Technology | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial -I3 speed grade with widest temperature range (vs EP3SL70F780C4N)
- Pin-compatible industrial-grade I3 alternative in same package (vs EP3SL70F780I3G)
- Higher speed grade within the same 780-FBGA family (vs EP3SL70F780C4N)
Design Notes
The 780-FBGA uses a 1.0 mm ball pitch and requires a 4-6 layer PCB stackup with 0.5 oz copper outer layers and 1 oz inner planes. Use microvia (laser-drilled) stack-ups for signal breakout under the BGA - via-in-pad with filled and plated-over vias is recommended for the inner rows to escape the 488 user I/Os without trace-length mismatches. Per Altera application note AN-532, the BGA escape routing must maintain 50 ohm single-ended impedance with 85 ohm differential for LVDS pairs.
Decoupling must include a dense array of 0.1 uF and 0.01 uF X7R ceramics placed within 100 mils of every VCC/GND ball pair, plus bulk 47 uF to 100 uF tantalum or polymer caps on each supply rail. Stratix III L devices have separate VCCINT (core), VCCIO (I/O banks), VCCA (PLL analog), and VCCD (configuration) rails that must be brought up in the recommended sequence to avoid latch-up. The 1.1 V VCCINT rail can source 3-5 A at full utilization, so use at least 6 vias from each power pin to inner planes.
Stratix III L FPGAs use a flip-chip package where the silicon die is mounted directly to the BGA substrate; heat exits through the balls into the PCB rather than through a top-side heat spreader. Provide a continuous ground plane on the top PCB layer directly under the BGA footprint for thermal dissipation, and consider a 1-2 C/W thermal pad cutout. Per the manufacturer datasheet, the theta-JA of the 780-FBGA is approximately 8-12 C/W with adequate PCB copper; the device derates linearly above 85 C junction.
For DDR3/DDR2 memory interfaces up to 533 MHz, use fly-by topology with series-DNI placement for address/command signals as recommended in Altera's External Memory Interface Handbook. Match DQ/DQS byte-lane lengths within +/-25 mils and use differential DQS pairs with 100 ohm differential termination at the FPGA end. SSO (simultaneous-switching output) noise can corrupt I/O timing on the 780-FBGA's 488 I/Os; spread switching loads across I/O banks and limit each bank to 70% simultaneous switching per Altera's SSO calculator.
Do not attempt to use a non-780-FBGA Stratix III variant as a drop-in; the EP3SL70F484 parts use a 484-ball BGA with a different pinout and are NOT compatible. Configuration mode pins (MSEL) must match the selected configuration scheme (AS, PS, JTAG, or Fast Passive Parallel); misconfiguration prevents bitstream loading. Always confirm the bitstream file targets the EP3SL70F780 device ID, and use the Quartus II programmer with the latest Stratix III device support file to avoid pinout database corruption.
Compliance Information
RoHS and REACH compliance per DigiKey and Mouser product listings. AEC-Q100 not applicable (FPGA is not an automotive-qualified part). Halogen-free and conflict-mineral declarations not explicitly stated in available distributor data.
