EP3SL70F780I3N vs EP3SL70F780I3 Comparison
Detailed side-by-side comparison of EP3SL70F780I3N by Intel and EP3SL70F780I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 β Last Time BuySpecification Comparison
| Parameter | EP3SL70F780I3N | EP3SL70F780I3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,240.00 | $1,096.81 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | β |
| Embedded Memory (bits) | 2,699,264 | β |
| User I/Os | 488 | β |
| Process Technology | 65 nm CMOS | β |
| Core Voltage | 1.1 V (1.05 V to 1.15 V) | 1.1 V |
| Operating Frequency | 500 MHz | β |
| Speed Grade | I3 (industrial) | I3 (industrial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) | β |
| Ball Pitch | 1.0 mm | β |
| Operating Junction Temperature | -40 C to +100 C | β |
| Configuration | SRAM-based, volatile | β |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant (per distributor listings) | [DATA_NEEDED: RoHS status] |
| Embedded Memory Bits | β | 2,699,264 bits |
| Maximum User I/O | β | 488 |
| Operating Temperature | β | -40 C to +100 C (Industrial) |
| Process Node | β | 65 nm |
| Package | β | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Code | β | BGA780,28X28,40 |
| Configuration Mode | β | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | β | 780 |
| Supplier Device Package | β | 780-BBGA, FCBGA |