EP3SL70F780I3N vs EP3SL70F780I4L Comparison
Detailed side-by-side comparison of EP3SL70F780I3N by Intel and EP3SL70F780I4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SL70F780I3N | EP3SL70F780I4L |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,240.00 | $1,150.00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Embedded Memory (bits) | 2,699,264 | β |
| User I/Os | 488 | β |
| Process Technology | 65 nm CMOS | β |
| Core Voltage | 1.1 V (1.05 V to 1.15 V) | β |
| Operating Frequency | 500 MHz | β |
| Speed Grade | I3 (industrial) | I4 |
| Package Type | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) | β |
| Ball Pitch | 1.0 mm | β |
| Operating Junction Temperature | -40 C to +100 C | β |
| Configuration | SRAM-based, volatile | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant (per distributor listings) | Compliant |
| Embedded Memory Bits | β | 2,699,264 |
| User I/O Pins | β | 488 |
| Package | β | 780-ball FBGA (FineLine BGA) |
| Operating Temperature | β | -40C to +100C (industrial) |
| Power Variant | β | L (low static power) |
| Process Node | β | 40 nm |
| Configuration Method | β | Serial / Parallel / JTAG via Quartus II |
| DSP Blocks | β | [DATA_NEEDED: DSP block count] |
| Transceivers | β | None (logic/transceiver-less L variant) |
| PLL Count | β | [DATA_NEEDED: PLL count] |