EP4CE55F23C7N vs EP4CE55F23C8LN Comparison
Detailed side-by-side comparison of EP4CE55F23C7N by Intel and EP4CE55F23C8LN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE55F23C7N | EP4CE55F23C8LN |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $56.40 | $105.00 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | β |
| Configurable Logic Blocks (CLBs) | 3,491 | β |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits |
| Maximum User I/O | 324 | β |
| Embedded 18x18 Multipliers | 66 | 156 |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | 20 |
| Maximum Operating Frequency | 472.5 MHz (C7 speed grade) | β |
| Core Voltage (VCCINT) | 1.2 V | β |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Package | 484-FBGA (F23) 23 x 23 mm, 1.0 mm pitch | 484-pin FBGA (FBGA-484) |
| Operating Temperature | 0C to +85C (commercial, C7) | 0C to +85C (commercial) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | β |
| Mounting Type | Surface Mount (BGA) | β |
| RoHS Status | Compliant | Compliant (lead-free) |
| Device Logic Elements | β | 55,856 |
| Logic Array Blocks (LABs) | β | 3,491 |
| Maximum User I/Os | β | 324 |
| Core Voltage | β | 1.2 V |
| Package Size | β | 23 x 23 mm |
| Ball Pitch | β | 1.0 mm |
| Speed Grade | β | C8 |
| Device Type | β | FPGA |