EP4CE55F23I8L vs EP4CE75F23I8L Comparison

Detailed side-by-side comparison of EP4CE55F23I8L by Intel and EP4CE75F23I8L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CE55F23I8L EP4CE75F23I8L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $143.43 $213.30
Device Family Cyclone IV E β€”
Logic Elements (LEs) 55,856 β€”
Embedded Memory Bits 2,396,160 bits (~234 Kbit / ~292.5 KByte) β€”
Maximum User I/O Pins 324 β€”
Embedded 18x18 Multipliers 156 274
General-Purpose PLLs 4 β€”
Process Technology 60 nm β€”
Core Supply Voltage 1.2 V β€”
Package 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) 484-ball FBGA
Operating Temperature Range -40C to +100C (Industrial) β€”
Configuration Modes AS, PS, JTAG AS, PS, FPP, JTAG
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X LVDS, SSTL, HSTL, LVPECL, LVCMOS, LVTTL
Speed Grade 8 β€”
RoHS Status Compliant Compliant
Lead-Free / Halogen-Free Yes / Yes β€”
Family β€” Cyclone IV E
Logic Elements β€” 75,408
Embedded Memory (bits) β€” 2,810,880
Number of M9K Memory Blocks β€” 305
User I/O Pins β€” 292
PLLs β€” 4
Global Clock Networks β€” 20
Maximum User I/O β€” 292
Operating Temperature β€” -40C to +85C (Industrial)
Supply Voltage (Core) β€” 1.0 V / 1.2 V
Process Node β€” 60 nm low-leakage
MSL Level β€” 3
Mounting Type β€” Surface Mount (BGA)

Datasheets & Resources

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