EP4CE55F29I7N vs EP4CE55F29C8N Comparison
Detailed side-by-side comparison of EP4CE55F29I7N by Intel and EP4CE55F29C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE55F29I7N | EP4CE55F29C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $154.80 | $285.00 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 | β |
| Number of LABs/CLBs | 3491 | β |
| Maximum User I/O | 374 | β |
| Core Voltage (VCCINT) | 1.2 V | β |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | β |
| Number of PLLs | 4 | β |
| Global Clock Networks | 20 | β |
| Dedicated Clock Pins | 11 | β |
| Embedded Multipliers (18x18) | 154 | β |
| Package | 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FBGA (F29) |
| Speed Grade | I7 (industrial) | 8 (commercial) |
| Operating Junction Temperature | -40 C to +100 C | β |
| Process Technology | 60 nm low-k | 60 nm (TSMC low-power) |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount | Surface Mount |
| Supply Type | Tray | β |
| Embedded Memory | β | 2,340 Kbits |
| Embedded Multiplier Blocks (18x18) | β | 154 |
| Maximum User I/O Pins | β | 374 |
| Logic Array Blocks (LABs) | β | 3,491 |
| Core Voltage | β | 1.2 V |
| Temperature Grade | β | Commercial (0 C to +85 C) |
| PLLs | β | 4 to 8 (per device) |
| Configuration Method | β | SRAM-based, volatile (requires external config device) |
| Lead-Free / Halogen-Free | β | Yes (per part marking) |