EP4CE6E22C7 vs EP4CE6E22C6 Comparison
Detailed side-by-side comparison of EP4CE6E22C7 by Intel and EP4CE6E22C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP4CE6E22C7
EP4CE6E22C7 - Cyclone IV E FPGA 6K LE, 144-LQFP | Intel/Altera
EP4CE6E22C7 β ActiveSpecification Comparison
| Parameter | EP4CE6E22C7 | EP4CE6E22C6 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $11.20 | $12.05 |
| Series | Cyclone IV E | β |
| Family | Cyclone IV | Cyclone IV E |
| Core Architecture | Logic Elements (LE) | β |
| Number of Logic Elements (LEs) | 6,272 | β |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | β |
| Number of Configurable Logic Blocks (CLBs) | 392 | β |
| Total Embedded Memory Bits | 276,480 | β |
| Total RAM (Kbits) | 270 | β |
| Number of Embedded 18x18 Multipliers | 15 | β |
| Number of PLLs | 4 | β |
| User I/O Count | 91 | β |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, SSTL, HSTL, PCI | β |
| Operating Supply Voltage (Core) | 1.0 V to 1.2 V (typ. 1.2 V) | β |
| Operating Supply Voltage (I/O) | 1.2 V to 3.3 V | β |
| Logic Speed Grade | C7 | β |
| Operating Temperature Range (Commercial) | 0Β°C to +85Β°C (junction) | β |
| Package | 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch | β |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | β |
| Process Technology | 60 nm low-power CMOS | TSMC 60 nm low-k |
| RoHS Status | Compliant | Compliant |
| Device Logic Elements | β | 6,272 LE |
| Logic Array Blocks (LABs) | β | 392 LABs |
| Total RAM Bits | β | 270 Kbit |
| Embedded 18x18 Multipliers | β | 15 |
| PLLs | β | 2 |
| Maximum User I/Os | β | 91 |
| Core Voltage | β | 1.2 V |
| Speed Grade | β | C6 |
| Operating Temperature | β | 0 Β°C to +85 Β°C (Commercial) |
| Package Type | β | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | β | 22 mm Γ 22 mm |
| Lead Pitch | β | 0.5 mm |
| Configuration Method | β | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |