EP4CE6E22C6 - Cyclone IV E FPGA, 6K LE, 144-EQFP | Intel
MPN: EP4CE6E22C6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $21.28 | $21.28 |
| 10 | $19.15 | $191.50 |
| 100 | $16.4 | $1,640.00 |
| 500 | $14.1 | $7,050.00 |
| 1,000 | $12.05 | $12,050.00 |
EP4CE6E22C6 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be re-programmed to implement any digital logic function, sitting in the product hierarchy of programmable logic -> logic IC -> integrated circuit. FPGAs bridge the gap between fixed-function ASICs and software-driven processors, allowing hardware-level parallelism for DSP, glue logic, and protocol bridging without NRE costs.
Key features of the EP4CE6E22C6 include 6,272 logic elements, 270 Kbits of embedded RAM (M9K blocks), 15 embedded 18x18 multipliers for DSP, two general-purpose PLLs, and 91 maximum user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The EQFP-144 (22 mm × 22 mm body, 0.5 mm pitch, exposed pad) provides a wire-bond QFP package option for legacy and through-hole-friendly designs where BGA is not required.
Architecturally, the Cyclone IV E family uses an SRAM-based configuration cell with a 4-input look-up table (LUT) per logic element, dedicated multiplier blocks, and per-IO bank supply pins supporting up to 8 banks in this package. The C6 speed grade offers commercial timing with internal core speeds up to 472.5 MHz per published device specifications, and configuration is supported via JTAG, Active Serial, and Passive Serial modes.
Typical applications include industrial control and motor drive glue logic, low-volume communications bridges (UART/SPI/I2C to parallel), legacy 32-bit controller co-processing, video processing front-ends, and education/hobby digital logic platforms. The Cyclone IV E series is widely adopted in cost-sensitive designs where BGA assembly cost must be avoided.
When designing with the EP4CE6E22C6, note that configuration memory is volatile: an external EPCS or EPCQ configuration flash, or a microcontroller, is required to load the bitstream on every power-up. The exposed thermal pad must be soldered to a sufficient copper pour to meet the device's theta-JA thermal budget during continuous operation.
Drop-in alternatives for EP4CE6E22C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE6E22C6 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE6E22C8N
✅ Drop-In✓ In Stock
$10.5 / Unit
View Datasheet →EP4CE6E22C7N
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$18.5 / Unit
View Datasheet →EP4CE6E22A7N
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$17.4 / Unit
View Datasheet →EP4CE6E22I7N
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$10.5 / Unit
View Datasheet →EP4CE6E22C6N
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$11.2 / Unit
View Datasheet →EP4CE10E22C8N
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$11.1 / Unit
View Datasheet →EP4CE6E22C6 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Device Logic Elements | 6,272 LE |
| Logic Array Blocks (LABs) | 392 LABs |
| Total RAM Bits | 270 Kbit |
| Embedded 18x18 Multipliers | 15 |
| PLLs | 2 |
| Maximum User I/Os | 91 |
| Core Voltage | 1.2 V |
| Speed Grade | C6 |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Package Type | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | 22 mm × 22 mm |
| Lead Pitch | 0.5 mm |
| Mounting Type | Surface Mount |
| Process Technology | TSMC 60 nm low-k |
| Configuration Method | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |
| RoHS Status | Compliant |
EP4CE6E22C6 22 mm × 22 mm Pin Configuration Guide
Pin configuration for EP4CE6E22C6 (22 mm × 22 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE6E22C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE6E22C6 is suitable for 6 applications: Industrial Motor Control Glue Logic, Legacy Communications Protocol Bridge, Video Processing Front-End, 32-bit Controller Co-Processor, Education and Prototyping Platform, Low-Cost IoT Sensor Aggregation.
Industrial Motor Control Glue Logic
The EP4CE6E22C6 is well-suited for industrial motor control and drive glue logic, where its 6,272 logic elements and 15 embedded 18x18 multipliers provide sufficient capacity to interface PWM controllers, encoder feedback (QEP/Hall sensors), and fault-detection logic. The 91 user I/Os in the EQFP-144 package easily accommodate multiple communication channels (UART, SPI, I2C) for PLC interconnects, while 270 Kbit embedded RAM buffers state-machine context and lookup tables. The commercial 0C to +85C temperature range is adequate for cabinet-protected industrial environments, and the QFP package simplifies field rework compared to BGA alternatives.
Recommended
Legacy Communications Protocol Bridge
For UART/SPI/I2C-to-parallel or RS-232-to-RS-485 protocol bridging in low-volume embedded systems, the EP4CE6E22C6 delivers the necessary logic density and I/O count in a footprint-friendly QFP package. Its 6,272 logic elements comfortably fit multi-channel bridges, while the SRAM-based configuration enables field upgrades via JTAG without firmware toolchain. The 91 user I/Os handle multiple serial channels simultaneously. Unlike a microcontroller, the FPGA's parallel hardware pipelines reduce latency below 1 microsecond, making it ideal for real-time industrial sensor multiplexing.
Recommended
Video Processing Front-End
The EP4CE6E22C6's 15 embedded 18x18 multipliers and 270 Kbit embedded RAM enable basic video processing front-ends such as deinterlacing, scaling, or color-space conversion for industrial cameras and machine vision. Its 91 user I/Os accommodate parallel video buses (RGB/YUV 8/16/24 bit) plus auxiliary I2C/SPI control channels. The 472.5 MHz internal frequency supports real-time pixel clock processing for standard-definition and entry-level HD formats, and the QFP package facilitates prototype iteration during algorithm development.
Recommended
32-bit Controller Co-Processor
As a co-processor to a 32-bit MCU or ARM Cortex host, the EP4CE6E22C6 accelerates DSP kernels, crypto primitives, and custom state machines offloaded from the main CPU. Its 6,272 logic elements are sufficient for AES-128/SHA-256 hardware accelerators or motor-control FFT preprocessing. The 15 multipliers provide 1.5 GMAC DSP throughput at 100 MHz. The exposed-pad EQFP package is ideal for high-vibration automotive and industrial environments where QFP solder joints outperform BGA thermal cycling.
Recommended
Education and Prototyping Platform
The Cyclone IV E series is the de-facto FPGA choice in university digital logic and embedded systems curricula due to its accessible QFP package and the free Quartus Prime Lite toolchain. The EP4CE6E22C6's 6,272 logic elements are sufficient for teaching Verilog/VHDL, computer architecture (RISC cores, MIPS pipelines), and signal-processing coursework. The 0.5 mm pitch EQFP-144 is hand-solderable by advanced students using hot-air stations, lowering lab setup costs versus BGA packages.
Recommended
Low-Cost IoT Sensor Aggregation
For IoT edge nodes aggregating multiple sensor buses (I2C, SPI, GPIO) before forwarding to a Wi-Fi/BLE host, the EP4CE6E22C6 provides flexible I/O mapping and protocol translation. Its 91 user I/Os can interface with 8+ sensor channels simultaneously, and the embedded RAM buffers burst sensor data. The commercial temperature range suits indoor smart-home gateways. The low-cost QFP packaging keeps total BOM cost competitive against discrete MCU + level shifter designs.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE6E22C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE6E22C8N | EP4CE6E22C7N | EP4CE6E22A7N | EP4CE6E22I7N | EP4CE6E22C6N | EP4CE10E22C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-pin EQFP (22x22 mm) | 144-pin EQFP (same) | 144-pin EQFP (same) | 144-pin EQFP (same) | 144-pin EQFP (same) | 144-pin EQFP (same) | 144-pin EQFP (same) |
| Family | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E |
| Logic Elements | 6,272 LE | 6,272 LE (same) | 6,272 LE (same) | 6,272 LE (same) | 6,272 LE (same) | 6,272 LE (same) | 10,320 LE (+64%) |
| Embedded RAM | 270 Kbit | 270 Kbit | 270 Kbit | 270 Kbit | 270 Kbit | 270 Kbit | 414 Kbit |
| Embedded Multipliers (18x18) | 15 | 15 | 15 | 15 | 15 | 15 | 23 |
| Speed Grade | C6 (commercial) | C8 (faster) | C7 | A7 (auto/industrial) | I7 (industrial) | C6 (same) | C8 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Automotive/Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Max User I/Os | 91 | 91 | 91 | 91 | 91 | 91 | 91 |
Key Differentiators
- Wire-bond EQFP-144 package for low-cost, hand-reworkable assembly (vs Cyclone IV E BGA-256 variants)
- Same silicon (6,272 LE, 270 Kbit) across speed grades for easy migration (vs Cross-brand Xilinx Spartan-6 XC6SLX9)
- Commercial 0C-85C range with industrial I7 upgrade path (vs EP4CE6E22I7N (industrial temperature))
- 15 embedded 18x18 multipliers in 6K LE density class (vs Lattice ECP5 LFE5U-12F (also 144-pin density class))
Design Notes
The Cyclone IV E EP4CE6E22C6 requires a 1.2 V core supply plus separate VCCIO rails per I/O bank (typically 1.2 V to 3.3 V). Decoupling must include 100 nF ceramic caps at every supply pin plus 10 uF bulk on each rail. Use a power-on-reset supervisor (e.g., TPS3808) to hold nCONFIG low until all rails are stable; otherwise configuration failures may occur. Estimated core current: 100-300 mA typical at 50 MHz clock, scaling with toggle rate.
The EQFP-144 exposed thermal pad must be soldered to a top-layer copper pour of at least 1 square inch (6 cm squared) and stitched with thermal vias to inner/inner-bottom ground planes. Without the exposed-pad connection, junction temperature rises rapidly under sustained switching activity. Estimated theta-JA for a properly soldered EPAD is approximately 18-22 C/W; without EPAD connection it exceeds 50 C/W. Use thermal camera profiling during initial prototype bring-up.
Cyclone IV E uses volatile SRAM configuration. Forgetting to connect an EPCS/EPCQ flash results in a non-functional board on every power-up. JTAG-only loading works for development but is not field-deployable. A second common pitfall is leaving any I/O pin unconnected without setting it to tri-state in software; floating inputs can draw extra current and inject noise into logic. Always generate a pin-out report from Quartus and tie unused pins to known states explicitly.
Trace length matching for differential I/O standards (LVDS) requires 100 ohm differential impedance and intra-pair skew below 20 ps. Separate analog and digital ground planes under the EQFP-144 footprint, joining at a single point near the FPGA. Keep JTAG (TCK, TMS, TDI, TDO) traces short and away from switching power converter edges. Recommended stack-up: 4-layer minimum with dedicated VCC and GND planes.
Place configuration flash (EPCS/EPCQ) within 50 mm of the FPGA DATA0/DCLK/nCONFIG/nSTATUS pins to avoid signal integrity issues. Add 10 kohm pull-ups on nCONFIG, nSTATUS, and MSEL pins per the Cyclone IV E handbook. If using Active Serial mode, route MSEL pins correctly (00 = AS, 10 = PS, 01 = Fast AS) to select the configuration mode.
Compliance Information
RoHS and REACH compliant per Intel product page. Standard EP4CE6E22C6 is commercial temperature grade (0C to +85C); for automotive use, choose EP4CE6E22A7N variant.
