EP4CGX110DF27I7N vs EP4CGX110DF31I7 Comparison
Detailed side-by-side comparison of EP4CGX110DF27I7N by Intel and EP4CGX110DF31I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX110DF27I7N | EP4CGX110DF31I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $198.00 | $276.34 |
| Series | Cyclone IV GX | Cyclone IV GX |
| Device Family | EP4CGX110 | β |
| Logic Elements (LEs) | 109,424 | β |
| Logic Array Blocks (LABs) | 6,422 | β |
| Embedded Memory (bits) | 5,621,760 | β |
| Memory Blocks (M9K) | 610 | β |
| Embedded 18x18 Multipliers | 280 | β |
| User I/Os | 393 | β |
| Transceivers | 8 channels, up to 3.125 Gbps | 8 (up to 3.125 Gbps) |
| PCIe Hard IP Blocks | 4 (Gen1 x1/x2/x4) | β |
| PLLs | 4 | 4 |
| Core Voltage | 1.2 V | 1.2 V typical |
| Operating Temperature | -40C to +100C (Industrial) | β |
| Package | 672-ball FBGA, 1.0 mm pitch | 896-BGA (FBGA-896), 31 mm |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Process Node | 60 nm | β |
| Configuration Scheme | AS, PS, JTAG, FPP | β |
| Device Logic Elements | β | 109,424 |
| Total Memory Bits | β | 5,621,760 |
| Number of Logic Array Blocks (LABs) | β | Not specified in provided data [DATA_NEEDED: LAB count] |
| Number of I/O | β | 475 user I/O |
| Multipliers (18x18) | β | 432 |
| M9K Memory Blocks | β | 270 |
| Ball Pitch | β | 0.8 mm |
| Speed Grade | β | -7 |
| Temperature Grade | β | Industrial (-40C to +100C Tj) |
| Configuration Method | β | SRAM (EPCS or JTAG) |
| MSL Level | β | 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] |