EP4CGX110DF27I7N - Cyclone IV GX FPGA, 110K LEs, 672-FBGA | Intel
MPN: EP4CGX110DF27I7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
EP4CGX110DF27I7N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. FPGAs sit in the digital logic hierarchy above fixed-function ASICs and below microcontrollers for parallel, high-throughput workloads. The Cyclone IV GX family specifically targets cost-sensitive, transceiver-equipped applications, combining low static power (~0.5 W typical) with multi-gigabit serial I/O.
Key differentiating features of the EP4CGX110DF27I7N include eight integrated 3.125 Gbps transceivers, four PCI Express hard IP blocks (PIPE-ready), and 5.4 Mbits of embedded RAM. The 672-FBGA package supports 393 general-purpose I/Os with LVDS, LVTTL, LVCMOS, and SSTL-18 signaling, enabling direct interface to DDR2 SDRAM and external parallel buses without glue logic.
Architecturally, the device uses a 60 nm process node with a sea-of-LABs fabric, embedded 9-Kbit M9K memory blocks, and dedicated 18x18 multipliers for DSP operations. Hard IP blocks for PCIe Gen1 (x1/x2/x4), memory controllers, and PLL-based clock management reduce soft logic overhead and improve timing closure for serial-protocol designs.
Typical applications include industrial video bridging, motor-control coprocessors, low-end wireless baseband, PCI Express endpoint cards, and protocol-conversion glue logic. The integrated transceivers make the EP4CGX110DF27I7N especially attractive for designs that previously required a separate PHY plus an FPGA. Wide industrial-grade operating temperature range and rugged FBGA packaging also suit factory-floor deployments.
When designing with this device, engineers must respect the PCB layout rules for 1.0 mm-pitch FBGA, including microvia stack-ups and matched-length differential pairs for the transceiver lanes. The Quartus Prime design suite (free Web Edition) supports the entire Cyclone IV GX family.
This page synthesizes distributor inventory, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4CGX110DF27I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX110DF27I7N (same form factor and footprint) β differing in Package, Speed Grade, Transceivers, Process Technology, Operating Temperature.
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EP4CGX110DF27I7
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View Datasheet βEP4CGX110DF27C8N
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$152.3 / Unit
View Datasheet βEP4CGX110DF27C7N
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$204.2 / Unit
View Datasheet βEP4CGX110DF27I7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV GX |
| Device Family | EP4CGX110 |
| Logic Elements (LEs) | 109,424 |
| Logic Array Blocks (LABs) | 6,422 |
| Embedded Memory (bits) | 5,621,760 |
| Memory Blocks (M9K) | 610 |
| Embedded 18x18 Multipliers | 280 |
| User I/Os | 393 |
| Transceivers | 8 channels, up to 3.125 Gbps |
| PCIe Hard IP Blocks | 4 (Gen1 x1/x2/x4) |
| PLLs | 4 |
| Core Voltage | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Package | 672-ball FBGA, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Process Node | 60 nm |
| Configuration Scheme | AS, PS, JTAG, FPP |
EP4CGX110DF27I7N 672-ball fbga, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CGX110DF27I7N (672-ball fbga, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX110DF27I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX110DF27I7N is suitable for 6 applications: Industrial Video Bridging & Surveillance, PCI Express Endpoint Cards, Motor Control & Industrial Automation, Wireless Baseband & Protocol Conversion, Test & Measurement Instrumentation, Display & Video Wall Controllers.
Industrial Video Bridging & Surveillance
The EP4CGX110DF27I7N's 8 multi-gigabit transceivers and 109,424 logic elements enable real-time bridging between camera sensors using MIPI, LVDS, or parallel CMOS interfaces and GigE Vision / SDI uplink links. The 3.125 Gbps serial bandwidth supports uncompressed HD-SDI transport, while 5.6 Mbits of embedded RAM buffer line-scan and Bayer-pattern processing. Industrial-grade -40C to +100C operation suits outdoor cabinet installations.
Recommended
PCI Express Endpoint Cards
The EP4CGX110DF27I7N integrates 4 hard PCI Express Gen1 IP cores supporting x1, x2, and x4 lane configurations, eliminating the need for a soft PCIe PHY. The 280 embedded 18x18 multipliers accelerate endpoint DMA and protocol handling. Designers can implement low-cost PCIe cards (NICs, data acquisition, industrial I/O) without external bridge chips, saving BOM cost and board area.
Recommended
Motor Control & Industrial Automation
Factory automation requires deterministic PWM generation, quadrature encoder decoding, and fieldbus bridging. The EP4CGX110DF27I7N's 280 dedicated multipliers handle field-oriented control (FOC) algorithms in real time, while the integrated transceivers interface to EtherCAT, Profinet, or SERCOS III slave stacks via dedicated PHY partners. Industrial temperature qualification supports cabinet-free machine mounting.
Recommended
Wireless Baseband & Protocol Conversion
Small-cell wireless baseband and protocol-conversion designs use the EP4CGX110DF27I7N's CPRI / OBSAI serial links operating at 614 Mbps to 3.072 Gbps. The 109K logic elements support LTE PHY layer functions, while embedded memory buffers HARQ and de-interleaving tasks. The 1.2 V core keeps typical power dissipation under 1.5 W, suitable for fanless outdoor radio units.
Recommended
Test & Measurement Instrumentation
The EP4CGX110DF27I7N serves as the digital backbone of bench-top instruments: arbitrary waveform generators, logic analyzers, and protocol testers. The 393 user I/Os provide abundant parallel probing channels, while the 8 transceivers handle high-speed serial stimulus/response. The industrial temperature range and rugged FBGA package suit portable field instruments.
Recommended
Display & Video Wall Controllers
Driving multi-panel LCD walls, the EP4CGX110DF27I7N's 5.6 Mbits of embedded RAM acts as a multi-buffered frame store for up to 4 simultaneous 1080p60 video streams. The 393 I/Os support LVDS pairs for direct panel attachment, while the integrated transceivers route pixel data over long-distance serial links to remote display panels in digital-signage installations.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX110DF27I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX110DF27I7 | EP4CGX110DF27C8N | EP4CGX110DF27C7N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FBGA | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 |
| Embedded Memory (bits) | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 |
| User I/Os | 393 | 393 | 393 | 393 |
| Transceivers | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | -7 (faster) | -7 | -8 (slower, lower cost) | -7 |
Key Differentiators
- Integrated multi-gigabit transceivers eliminate external PHY cost (vs EP4CE55F29I7N (Cyclone IV E, no transceivers))
- Industrial temperature grade supports harsh environments (vs EP4CGX110DF27C8N (commercial grade))
- Smaller FBGA package for space-constrained designs (vs EP4CGX110DF31I7N (896-FBGA))
Design Notes
The 672-ball FBGA uses a 1.0 mm pitch, which requires microvia (laser-drilled) stack-ups rather than conventional through-via PCBs. Use at minimum a 6-layer stack-up with the FPGA on the top layer, a continuous ground plane on layer 2, and split power planes on layers 3-5 for the 1.2 V core, 2.5 V analog, and 3.3 V I/O rails. All decoupling capacitors must be placed on the BGA footprint side, with 0402-size 0.1 uF caps within 100 mils of every power pin.
The 8 multi-gigabit transceiver channels require 100-ohm differential routing with intra-pair skew under 5 mils and length matching to within 10 mils across P and N. Use a continuous reference ground plane beneath each transceiver lane; do not route over plane splits. Per Intel Cyclone IV GX layout guidelines, place AC-coupling capacitors within 200 mils of the FPGA transmitter pins and maintain 4W spacing between adjacent TX/RX channels.
Estimated: at typical industrial use (VCCINT 1.2 V, 60% toggle rate, junction 85C), the EP4CGX110DF27I7N dissipates approximately 1.2-1.8 W. A modest thermal copper pour (at least 1 square inch connected to the central BGA balls) keeps junction rise below 15C above ambient without a heatsink. For sealed enclosures with no airflow, consider a small aluminum heatsink bonded to the package top.
Do not assume bitstream compatibility between speed grades. The -7 and -8 speed grade variants have different timing margins; recompile the Quartus Prime design with the appropriate device selection before programming. Also, never use a commercial-grade EP4CGX110DF27C7N/C8N in an industrial environment expecting -40C operation; the silicon is qualified only to 0C minimum and may fail cold-start.
Compliance Information
RoHS and REACH compliant per Intel product page. The 'N' suffix in the OPN indicates lead-free / RoHS-compliant packaging. AEC-Q100 is not applicable as this is a commercial/industrial FPGA, not an automotive-qualified IC.
