EP4CGX110DF31C7N vs EP4CGX110DF31I7 Comparison
Detailed side-by-side comparison of EP4CGX110DF31C7N by Intel and EP4CGX110DF31I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX110DF31C7N | EP4CGX110DF31I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $112.40 | $276.34 |
| Family | Cyclone IV GX | β |
| Logic Elements | 109,424 | β |
| Embedded Memory (bits) | 5,621,760 | β |
| Maximum User I/O | 475 | β |
| Process Technology | 60 nm | β |
| Core Voltage (VCCINT) | 1.2 V nominal (1.16 V to 1.24 V) | β |
| PLL Analog Voltage (VCCA) | 2.5 V nominal (2.375 V to 2.625 V) | β |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | β |
| Transceivers | 8 channels, up to 3.125 Gbps | 8 (up to 3.125 Gbps) |
| Hard IP Block | PCIe Gen1 x1/x2/x4 | β |
| PLLs | 4 general-purpose | 4 |
| Package | 896-ball FBGA (F31) | 896-BGA (FBGA-896), 31 mm |
| Speed Grade | C7 (commercial) | -7 |
| Operating Temperature (Commercial) | 0 Β°C to 85 Β°C (TJ) | β |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Series | β | Cyclone IV GX |
| Device Logic Elements | β | 109,424 |
| Total Memory Bits | β | 5,621,760 |
| Number of Logic Array Blocks (LABs) | β | Not specified in provided data [DATA_NEEDED: LAB count] |
| Number of I/O | β | 475 user I/O |
| Multipliers (18x18) | β | 432 |
| M9K Memory Blocks | β | 270 |
| Ball Pitch | β | 0.8 mm |
| Temperature Grade | β | Industrial (-40C to +100C Tj) |
| Core Voltage | β | 1.2 V typical |
| Configuration Method | β | SRAM (EPCS or JTAG) |
| MSL Level | β | 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] |