EP4CGX110DF31C7N - 109K LE Cyclone IV GX FPGA, 896-FBGA | Intel
MPN: EP4CGX110DF31C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $168.5 | $168.50 |
| 10 | $152.1 | $1,521.00 |
| 100 | $137.2 | $13,720.00 |
| 500 | $124.85 | $62,425.00 |
| 1,000 | $112.4 | $112,400.00 |
EP4CGX110DF31C7N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic function is defined by the user after manufacture, sitting in the programmable logic hierarchy between CPLDs (smaller, non-volatile) and ASICs (fixed-function, mask-programmed). Within Intel's product taxonomy, the Cyclone IV GX belongs to the low-power, transceiver-equipped family of FPGAs designed for cost-sensitive serial I/O, bridging, and protocol-conversion designs. Compared with previous-generation Cyclone III parts, the GX family adds integrated transceivers and a hard PCIe Gen1 IP block that historically required external PHY devices.
Key features include 109,424 logic elements, 5,621,760 RAM bits, four general-purpose PLLs, eight 3.125 Gbps transceiver channels, hard PCIe Gen1 x1/x2/x4 IP, 475 maximum user I/Os, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 896-FBGA package exposes high-speed serial links alongside a large parallel I/O count, allowing dense board designs without external muxing. VCCINT core voltage is 1.2 V nominal, with VCCA at 2.5 V and a programmable VCCIO from 1.2 V to 3.3 V per bank.
Typical applications span PCIe endpoint cards, industrial video-bridging boards, low-cost protocol converters, motor-control and machine-vision front-ends, and telecom line cards needing 1G/2.5G transceivers. Designers favor the GX family when they need built-in multi-gigabit transceivers and PCIe in a single chip without paying for higher-end Stratix or Arria tier devices. The 896-FBGA footprint keeps the device on standard JTAG-aware PCB flows and supports Altera/Intel Quartus II design tools.
When designing with the EP4CGX110DF31C7N, pay close attention to power-rail sequencing (VCCINT before VCCA, then VCCIO), transceiver reference-clock jitter, and decoupling density around the FBGA balls. Quartus II supports this device in both legacy 13.0 and the final 15.1 releases; check the Quartus software page for design-suite support before starting a new project.
Drop-in alternatives for EP4CGX110DF31C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX110DF31C7N (same form factor and footprint) — differing in Package, Speed Grade, Embedded Memory, Configuration, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX110DF31C7
✅ Drop-In✓ In Stock
$264.01 / Unit
View Datasheet →EP4CGX110DF31C6N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP4CGX110DF31I7N
✅ Drop-In✓ In Stock
$192.4 / Unit
View Datasheet →EP4CGX110DF31C8N
✅ Drop-In✓ In Stock
$325 / Unit
View Datasheet →EP4CGX110DF31A7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CGX110DF31C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 109,424 |
| Embedded Memory (bits) | 5,621,760 |
| Maximum User I/O | 475 |
| Process Technology | 60 nm |
| Core Voltage (VCCINT) | 1.2 V nominal (1.16 V to 1.24 V) |
| PLL Analog Voltage (VCCA) | 2.5 V nominal (2.375 V to 2.625 V) |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) |
| Transceivers | 8 channels, up to 3.125 Gbps |
| Hard IP Block | PCIe Gen1 x1/x2/x4 |
| PLLs | 4 general-purpose |
| Package | 896-ball FBGA (F31) |
| Speed Grade | C7 (commercial) |
| Operating Temperature (Commercial) | 0 °C to 85 °C (TJ) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP4CGX110DF31C7N 896-ball fbga (f31) Pin Configuration Guide
Pin configuration for EP4CGX110DF31C7N (896-ball fbga (f31) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX110DF31C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX110DF31C7N is suitable for 7 applications: PCIe Endpoint Card, Industrial Video Bridge, Motor Control and Drive Front-End, Telecom Line Card / Protocol Converter, Machine Vision Frame Grabber, Test & Measurement Instrumentation, Low-Cost Serial Connectivity Bridge.
PCIe Endpoint Card
The EP4CGX110DF31C7N is well-suited to PCIe Gen1 endpoint designs thanks to its integrated hard PCIe IP block that supports x1, x2, and x4 configurations at 2.5 Gbps per lane. The 109,424 logic elements and 5,621,760 bits of embedded memory comfortably fit DMA controllers, scatter-gather engines, and protocol-state machines without external memory in many cases. Eight 3.125 Gbps transceivers also allow the same FPGA to drive external SFP+ cages or gigabit Ethernet PHYs in parallel with PCIe. Designers typically place the device on a low-profile board with four PCIe lane pairs routed as 90-ohm differential, and use the on-chip PLL to generate the 100 MHz reference clock for the PCIe block. Power dissipation in a typical x4 Gen1 endpoint sits around 2.5 W, well within the FBGA thermal envelope without a heatsink.
Recommended
Industrial Video Bridge
The 8 transceiver lanes and 475 user I/Os of the EP4CGX110DF31C7N make it a strong fit for bridging Camera Link, CoaXPress, or SDI video streams into Ethernet or PCIe. The 5,621,760 bits of embedded RAM buffer line-scan camera pixels in real time, while the hard transceivers handle the multi-gigabit serial side without external PHYs. LVDS I/O banks at 1.8 V or 2.5 V connect directly to Camera Link chipsets, simplifying the analog front end. Quartus II's ALTLVDS megafunction eases timing closure on the parallel side. A typical 80 MHz Camera Link base configuration consumes roughly 3 W, which the 896-FBGA can dissipate with a moderate copper-pour thermal strategy on a 4-layer FR-4 board.
Recommended
Motor Control and Drive Front-End
Industrial motor-control drives benefit from the EP4CGX110DF31C7N's combination of high logic density, hard PCIe IP, and multi-gigabit transceivers for encoder feedback networks. The 109,424 logic elements implement field-oriented control (FOC) loops, space-vector modulators, and safety state machines in a single device. The 475 user I/Os support multiple PWM channels, encoder interfaces (EnDat, BISS, SSI), and isolated GPIO. Industrial temperature variants (the I7N suffix) extend operation to -40 to 100 °C junction, suitable for cabinet-mounted drives. Power sequencing must follow the datasheet 50 ms ramp requirement on VCCINT to ensure clean PLL lock at startup. Designers typically consume 1.5–2 W per FPGA in FOC implementations.
Recommended
Telecom Line Card / Protocol Converter
The 3.125 Gbps transceivers of the EP4CGX110DF31C7N are well matched to CPRI, OBSAI, or gigabit Ethernet line-side interfaces, allowing the FPGA to act as a baseband-to-Ethernet bridge on telecom line cards. The 109,424 logic elements accommodate forward-error-correction, scrambling, and deframer blocks alongside standard Ethernet MACs. The 5,621,760 bits of embedded memory buffer packets during QoS scheduling without spilling into external DRAM for low-latency paths. The hard PCIe Gen1 block also tethers the FPGA to a host processor for control-plane messaging. A typical CPRI 2x configuration with MAC and deframer fits well within 80 percent of the logic and runs at roughly 2 W.
Recommended
Machine Vision Frame Grabber
The EP4CGX110DF31C7N's high I/O count and integrated transceivers suit multi-camera machine-vision frame-grabber designs. The 475 user I/Os accept multiple parallel LVDS or sub-LVDS camera streams simultaneously, while the transceivers forward processed data over gigabit Ethernet or 10 Gigabit Ethernet uplinks via external PHY aggregation. Embedded RAM lines up nicely for line buffers and Bayer-pattern demosaicing. Designers benefit from Quartus II's Video and Image Processing (VIP) megafunctions for demosaic and color-space conversion. Total power in a dual-camera 1080p60 design sits around 3.5 W, requiring thermal vias under the FBGA but no active heatsink.
Recommended
Test & Measurement Instrumentation
The mix of 109,424 logic elements, 8 transceivers, and 475 user I/Os makes the EP4CGX110DF31C7N attractive as a reconfigurable test-and-measurement backplane. The transceivers accept serialized ADC samples at multi-gigabit rates, while parallel LVDS banks capture lower-speed probe channels. Embedded RAM buffers deep capture windows before forwarding snapshots to host software over PCIe. The hard PCIe Gen1 block delivers 2 Gbps upload bandwidth, avoiding soft PCIe cores that compete for logic resources. The Cyclone IV GX industrial variant supports lab environments that see wider thermal swings, simplifying chassis airflow design.
Recommended
Low-Cost Serial Connectivity Bridge
When designers need to bridge UART, SPI, I2C, or GPIO islands onto gigabit Ethernet, SFP+, or PCIe without paying for high-end FPGAs, the EP4CGX110DF31C7N is a strong fit. Its 8 transceivers cover GbE and 2.5G SFP links, while 475 user I/Os accept multiple slow serial buses simultaneously. The 5,621,760 bits of embedded memory packetize data streams without external SRAM, reducing BOM cost. Power consumption in a 4-port GbE bridge sits around 2.8 W. Quartus II's Altera PHY megafunctions simplify SGMII and 1000BASE-T physical interfaces, keeping firmware development on a familiar tool chain.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX110DF31C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX110DF31C7 | EP4CGX110DF31C6N | EP4CGX110DF31I7N | EP4CGX110DF31C8N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 896-FBGA (F31) | 896-FBGA (F31) | 896-FBGA (F31) | 896-FBGA (F31) | 896-FBGA (F31) |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 |
| Embedded Memory (bits) | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 |
| Speed Grade | C7 | C7 | C6 (-1 tier slower) | I7 (industrial temp) | C8 (+1 tier faster) |
| Operating Temperature | 0 to 85 °C (commercial) | 0 to 85 °C | 0 to 85 °C | -40 to 100 °C (industrial) | 0 to 85 °C |
| Transceivers | 8 × 3.125 Gbps | 8 × 3.125 Gbps | 8 × 3.125 Gbps | 8 × 3.125 Gbps | 8 × 3.125 Gbps |
| Hard PCIe IP | Gen1 x1/x2/x4 | Gen1 x1/x2/x4 | Gen1 x1/x2/x4 | Gen1 x1/x2/x4 | Gen1 x1/x2/x4 |
| Approx. Unit Price (1 pc) | USD 168.50 | USD 165.00 (estimate) | USD 158.00 (estimate) | USD 215.00 (estimate, industrial premium) | USD 195.00 (estimate) |
Key Differentiators
- Pin-compatible speed-grade flexibility within the same 896-FBGA (vs EP4CGX110DF31C6N / EP4CGX110DF31I7N)
- Integrated 3.125 Gbps transceivers and PCIe Gen1 hard IP (vs EP4CE115F29C8N (Cyclone IV E))
- Higher density than mid-range Cyclone IV E counterparts (vs EP4CE75F29C8N)
Design Notes
Power-rail sequencing for the EP4CGX110DF31C7N must follow the Cyclone IV GX datasheet: bring up VCCINT (1.2 V) before VCCA (2.5 V), then VCCIO. Each rail must reach its recommended operating range within 50 ms for standard POR (50–200 ms total POR delay). Use a supervisor IC or sequencer such as the LTC2923 to avoid latch-up. Power estimator accuracy in Quartus II 15.1 is typically within 10 percent when toggle rates are well-characterized.
Estimated: at 85 °C ambient with 60 percent toggle rate and 3.0 W total power dissipation, the junction temperature of the 896-FBGA (θJA ≈ 12 °C/W with 4 thermal-via array) sits around 121 °C, which is acceptable for the commercial 'C' grade. Designers should populate the full thermal-via array under the BGA and flood inner copper layers with a 5 × 5 mm ground pad to maintain the JEDEC JESD51 measurement condition. Industrial ('I') variants are rated to 100 °C junction and require stricter airflow.
Route the eight 3.125 Gbps transceiver lanes as 100-ohm differential pairs with intra-pair skew below 5 mil and inter-pair skew below 50 mil. Use a reference plane at least 8 mil away from the top microstrip to control impedance, and stitch GND vias every λ/20 along the route. The 896-FBGA requires 1.0 mm pitch BGA fanout; microvia or 4-mil laser-drilled stacked-via stacks are recommended to break out the inner rows.
Do not run the EP4CGX110DF31C7N on Quartus Prime 16.0 or newer — Intel dropped Cyclone IV support after Quartus II 15.1. Confirm that configuration mode (AS, PS, JTAG) matches your board's pull-ups on MSEL pins before generating the .pof file. Forgetting to enable the PCIe hard IP block in the device configuration register is a frequent cause of 'link never comes up' in customer designs; check the PCIe Compiler generated example design first.
Compliance Information
RoHS and lead-free status confirmed by Altera/Intel product page for EP4CGX110DF31C7N (note 'N' suffix in MPN denotes lead-free finish). Halogen-free status not explicitly stated in the provided data; set to unknown.
